Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/075—Connecting or disconnecting of bond wires
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
  • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/01—Manufacture or treatment
  • H10W72/015—Manufacture or treatment of bond wires
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/075—Connecting or disconnecting of bond wires
  • H10W72/07531—Techniques
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/075—Connecting or disconnecting of bond wires
  • H10W72/07531—Techniques
  • H10W72/07532—Compression bonding, e.g. thermocompression bonding
  • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/50—Bond wires
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/36—Electric or electronic devices
  • B23K2101/40—Semiconductor devices
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
  • H10W72/07113—Means for calibration
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
  • H10W72/07141—Means for applying energy, e.g. ovens or lasers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
  • H10W72/07183—Means for monitoring

Definitions

• the invention relates to wire bonding operations, and in particular, to methods of calibrating ultrasonic characteristics on a wire bonding system.
• wire bonding continues to be a widely used process for providing electrical interconnections within a semiconductor package.
• Various process parameters are utilized in connection with a wire bonding process. For example, ultrasonic energy (and associated process parameters) is often used to bond a wire to a workpiece.
• wire bonding processes may not be repeatable using the same parameters.
• one wire bonding system may be different from another wire bonding system.
• using the same process parameters (e.g., wire bonding parameters) on one wire bonding system may not result in the same performance (e.g., the same quality of wire bonds) on another wire bonding system.
• the same process parameters e.g., wire bonding parameters
• the performance e.g., the quality of wire bonds
• a method of calibrating an ultrasonic characteristic on a wire bonding system includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference nonstick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.
• a method of calibrating an ultrasonic characteristic on a wire bonding system includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference unacceptable ultrasonic characteristic that results in an unacceptable wire bond condition; (c) determining a calibration unacceptable ultrasonic characteristic, on a wire bonding system to be calibrated, that results in an unacceptable wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference unacceptable ultrasonic characteristic and the calibration unacceptable ultrasonic characteristic.
• FIGS. 1A-1D are a series of block diagram views illustrating testing of a wire bond at a reference ultrasonic characteristic in accordance with an exemplary embodiment of the invention
• FIGS. 2A-2D are a series of block diagram views illustrating testing of a wire bond at a modified ultrasonic characteristic in accordance with an exemplary embodiment of the invention
• FIGS. 3A-3D are a series of block diagram views illustrating testing of a wire bond at another modified ultrasonic characteristic in accordance with an exemplary embodiment of the invention.
• ultrasonic characteristic is intended to refer to any variable (e.g., a value of a variable, a percentage of a variable, etc.) intended to adjust ultrasonic output of an ultrasonic transducer on a wire bonding system (e.g., a wire bonding machine).
• a wire bonding system e.g., a wire bonding machine
• such characteristics may be electrical characteristics (e.g., current, voltage, power, etc.).
• an ultrasonic characteristic is an electrical current value (or electrical current percentage) configured to be applied to an ultrasonic transducer on a wire bonding system to form the wire bond.
• ultrasonic characteristics e.g., electrical current, electrical power, etc.
• a value e.g., a certain value of milliamperes or mA
• a percentage e.g., a percentage of a value, such as a percentage of a reference value
• Exemplary aspects of the invention relate to calibration methods for adjusting an ultrasonic characteristic on a wire bonding system, thereby providing portability of wire bonding systems (e.g., wire bonding machines). That is, features on the wire bonding systems provide for "on bonder" calibrations (e.g., real-time adjustments to one or more bonding parameters, such as ultrasonic characteristics) to overcome challenges related to machine portability (e.g., one machine being different from another machine, conditions changing on a given machine in production, etc.).
• on bonder e.g., real-time adjustments to one or more bonding parameters, such as ultrasonic characteristics
• reference response data is collected at multiple ultrasonic characteristics (e.g., multiple values and/or percentages of electrical current applied to an ultrasonic transducer) to generate a reference ultrasonic characteristic for formation of a wire bond (e.g., an electrical current level applied to the ultrasonic transducer that forms a desirable ball bond of a wire loop).
• This reference response data may be collected, for example, from one or more wire bonding systems, or from a single reference wire bonding system.
• the reference response data e.g., stored in memory
• the reference ultrasonic characteristic is generated.
• This reference ultrasonic characteristic is stored (e.g., on a computer included on a wire bonding system, on a computer external from but accessible by a wire bonding system, etc.) as a "golden" value (e.g., a setpoint value for the ultrasonic characteristic, such as an electrical current setpoint configured to be applied to an ultrasonic transducer on a wire bonding system to form the wire bond).
• a "golden" value e.g., a setpoint value for the ultrasonic characteristic, such as an electrical current setpoint configured to be applied to an ultrasonic transducer on a wire bonding system to form the wire bond.
• the reference ultrasonic characteristic may be stored in a bond program for a specific application. After the reference ultrasonic characteristic is determined, a reference unacceptable ultrasonic characteristic and a calibration unacceptable ultrasonic characteristic may be determined.
• a reference unacceptable ultrasonic characteristic is determined, where the reference unacceptable ultrasonic characteristic results in an unacceptable wire bond condition (e.g., a non-stick wire bond condition, a low shear strength wire bond condition, a low pull strength wire bond condition, and an unacceptable level of wire bond deformation).
• an applied ultrasonic characteristic e.g., starting with the reference ultrasonic characteristic or some other value
• wire bonding operations may be incrementally adjusted (e.g., reduced, increased, both reduced and increased, etc.) until the unacceptable wire bond condition results, and then the reference unacceptable ultrasonic characteristic is determined when the unacceptable condition results.
• the incremental adjustments may be values and/or percentages of the ultrasonic characteristic (e.g., ultrasonic current levels).
• the reference unacceptable ultrasonic characteristic may be stored in the computer with the reference ultrasonic characteristic (e.g., as part of a bond program for a specific application, in a local computer of the wire bonding system, in a remote computer accessible by the wire bonding system, etc.).
• a calibration factor for the wire bonding system to be calibrated is determined using the reference unacceptable ultrasonic characteristic and the calibration unacceptable ultrasonic characteristic.
• the calibration factor may be determined by determining a difference between the reference unacceptable ultrasonic characteristic and the calibration unacceptable ultrasonic characteristic.
• a new setpoint may be calculated for the wire bonding system to be calibrated using the calibration factor.
• the calibration factor may be applied to the reference ultrasonic characteristic (e.g., as a multiplier).
• This setpoint may be considered the actual ultrasonic characteristic to be applied on the wire bonding system to be calibrated.
• the process of calibrating the ultrasonic characteristic on the wire bonding system to be calibrated may be repeated for a new wire bonding application and/or following a specific trigger. That is, the calibration may be done on a wire bonding system upon the occurrence of a trigger.
• Example triggers include: start-up of a wire bonding system (e.g., when a process program is first loaded on a machine); change of a wire spool on a wire bonding system; change of a wire bonding tool on a wire bonding system; at the request of an operator; upon the expiration of a predetermined time period; upon the expiration of a predetermined number of wire bonds on the wire bonding system; etc. [0023] When a given trigger occurs, the calibration is performed to determine the setpoint for that wire bonding system and/or for a specific application on that wire bonding system.
• a user has a specific wire bonding application.
• This application has specific requirements. For example, a specific wire, a specific wire bonding tool, a specific workpiece, a specific wire bonding program, a specific set of wire bonding parameters, etc.
• a desirable ultrasonic characteristic is determined (e.g., an electrical current value applied to a transducer, an electrical voltage value applied to a transducer, an electrical power value applied to a transducer, etc.).
• the desirable ultrasonic characteristic e.g., a reference ultrasonic characteristic, UCREF
• UCREF reference ultrasonic characteristic
• FIGS. 1A-1D, 2A-2D, and 3A-3D represent a series of tests where an applied ultrasonic characteristic is incrementally adjusted (e.g., reduced) until an unacceptable wire bond condition results.
• the applied ultrasonic characteristic may be an increment of the reference ultrasonic characteristic.
• the reference ultrasonic characteristic is 100 mA of electrical current.
• the reference ultrasonic characteristic may be applied to achieve a desirable wire bond.
• an increment of the reference ultrasonic characteristic has been applied, also resulting in an acceptable wire bond.
• FIGS. 1A-1D, 2A-2D, and 3A-3D represent a series of tests where an applied ultrasonic characteristic is incrementally adjusted (e.g., reduced) until an unacceptable wire bond condition results.
• the applied ultrasonic characteristic may be an increment of the reference ultrasonic characteristic.
• the reference ultrasonic characteristic is 100 mA of electrical current.
• the reference ultrasonic characteristic may be applied to achieve a desirable wire bond.
• an increment of the reference ultrasonic characteristic has been applied
• the process of incrementally adjusting an applied ultrasonic characteristic may be used to determine (i) a reference non-stick ultrasonic characteristic, and/or (ii) a calibration unacceptable ultrasonic characteristic.
• the reference non-stick ultrasonic characteristic may be determined on a reference wire bonding system (or a plurality of wire bonding systems). Such a reference wire bonding system is represented on FIGS. 1A-1D, FIGS. 2A-2D, and FIGS. 3A-3D as reference wire bonding system 100.
• the calibration unacceptable ultrasonic characteristic is determined on a wire bonding system to be calibrated (sometimes referred to herein as an "actual”, “given” or “subject” wire bonding system).
• a wire bonding system to be calibrated is represented on FIGS. 1A-1D, FIGS. 2A-2D, and FIGS. 3A-3D as reference wire bonding system 100'.
• FIGS. 1A-1D show bonding of a free air ball using the reference ultrasonic characteristic (e.g., setpoint of 100 mA).
• FIG. 1A illustrates reference wire bonding system 100, which includes a support structure 102 and a bond head assembly 110.
• Support structure 102 supports a workpiece 104, which includes a die 104a that is attached to a substrate 104b.
• Die 104a includes a first bond location 104al.
• Bond head assembly 110 includes a transducer 110a that, in turn, carries a wire bonding tool 108.
• Wire bonding tool 108 includes a working end 108a.
• a wire 106 is threaded through wire bonding tool 108, and includes free air ball 106a at working end 108a.
• Transducer 110a is electrically connected to a computer 112 that is configured to store data and control the motion (and operation) of transducer 110a.
• Computer 112 is electrically connected to detection system 114, which can detect whether bonded portions of wire are properly attached to their respective bonding locations (e.g., bond pads, leads, contacts, traces, etc.).
• detection system 114 can detect whether bonded portions of wire are properly attached to their respective bonding locations (e.g., bond pads, leads, contacts, traces, etc.).
• wire bonding machines marketed by Kulicke and Soffa Industries, Inc. often utilize a "BITS" process (i.e. , Bond Integrity Test System) in connection with such a detection system to confirm that proper wire bonds have been formed. Exemplary details of such processes are disclosed in International Patent Application Publication WO 2009/002345, which is incorporated by reference herein in its entirety.
• Detection system 114 may detect if a bonded portion of a wire is properly attached to a bonding location via an electric continuity check. However, it is understood that other types of detection systems may be utilized (e.g., optical inspection systems for detection if a portion of
• Detection system 114 is used to ensure bonded ball 106a' is properly bonded to the first bond location 104al (e.g., to determine if a non-stick wire bond condition exists, to determine if a low shear strength wire bond condition exists, to determine if a low pull strength wire bond condition exists, and/or to determine if an unacceptable level of wire bond deformation exists, etc.).
• a desirable ball bond is formed in FIG. ID, having used the reference ultrasonic characteristic.
• FIGS. 2A-2D and FIGS. 3A-3D represent repeating the bonding process at a plurality of adjusted levels (e.g., increments) of the reference ultrasonic characteristic (e.g., incremental decreases of 1%, incremental decreases of 5%, incremental increases of 1%, incremental increases of 5%, etc.). That is, the ultrasonic characteristic is iteratively adjusted (e.g., reduced by a predetermined value and/or percentage, increased by a predetermined value and/or percentage) until an unacceptable wire bonding condition is formed. In the example shown in FIGS. 2A-2D, at one adjusted level of the reference ultrasonic characteristic, an acceptable ball bond is formed in FIG. 2D.
• adjusted levels e.g., increments
• the ultrasonic characteristic is iteratively adjusted (e.g., reduced by a predetermined value and/or percentage, increased by a predetermined value and/or percentage) until an unacceptable wire bonding condition is formed.
• an acceptable ball bond is formed in FIG. 2D.
• the calibration unacceptable ultrasonic characteristic may be expressed as a value of the ultrasonic characteristic (e.g., 75 mA).
• the calibration unacceptable ultrasonic characteristic may be expressed in other ways.
• the calibration unacceptable ultrasonic characteristic may be expressed as a percentage of the reference ultrasonic characteristic (i.e., 0.75*UCREF) .
• these processes may be repeated for a number of cycles to determine an accurate reference unacceptable ultrasonic characteristic and/or an accurate calibration unacceptable ultrasonic characteristic. That is, it may be that a certain percentage of unacceptable wire bond conditions occur in a calibration before declaring a reference unacceptable ultrasonic characteristic and/or a calibration unacceptable ultrasonic characteristic (e.g., a certain percentage of unacceptable wire bond conditions occur at a given adjusted ultrasonic characteristic).
• a calibration factor is determined. Such a calibration factor may be used to determine the ultrasonic characteristic setpoint for the wire bonding system to be calibrated.
• the calibration factor may be considered the difference between the reference unacceptable ultrasonic characteristic and the calibration unacceptable ultrasonic characteristic.
• the calibration factor may be provided in terms of a percentage. In the example above, the reference unacceptable ultrasonic characteristic may be considered to be 0.8*UCREF, and the calibration unacceptable ultrasonic characteristic may be considered to be 0.75*UCREF. In such an example, the calibration factor may be 5% (0.05*UCREF) .
• the calibration factor may be used.
• the reference ultrasonic characteristic is 100 mA of electrical current.
• the ultrasonic characteristic setpoint for the wire bonding system to be calibrated may be determined by reducing the reference ultrasonic characteristic by 5%.
• the ultrasonic characteristic setpoint may be considered to be 95 mA.
• FIGS. 4-5 are flow diagrams illustrating methods of calibrating an ultrasonic characteristic on a wire bonding system. As is understood by those skilled in the art, certain steps included in the flow diagrams may be omitted; certain additional steps may be added; and the order of the steps may be altered from the order illustrated - all within the scope of the invention.
• Step 400 a reference ultrasonic characteristic (e.g., an electrical current value configured to be applied to an ultrasonic transducer on the wire bonding system) for formation of a wire bond is determined.
• Step 400 may include determining the reference ultrasonic characteristic on a reference wire bonding system (or a plurality of reference wire bonding systems) using application specific materials. Examples of application specific materials include at least one of: (i) a wire; (ii) a wire bonding tool; and (iii) a workpiece.
• Step 400 may include determining the reference ultrasonic characteristic on a reference wire bonding system(s) using an application specific wire bonding program.
• Step 400 may include determining the reference ultrasonic characteristic on a reference wire bonding system(s) using application specific wire bonding parameters.
• Step 402 a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition is determined (e.g., on a reference wire bonding system).
• Step 402 may include determining the reference non-stick ultrasonic characteristic by incrementally adjusting (e.g., reducing) an applied ultrasonic characteristic in wire bonding operations until the non-stick wire bond condition results.
• the reference non-stick ultrasonic characteristic may be considered the applied ultrasonic characteristic resulting in the non-stick wire bond condition.
• the non-stick wire bond condition may occur with respect to Step 402 when a predetermined percentage of wire bonds tested at the applied ultrasonic characteristic do not stick to their respective bonding location.
• FIG. 3A-3D illustrate incremental adjustments that result in an acceptable wire bond (FIG. 2D) and non-stick wire bond (FIG. 3D).
• the reference non-stick ultrasonic characteristic may be determined, for example, using the value (or percentage) of the reference ultrasonic characteristic corresponding to FIG. 3D (where the non-stick wire bond occurs).
• Step 404 a calibration non-stick ultrasonic characteristic is determined on a wire bonding system to be calibrated.
• the calibration non-stick ultrasonic characteristic results in a non-stick wire bond condition.
• Step 404 may include determining the calibration non-stick ultrasonic characteristic by incrementally adjusting an applied ultrasonic characteristic in wire bonding operations until the non-stick wire bond condition results.
• the calibration non-stick ultrasonic characteristic may be considered the applied ultrasonic characteristic resulting in the non-stick wire bond condition.
• the non-stick wire bond condition may occur with respect to Step 404 when a predetermined percentage of wire bonds tested at the applied ultrasonic characteristic do not stick to their respective bonding location. As stated above, FIGS. 2A-2D and FIGS.
• FIG. 3A-3D illustrate incremental adjustments that result in an acceptable wire bond (FIG. 2D) and a non-stick wire bond (FIG. 3D).
• the calibration non-stick ultrasonic characteristic may be determined, for example, using the value (or percentage) of the reference ultrasonic characteristic corresponding to FIG. 3D (where the non-stick wire bond occurs).
• Step 406 a calibration factor for the wire bonding system to be calibrated is determined using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.
• Step 406 may include determining a difference between the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.
• Step 500 a reference ultrasonic characteristic (e.g., an electrical current value configured to be applied to an ultrasonic transducer on the wire bonding system) for formation of a wire bond is determined.
• Step 500 may include determining the reference ultrasonic characteristic on a reference wire bonding system (or a plurality of reference wire bonding systems) using application specific materials. Examples of application specific materials include at least one of: (i) a wire, (ii) a wire bonding tool; and (iii) a workpiece.
• Step 500 may include determining the reference ultrasonic characteristic on a reference wire bonding system(s) using an application specific wire bonding program.
• Step 500 may include determining the reference ultrasonic characteristic on a reference wire bonding system(s) using application specific wire bonding parameters.
• a reference unacceptable ultrasonic characteristic that results in an unacceptable wire bond condition is determined (e.g., on a reference wire bonding system).
• an unacceptable wire bond condition include one or more of: (i) a non-stick wire bond condition; (ii) a low shear strength wire bond condition; (iii) a low pull strength wire bond condition; and (iv) an unacceptable level of wire bond deformation.
• Step 502 may include determining the reference unacceptable ultrasonic characteristic by incrementally adjusting (e.g., reducing) an applied ultrasonic characteristic in wire bonding operations until the unacceptable wire bond condition results.
• the reference non-stick ultrasonic characteristic may be considered the applied ultrasonic characteristic resulting in the unacceptable wire bond condition.
• the unacceptable wire bond condition may occur with respect to Step 502 when a predetermined percentage of wire bonds tested at the applied ultrasonic characteristic are unacceptable according to predetermined criteria.
• FIGS. 2A-2D and FIGS. 3A-3D illustrate incremental adjustments that result in an acceptable wire bond (FIG. 2D) and an unacceptable wire bond (FIG. 3D).
• the reference unacceptable ultrasonic characteristic may be determined, for example, using the value (or percentage) of the reference ultrasonic characteristic corresponding to FIG. 3D (where the unacceptable wire bond occurs).
• Step 504 a calibration unacceptable ultrasonic characteristic is determined on a wire bonding system to be calibrated.
• the calibration unacceptable ultrasonic characteristic results in an unacceptable wire bond condition.
• Step 504 may include determining the calibration unacceptable ultrasonic characteristic by incrementally adjusting (e.g., reducing, increasing, reducing and increasing, etc.) an applied ultrasonic characteristic in wire bonding operations until the unacceptable wire bond condition results.
• the calibration unacceptable ultrasonic characteristic may be considered the applied ultrasonic characteristic resulting in the unacceptable wire bond condition.
• the unacceptable wire bond condition may occur with respect to Step 504 when a predetermined percentage of wire bonds tested at the applied ultrasonic characteristic are unacceptable according to predetermined criteria. As stated above, FIGS. 2A-2D and FIGS.
• FIG. 3A-3D illustrate incremental adjustments that result in an acceptable wire bond (FIG. 2D) and an unacceptable wire bond (FIG. 3D).
• the calibration unacceptable ultrasonic characteristic may be determined, for example, using the value (or percentage) of the reference ultrasonic characteristic corresponding to FIG. 3D (where the unacceptable wire bond occurs).
• Step 506 a calibration factor for the wire bonding system to be calibrated is determined using the reference unacceptable ultrasonic characteristic and the calibration unacceptable ultrasonic characteristic.
• Step 506 may include determining a difference between the reference unacceptable ultrasonic characteristic and the calibration unacceptable ultrasonic characteristic.
• the calibrations described herein address machine to machine portability issues and material variations (e.g., variations in wire, wire bonding tools, workholders, workpieces, etc.) - without using off bonder metrology. These new calibrations may be used to take into account the specific wire bonding tool (e.g., capillary), wire, workholder, and workpiece (e.g., die, substrate, etc.) used in a wire bonding application.
• specific wire bonding tool e.g., capillary
• wire, workholder, and workpiece e.g., die, substrate, etc.
• first bonds of a wire loop e.g., ball bonds
• teachings of the invention may be applied to any bonded portion of wire, including a second bond of a wire loop, a stitch bond, a bonded ball, a bump, a ball bond of a vertical wire, etc.

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• 2022
  • 2022-11-15 KR KR1020247019763A patent/KR20240100438A/ko active Pending
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