JP2024530709A - シリカ粒子を製造するための方法、かかる方法によって製造されるシリカ粒子、かかるシリカ粒子の組成物および使用 - Google Patents
シリカ粒子を製造するための方法、かかる方法によって製造されるシリカ粒子、かかるシリカ粒子の組成物および使用 Download PDFInfo
- Publication number
- JP2024530709A JP2024530709A JP2024510300A JP2024510300A JP2024530709A JP 2024530709 A JP2024530709 A JP 2024530709A JP 2024510300 A JP2024510300 A JP 2024510300A JP 2024510300 A JP2024510300 A JP 2024510300A JP 2024530709 A JP2024530709 A JP 2024530709A
- Authority
- JP
- Japan
- Prior art keywords
- silica particles
- gel
- group
- sicl
- occurrence
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/141—Preparation of hydrosols or aqueous dispersions
- C01B33/142—Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates
- C01B33/143—Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates of aqueous solutions of silicates
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/157—After-treatment of gels
- C01B33/158—Purification; Drying; Dehydrating
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/141—Preparation of hydrosols or aqueous dispersions
- C01B33/1415—Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/141—Preparation of hydrosols or aqueous dispersions
- C01B33/142—Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates
- C01B33/143—Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates of aqueous solutions of silicates
- C01B33/1435—Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates of aqueous solutions of silicates using ion exchangers
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/152—Preparation of hydrogels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
- C01B33/187—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates
- C01B33/193—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates of aqueous solutions of silicates
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Silicon Compounds (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP21306129 | 2021-08-19 | ||
| EP21306129.4 | 2021-08-19 | ||
| PCT/EP2022/072412 WO2023020906A1 (en) | 2021-08-19 | 2022-08-10 | Method for producing silica particles, silica particles produced by such method, compositions and uses of such silica particles |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024530709A true JP2024530709A (ja) | 2024-08-23 |
| JP2024530709A5 JP2024530709A5 (https=) | 2025-08-19 |
Family
ID=77666442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024510300A Pending JP2024530709A (ja) | 2021-08-19 | 2022-08-10 | シリカ粒子を製造するための方法、かかる方法によって製造されるシリカ粒子、かかるシリカ粒子の組成物および使用 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20240351889A1 (https=) |
| EP (1) | EP4387930A1 (https=) |
| JP (1) | JP2024530709A (https=) |
| KR (1) | KR20240049316A (https=) |
| CN (1) | CN117813258A (https=) |
| TW (1) | TW202317718A (https=) |
| WO (1) | WO2023020906A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200604097A (en) | 2004-07-26 | 2006-02-01 | Fuso Chemical Co Ltd | Silica sol and manufacturing method therefor |
| WO2007038321A2 (en) | 2005-09-26 | 2007-04-05 | Planar Solutions, Llc | Ultrapure colloidal silica for use in chemical mechanical polishing applications |
| TW200817497A (en) * | 2006-08-14 | 2008-04-16 | Nippon Chemical Ind | Polishing composition for semiconductor wafer, production method thereof, and polishing method |
| CN107662924A (zh) * | 2016-07-29 | 2018-02-06 | 新特能源股份有限公司 | 制备二氧化硅气凝胶的方法及系统 |
-
2022
- 2022-08-10 US US18/684,228 patent/US20240351889A1/en active Pending
- 2022-08-10 WO PCT/EP2022/072412 patent/WO2023020906A1/en not_active Ceased
- 2022-08-10 JP JP2024510300A patent/JP2024530709A/ja active Pending
- 2022-08-10 CN CN202280056183.1A patent/CN117813258A/zh active Pending
- 2022-08-10 KR KR1020247008718A patent/KR20240049316A/ko active Pending
- 2022-08-10 EP EP22764402.8A patent/EP4387930A1/en active Pending
- 2022-08-19 TW TW111131280A patent/TW202317718A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP4387930A1 (en) | 2024-06-26 |
| TW202317718A (zh) | 2023-05-01 |
| CN117813258A (zh) | 2024-04-02 |
| WO2023020906A1 (en) | 2023-02-23 |
| KR20240049316A (ko) | 2024-04-16 |
| US20240351889A1 (en) | 2024-10-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250808 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250808 |