JP2024526794A5 - - Google Patents

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Publication number
JP2024526794A5
JP2024526794A5 JP2024502186A JP2024502186A JP2024526794A5 JP 2024526794 A5 JP2024526794 A5 JP 2024526794A5 JP 2024502186 A JP2024502186 A JP 2024502186A JP 2024502186 A JP2024502186 A JP 2024502186A JP 2024526794 A5 JP2024526794 A5 JP 2024526794A5
Authority
JP
Japan
Prior art keywords
uniform
profile
semiconductor device
power semiconductor
channel region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024502186A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024526794A (ja
Filing date
Publication date
Priority claimed from EP21186101.8A external-priority patent/EP4120361A1/en
Application filed filed Critical
Publication of JP2024526794A publication Critical patent/JP2024526794A/ja
Publication of JP2024526794A5 publication Critical patent/JP2024526794A5/ja
Pending legal-status Critical Current

Links

JP2024502186A 2021-07-16 2022-07-13 パワー半導体デバイスおよび製造方法 Pending JP2024526794A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP21186101.8 2021-07-16
EP21186101.8A EP4120361A1 (en) 2021-07-16 2021-07-16 Power semiconductor device
PCT/EP2022/069636 WO2023285549A1 (en) 2021-07-16 2022-07-13 Power semiconductor device and production method

Publications (2)

Publication Number Publication Date
JP2024526794A JP2024526794A (ja) 2024-07-19
JP2024526794A5 true JP2024526794A5 (https=) 2025-07-16

Family

ID=76958805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024502186A Pending JP2024526794A (ja) 2021-07-16 2022-07-13 パワー半導体デバイスおよび製造方法

Country Status (5)

Country Link
EP (1) EP4120361A1 (https=)
JP (1) JP2024526794A (https=)
CN (1) CN117642872A (https=)
DE (1) DE212022000250U1 (https=)
WO (1) WO2023285549A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4073176B2 (ja) * 2001-04-02 2008-04-09 新電元工業株式会社 半導体装置およびその製造方法
US6653698B2 (en) 2001-12-20 2003-11-25 International Business Machines Corporation Integration of dual workfunction metal gate CMOS devices
US6794234B2 (en) 2002-01-30 2004-09-21 The Regents Of The University Of California Dual work function CMOS gate technology based on metal interdiffusion
WO2010001201A1 (en) * 2008-06-30 2010-01-07 Freescale Semiconductor, Inc. Method of forming a power semiconductor device and power semiconductor device
DE102011079747A1 (de) * 2010-07-27 2012-02-02 Denso Corporation Halbleitervorrichtung mit Schaltelement und Freilaufdiode, sowie Steuerverfahren hierfür
JP6048317B2 (ja) * 2013-06-05 2016-12-21 株式会社デンソー 炭化珪素半導体装置
KR20150090669A (ko) * 2014-01-29 2015-08-06 에스케이하이닉스 주식회사 듀얼일함수 매립게이트형 트랜지스터 및 그 제조 방법, 그를 구비한 전자장치
JP2016054181A (ja) * 2014-09-03 2016-04-14 トヨタ自動車株式会社 絶縁ゲート型スイッチング素子
US9583485B2 (en) 2015-05-15 2017-02-28 Taiwan Semiconductor Manufacturing Company, Ltd. Fin field effect transistor (FinFET) device structure with uneven gate structure and method for forming the same

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