JP2024508104A - レーザ温度制御方法及び機械加工装置 - Google Patents
レーザ温度制御方法及び機械加工装置 Download PDFInfo
- Publication number
- JP2024508104A JP2024508104A JP2023545737A JP2023545737A JP2024508104A JP 2024508104 A JP2024508104 A JP 2024508104A JP 2023545737 A JP2023545737 A JP 2023545737A JP 2023545737 A JP2023545737 A JP 2023545737A JP 2024508104 A JP2024508104 A JP 2024508104A
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- JP
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- Prior art keywords
- laser
- temperature
- refrigerant
- target operating
- operating temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000003754 machining Methods 0.000 title claims description 8
- 239000003507 refrigerant Substances 0.000 claims abstract description 33
- 238000001514 detection method Methods 0.000 claims description 18
- 239000002826 coolant Substances 0.000 claims description 10
- 238000012544 monitoring process Methods 0.000 claims description 10
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000009977 dual effect Effects 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 38
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 25
- 238000010586 diagram Methods 0.000 abstract description 6
- 230000004043 responsiveness Effects 0.000 abstract description 3
- 230000007246 mechanism Effects 0.000 description 13
- 238000000960 laser cooling Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0407—Liquid cooling, e.g. by water
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Control Of Temperature (AREA)
- Lasers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110556119.7A CN115377777A (zh) | 2021-05-20 | 2021-05-20 | 激光器控温方法和机加工设备 |
| CN202110556119.7 | 2021-05-20 | ||
| PCT/CN2022/093034 WO2022242591A1 (fr) | 2021-05-20 | 2022-05-16 | Procédé de commande de température de laser et dispositif d'usinage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2024508104A true JP2024508104A (ja) | 2024-02-22 |
Family
ID=84058681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023545737A Pending JP2024508104A (ja) | 2021-05-20 | 2022-05-16 | レーザ温度制御方法及び機械加工装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2024508104A (fr) |
| CN (1) | CN115377777A (fr) |
| WO (1) | WO2022242591A1 (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116225098A (zh) * | 2023-02-28 | 2023-06-06 | 四川思创激光科技有限公司 | 一种基于模糊控制的激光焊机温控方法、系统及其装置 |
| CN116183184A (zh) * | 2023-04-27 | 2023-05-30 | 深圳市星汉激光科技股份有限公司 | 激光器高温测试方法、电路、电子设备及存储介质 |
| CN116649999B (zh) * | 2023-07-25 | 2023-11-07 | 赛诺威盛科技(北京)股份有限公司 | 探测器的温度控制方法和系统 |
| CN118226909B (zh) * | 2024-05-27 | 2024-08-13 | 安徽优睿半导体技术有限公司 | 一种用于半导体设备的热交换温控系统 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168439A (ja) * | 1999-12-09 | 2001-06-22 | Fuji Photo Film Co Ltd | 発光装置 |
| JP2009142864A (ja) * | 2007-12-14 | 2009-07-02 | Keyence Corp | レーザ加工装置、レーザ加工装置の設定方法及びレーザ加工装置の設定プログラム並びにコンピュータで読取可能な記録媒体 |
| EP3230798A1 (fr) * | 2015-04-01 | 2017-10-18 | Hewlett-Packard Indigo B.V. | Régulation de température pour un laser d'imagerie |
| CN204481323U (zh) * | 2015-04-17 | 2015-07-15 | 山西中科华仪科技有限公司 | 设有数字温度补偿装置的可调谐半导体激光温控装置 |
| CN108539574B (zh) * | 2017-03-06 | 2021-05-14 | 苏州旭创科技有限公司 | 激光器工作温度的低功耗控制方法、控制装置以及光模块 |
-
2021
- 2021-05-20 CN CN202110556119.7A patent/CN115377777A/zh active Pending
-
2022
- 2022-05-16 WO PCT/CN2022/093034 patent/WO2022242591A1/fr active Application Filing
- 2022-05-16 JP JP2023545737A patent/JP2024508104A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN115377777A (zh) | 2022-11-22 |
| WO2022242591A1 (fr) | 2022-11-24 |
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| A61 | First payment of annual fees (during grant procedure) |
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