JP2024521546A - ブリッジを通して結合された集積デバイスを含むパッケージ - Google Patents

ブリッジを通して結合された集積デバイスを含むパッケージ Download PDF

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JP2024521546A
JP2024521546A JP2023565402A JP2023565402A JP2024521546A JP 2024521546 A JP2024521546 A JP 2024521546A JP 2023565402 A JP2023565402 A JP 2023565402A JP 2023565402 A JP2023565402 A JP 2023565402A JP 2024521546 A JP2024521546 A JP 2024521546A
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interconnects
integrated device
metallization
bridge
coupled
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JP2024521546A5 (enExample
Inventor
ホン・ボク・ウィ
アニケット・パティル
ジジエ・ワン
マーカス・ス
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クアルコム,インコーポレイテッド
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    • HELECTRICITY
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    • H10W70/08Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
JP2023565402A 2021-05-24 2022-04-25 ブリッジを通して結合された集積デバイスを含むパッケージ Pending JP2024521546A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/328,666 US20220375838A1 (en) 2021-05-24 2021-05-24 Package comprising integrated devices coupled through a bridge
US17/328,666 2021-05-24
PCT/US2022/026200 WO2022250821A1 (en) 2021-05-24 2022-04-25 Package comprising integrated devices coupled through a bridge

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JP2024521546A true JP2024521546A (ja) 2024-06-03
JP2024521546A5 JP2024521546A5 (enExample) 2025-04-22

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US (1) US20220375838A1 (enExample)
EP (1) EP4348711A1 (enExample)
JP (1) JP2024521546A (enExample)
KR (1) KR20240013097A (enExample)
CN (1) CN117136436A (enExample)
BR (1) BR112023023632A2 (enExample)
WO (1) WO2022250821A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12355000B2 (en) 2020-11-10 2025-07-08 Qualcomm Incorporated Package comprising a substrate and a high-density interconnect integrated device
US12469811B2 (en) 2021-03-26 2025-11-11 Qualcomm Incorporated Package comprising wire bonds coupled to integrated devices
KR102914981B1 (ko) * 2021-06-14 2026-01-21 삼성전자주식회사 반도체 패키지
KR20230011659A (ko) * 2021-07-14 2023-01-25 삼성전자주식회사 반도체 패키지 및 그의 제조 방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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