TW202333253A - 在引線接合系統上校準超音波特性的方法 - Google Patents

在引線接合系統上校準超音波特性的方法 Download PDF

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Publication number
TW202333253A
TW202333253A TW111143785A TW111143785A TW202333253A TW 202333253 A TW202333253 A TW 202333253A TW 111143785 A TW111143785 A TW 111143785A TW 111143785 A TW111143785 A TW 111143785A TW 202333253 A TW202333253 A TW 202333253A
Authority
TW
Taiwan
Prior art keywords
wire bonding
ultrasonic
unacceptable
wire
characteristic
Prior art date
Application number
TW111143785A
Other languages
English (en)
Chinese (zh)
Inventor
喬恩 Ｗ 布魯諾
偉 秦
阿希什 沙
徐慧
梁正虎
Original Assignee
美商庫利克和索夫工業公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商庫利克和索夫工業公司 filed Critical 美商庫利克和索夫工業公司
Publication of TW202333253A publication Critical patent/TW202333253A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07113—Means for calibration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Manufacturing & Machinery (AREA)
TW111143785A 2021-11-16 2022-11-16 在引線接合系統上校準超音波特性的方法 TW202333253A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163280107P 2021-11-16 2021-11-16
US63/280,107 2021-11-16

Publications (1)

Publication Number Publication Date
TW202333253A true TW202333253A (zh) 2023-08-16

Family

ID=86324089

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111143785A TW202333253A (zh) 2021-11-16 2022-11-16 在引線接合系統上校準超音波特性的方法

Country Status (6)

Country Link
US (2) US12113043B2 (https=)
JP (1) JP2024541349A (https=)
KR (1) KR20240100438A (https=)
CN (1) CN118266071A (https=)
TW (1) TW202333253A (https=)
WO (1) WO2023091429A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1343201A1 (de) * 2002-03-08 2003-09-10 F & K Delvotec Bondtechnik GmbH "Verfahren und Anordnung zur Herstellung und Qualitätsprüfung einer Drahtbondverbindung"
JP4679454B2 (ja) * 2006-07-13 2011-04-27 株式会社新川 ワイヤボンディング装置
WO2009002345A1 (en) 2007-06-28 2008-12-31 Kulicke And Soffa Industries, Inc. Method of determining a height profile of a wire loop on a wire bonding machine
JP2010056106A (ja) * 2008-08-26 2010-03-11 Nec Electronics Corp ワイヤボンディング装置、これを用いたワイヤボンディング方法
JP2011066191A (ja) * 2009-09-17 2011-03-31 Renesas Electronics Corp 半導体装置の製造方法およびボンディング装置
EP2833791B1 (en) * 2012-03-26 2022-12-21 Maui Imaging, Inc. Methods for improving ultrasound image quality by applying weighting factors
US9153554B2 (en) * 2012-04-22 2015-10-06 Kulicke And Soffa Industries, Inc. Methods of adjusting ultrasonic bonding energy on wire bonding machines
TWI534918B (zh) * 2012-06-29 2016-05-21 庫利克和索夫工業公司 用以補償打線機上線徑變化之方法和系統
KR101672510B1 (ko) * 2012-11-16 2016-11-03 가부시키가이샤 신가와 와이어 본딩 장치 및 와이어 본딩 방법
WO2014077026A1 (ja) * 2012-11-16 2014-05-22 株式会社新川 ワイヤボンディング装置及び半導体装置の製造方法
US9620477B2 (en) * 2013-01-25 2017-04-11 Asm Technology Singapore Pte Ltd Wire bonder and method of calibrating a wire bonder
EP3717170B1 (de) * 2017-11-29 2024-01-10 Telsonic Holding AG Ultraschallbearbeitungsvorrichtung, verfahren zur konfiguration einer ultraschallbearbeitungsvorrichtung, system mit solcher ultraschallbearbeitungsvorrichtung
CN112385026B (zh) * 2018-07-11 2024-06-11 株式会社新川 打线接合装置

Also Published As

Publication number Publication date
US12113043B2 (en) 2024-10-08
KR20240100438A (ko) 2024-07-01
US20240404986A1 (en) 2024-12-05
JP2024541349A (ja) 2024-11-08
US20230154888A1 (en) 2023-05-18
WO2023091429A1 (en) 2023-05-25
CN118266071A (zh) 2024-06-28

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