JP2024541349A5 - - Google Patents
Info
- Publication number
- JP2024541349A5 JP2024541349A5 JP2024527725A JP2024527725A JP2024541349A5 JP 2024541349 A5 JP2024541349 A5 JP 2024541349A5 JP 2024527725 A JP2024527725 A JP 2024527725A JP 2024527725 A JP2024527725 A JP 2024527725A JP 2024541349 A5 JP2024541349 A5 JP 2024541349A5
- Authority
- JP
- Japan
- Prior art keywords
- patent document
- application publication
- document
- patent application
- prior
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163280107P | 2021-11-16 | 2021-11-16 | |
| US63/280,107 | 2021-11-16 | ||
| PCT/US2022/049991 WO2023091429A1 (en) | 2021-11-16 | 2022-11-15 | Methods of calibrating an ultrasonic characteristic on a wire bonding system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024541349A JP2024541349A (ja) | 2024-11-08 |
| JP2024541349A5 true JP2024541349A5 (https=) | 2025-11-17 |
Family
ID=86324089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024527725A Pending JP2024541349A (ja) | 2021-11-16 | 2022-11-15 | ワイヤーボンディングシステム上の超音波特性を較正する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US12113043B2 (https=) |
| JP (1) | JP2024541349A (https=) |
| KR (1) | KR20240100438A (https=) |
| CN (1) | CN118266071A (https=) |
| TW (1) | TW202333253A (https=) |
| WO (1) | WO2023091429A1 (https=) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1343201A1 (de) | 2002-03-08 | 2003-09-10 | F & K Delvotec Bondtechnik GmbH | "Verfahren und Anordnung zur Herstellung und Qualitätsprüfung einer Drahtbondverbindung" |
| JP4679454B2 (ja) * | 2006-07-13 | 2011-04-27 | 株式会社新川 | ワイヤボンディング装置 |
| WO2009002345A1 (en) | 2007-06-28 | 2008-12-31 | Kulicke And Soffa Industries, Inc. | Method of determining a height profile of a wire loop on a wire bonding machine |
| JP2010056106A (ja) * | 2008-08-26 | 2010-03-11 | Nec Electronics Corp | ワイヤボンディング装置、これを用いたワイヤボンディング方法 |
| JP2011066191A (ja) * | 2009-09-17 | 2011-03-31 | Renesas Electronics Corp | 半導体装置の製造方法およびボンディング装置 |
| EP2833791B1 (en) * | 2012-03-26 | 2022-12-21 | Maui Imaging, Inc. | Methods for improving ultrasound image quality by applying weighting factors |
| US9153554B2 (en) * | 2012-04-22 | 2015-10-06 | Kulicke And Soffa Industries, Inc. | Methods of adjusting ultrasonic bonding energy on wire bonding machines |
| TWI534918B (zh) | 2012-06-29 | 2016-05-21 | 庫利克和索夫工業公司 | 用以補償打線機上線徑變化之方法和系統 |
| SG11201503764YA (en) * | 2012-11-16 | 2015-06-29 | Shinkawa Kk | Wire-bonding apparatus and method of wire bonding |
| KR101598999B1 (ko) * | 2012-11-16 | 2016-03-02 | 가부시키가이샤 신가와 | 와이어 본딩 장치 및 반도체 장치의 제조 방법 |
| TWI587416B (zh) * | 2013-01-25 | 2017-06-11 | 先進科技新加坡有限公司 | 導線鍵合機和校準導線鍵合機的方法 |
| CN111386170A (zh) * | 2017-11-29 | 2020-07-07 | 远程声波控股公司 | 超声加工设备、超声加工设备的配置方法及具有这种超声加工设备的系统 |
| JP7008370B2 (ja) | 2018-07-11 | 2022-02-14 | 株式会社新川 | ワイヤボンディング装置 |
-
2022
- 2022-11-15 WO PCT/US2022/049991 patent/WO2023091429A1/en not_active Ceased
- 2022-11-15 US US17/987,708 patent/US12113043B2/en active Active
- 2022-11-15 KR KR1020247019763A patent/KR20240100438A/ko active Pending
- 2022-11-15 JP JP2024527725A patent/JP2024541349A/ja active Pending
- 2022-11-15 CN CN202280076368.9A patent/CN118266071A/zh active Pending
- 2022-11-16 TW TW111143785A patent/TW202333253A/zh unknown
-
2024
- 2024-08-13 US US18/802,075 patent/US20240404986A1/en active Pending
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