KR20240100438A - 와이어 본딩 시스템에 대한 초음파 특성을 캘리브레이션하는 방법 - Google Patents

와이어 본딩 시스템에 대한 초음파 특성을 캘리브레이션하는 방법 Download PDF

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Publication number
KR20240100438A
KR20240100438A KR1020247019763A KR20247019763A KR20240100438A KR 20240100438 A KR20240100438 A KR 20240100438A KR 1020247019763 A KR1020247019763 A KR 1020247019763A KR 20247019763 A KR20247019763 A KR 20247019763A KR 20240100438 A KR20240100438 A KR 20240100438A
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KR
South Korea
Prior art keywords
ultrasonic
wire
unacceptable
wire bonding
stick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247019763A
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English (en)
Korean (ko)
Inventor
존 더블유. 브루너
웨이 친
아쉬시 샤
후이 수
양정호
Original Assignee
쿨리케 앤드 소파 인더스트리즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 filed Critical 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드
Publication of KR20240100438A publication Critical patent/KR20240100438A/ko
Pending legal-status Critical Current

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Classifications

    • H01L24/85—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H01L24/43—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H01L2224/437—
    • H01L2224/85205—
    • H01L2224/859—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07113—Means for calibration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Manufacturing & Machinery (AREA)
KR1020247019763A 2021-11-16 2022-11-15 와이어 본딩 시스템에 대한 초음파 특성을 캘리브레이션하는 방법 Pending KR20240100438A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163280107P 2021-11-16 2021-11-16
US63/280,107 2021-11-16
PCT/US2022/049991 WO2023091429A1 (en) 2021-11-16 2022-11-15 Methods of calibrating an ultrasonic characteristic on a wire bonding system

Publications (1)

Publication Number Publication Date
KR20240100438A true KR20240100438A (ko) 2024-07-01

Family

ID=86324089

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247019763A Pending KR20240100438A (ko) 2021-11-16 2022-11-15 와이어 본딩 시스템에 대한 초음파 특성을 캘리브레이션하는 방법

Country Status (6)

Country Link
US (2) US12113043B2 (https=)
JP (1) JP2024541349A (https=)
KR (1) KR20240100438A (https=)
CN (1) CN118266071A (https=)
TW (1) TW202333253A (https=)
WO (1) WO2023091429A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1343201A1 (de) * 2002-03-08 2003-09-10 F & K Delvotec Bondtechnik GmbH "Verfahren und Anordnung zur Herstellung und Qualitätsprüfung einer Drahtbondverbindung"
JP4679454B2 (ja) * 2006-07-13 2011-04-27 株式会社新川 ワイヤボンディング装置
WO2009002345A1 (en) 2007-06-28 2008-12-31 Kulicke And Soffa Industries, Inc. Method of determining a height profile of a wire loop on a wire bonding machine
JP2010056106A (ja) * 2008-08-26 2010-03-11 Nec Electronics Corp ワイヤボンディング装置、これを用いたワイヤボンディング方法
JP2011066191A (ja) * 2009-09-17 2011-03-31 Renesas Electronics Corp 半導体装置の製造方法およびボンディング装置
EP2833791B1 (en) * 2012-03-26 2022-12-21 Maui Imaging, Inc. Methods for improving ultrasound image quality by applying weighting factors
US9153554B2 (en) * 2012-04-22 2015-10-06 Kulicke And Soffa Industries, Inc. Methods of adjusting ultrasonic bonding energy on wire bonding machines
TWI534918B (zh) * 2012-06-29 2016-05-21 庫利克和索夫工業公司 用以補償打線機上線徑變化之方法和系統
KR101672510B1 (ko) * 2012-11-16 2016-11-03 가부시키가이샤 신가와 와이어 본딩 장치 및 와이어 본딩 방법
WO2014077026A1 (ja) * 2012-11-16 2014-05-22 株式会社新川 ワイヤボンディング装置及び半導体装置の製造方法
US9620477B2 (en) * 2013-01-25 2017-04-11 Asm Technology Singapore Pte Ltd Wire bonder and method of calibrating a wire bonder
EP3717170B1 (de) * 2017-11-29 2024-01-10 Telsonic Holding AG Ultraschallbearbeitungsvorrichtung, verfahren zur konfiguration einer ultraschallbearbeitungsvorrichtung, system mit solcher ultraschallbearbeitungsvorrichtung
CN112385026B (zh) * 2018-07-11 2024-06-11 株式会社新川 打线接合装置

Also Published As

Publication number Publication date
US12113043B2 (en) 2024-10-08
TW202333253A (zh) 2023-08-16
US20240404986A1 (en) 2024-12-05
JP2024541349A (ja) 2024-11-08
US20230154888A1 (en) 2023-05-18
WO2023091429A1 (en) 2023-05-25
CN118266071A (zh) 2024-06-28

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