CN117813258A - 生产二氧化硅粒子的方法、通过所述方法生产的二氧化硅粒子、所述二氧化硅粒子的组合物和用途 - Google Patents

生产二氧化硅粒子的方法、通过所述方法生产的二氧化硅粒子、所述二氧化硅粒子的组合物和用途 Download PDF

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Publication number
CN117813258A
CN117813258A CN202280056183.1A CN202280056183A CN117813258A CN 117813258 A CN117813258 A CN 117813258A CN 202280056183 A CN202280056183 A CN 202280056183A CN 117813258 A CN117813258 A CN 117813258A
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CN
China
Prior art keywords
silica particles
sicl
gel
occurrence
chloride
Prior art date
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Pending
Application number
CN202280056183.1A
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English (en)
Chinese (zh)
Inventor
E·贾奎诺
L·哈努斯
G·格雷厄姆
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Merck Patent GmbH
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Merck Patent GmbH
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Publication date
Application filed by Merck Patent GmbH filed Critical Merck Patent GmbH
Publication of CN117813258A publication Critical patent/CN117813258A/zh
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/141Preparation of hydrosols or aqueous dispersions
    • C01B33/142Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates
    • C01B33/143Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates of aqueous solutions of silicates
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/157After-treatment of gels
    • C01B33/158Purification; Drying; Dehydrating
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/141Preparation of hydrosols or aqueous dispersions
    • C01B33/1415Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/141Preparation of hydrosols or aqueous dispersions
    • C01B33/142Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates
    • C01B33/143Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates of aqueous solutions of silicates
    • C01B33/1435Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates of aqueous solutions of silicates using ion exchangers
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/152Preparation of hydrogels
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1409Abrasive particles per se
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C01B33/187Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates
    • C01B33/193Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates of aqueous solutions of silicates
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/12Surface area
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/22Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/80Compositional purity

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Silicon Compounds (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN202280056183.1A 2021-08-19 2022-08-10 生产二氧化硅粒子的方法、通过所述方法生产的二氧化硅粒子、所述二氧化硅粒子的组合物和用途 Pending CN117813258A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP21306129 2021-08-19
EP21306129.4 2021-08-19
PCT/EP2022/072412 WO2023020906A1 (en) 2021-08-19 2022-08-10 Method for producing silica particles, silica particles produced by such method, compositions and uses of such silica particles

Publications (1)

Publication Number Publication Date
CN117813258A true CN117813258A (zh) 2024-04-02

Family

ID=77666442

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280056183.1A Pending CN117813258A (zh) 2021-08-19 2022-08-10 生产二氧化硅粒子的方法、通过所述方法生产的二氧化硅粒子、所述二氧化硅粒子的组合物和用途

Country Status (7)

Country Link
US (1) US20240351889A1 (https=)
EP (1) EP4387930A1 (https=)
JP (1) JP2024530709A (https=)
KR (1) KR20240049316A (https=)
CN (1) CN117813258A (https=)
TW (1) TW202317718A (https=)
WO (1) WO2023020906A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200604097A (en) 2004-07-26 2006-02-01 Fuso Chemical Co Ltd Silica sol and manufacturing method therefor
WO2007038321A2 (en) 2005-09-26 2007-04-05 Planar Solutions, Llc Ultrapure colloidal silica for use in chemical mechanical polishing applications
TW200817497A (en) * 2006-08-14 2008-04-16 Nippon Chemical Ind Polishing composition for semiconductor wafer, production method thereof, and polishing method
CN107662924A (zh) * 2016-07-29 2018-02-06 新特能源股份有限公司 制备二氧化硅气凝胶的方法及系统

Also Published As

Publication number Publication date
EP4387930A1 (en) 2024-06-26
TW202317718A (zh) 2023-05-01
WO2023020906A1 (en) 2023-02-23
KR20240049316A (ko) 2024-04-16
US20240351889A1 (en) 2024-10-24
JP2024530709A (ja) 2024-08-23

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