JP2024528673A5 - - Google Patents
Info
- Publication number
- JP2024528673A5 JP2024528673A5 JP2024503527A JP2024503527A JP2024528673A5 JP 2024528673 A5 JP2024528673 A5 JP 2024528673A5 JP 2024503527 A JP2024503527 A JP 2024503527A JP 2024503527 A JP2024503527 A JP 2024503527A JP 2024528673 A5 JP2024528673 A5 JP 2024528673A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- composition
- gpa
- dsc
- storage modulus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163224357P | 2021-07-21 | 2021-07-21 | |
| US63/224,357 | 2021-07-21 | ||
| PCT/US2022/037878 WO2023004041A2 (en) | 2021-07-21 | 2022-07-21 | Resin composition for non-conductive film with excellent high temperature properties for 3d tsv packages |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024528673A JP2024528673A (ja) | 2024-07-30 |
| JP2024528673A5 true JP2024528673A5 (https=) | 2025-07-29 |
Family
ID=84980608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024503527A Pending JP2024528673A (ja) | 2021-07-21 | 2022-07-21 | ３ｄ ｔｓｖパッケージ用の高温特性に優れた非導電性フィルム用の樹脂組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240174854A1 (https=) |
| JP (1) | JP2024528673A (https=) |
| KR (1) | KR20240037993A (https=) |
| CN (1) | CN118076677A (https=) |
| TW (1) | TW202317705A (https=) |
| WO (1) | WO2023004041A2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026055282A1 (en) * | 2024-09-05 | 2026-03-12 | Henkel Ag & Co. Kgaa | Non-conductive films for electronic devices and encapsulation applications |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008130894A1 (en) * | 2007-04-16 | 2008-10-30 | Designer Molecules, Inc. | Low temperature curing acrylate and maleimide based formulations and methods for use thereof |
| JP2009096851A (ja) * | 2007-10-15 | 2009-05-07 | Three M Innovative Properties Co | 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法 |
| JP5619466B2 (ja) * | 2010-04-13 | 2014-11-05 | デクセリアルズ株式会社 | 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、ダイボンド剤、非導電性ペースト、接着性エポキシ樹脂フィルム、非導電性エポキシ樹脂フィルム、異方性導電ペースト及び異方性導電フィルム |
| KR101753158B1 (ko) * | 2016-04-28 | 2017-08-09 | (주)이녹스첨단소재 | 비전도성 접착필름용 조성물 및 이를 포함하는 비전도성 접착필름 |
| KR102605475B1 (ko) * | 2016-06-24 | 2023-11-23 | (주)이녹스첨단소재 | 비전도성 접착필름용 조성물 및 이를 포함하는 비전도성 접착필름 |
-
2022
- 2022-07-20 TW TW111127183A patent/TW202317705A/zh unknown
- 2022-07-21 KR KR1020247004148A patent/KR20240037993A/ko active Pending
- 2022-07-21 WO PCT/US2022/037878 patent/WO2023004041A2/en not_active Ceased
- 2022-07-21 JP JP2024503527A patent/JP2024528673A/ja active Pending
- 2022-07-21 CN CN202280062996.1A patent/CN118076677A/zh active Pending
-
2024
- 2024-01-20 US US18/418,268 patent/US20240174854A1/en active Pending
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