WO2022242591A1 - Procédé de commande de température de laser et dispositif d'usinage - Google Patents

Procédé de commande de température de laser et dispositif d'usinage Download PDF

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Publication number
WO2022242591A1
WO2022242591A1 PCT/CN2022/093034 CN2022093034W WO2022242591A1 WO 2022242591 A1 WO2022242591 A1 WO 2022242591A1 CN 2022093034 W CN2022093034 W CN 2022093034W WO 2022242591 A1 WO2022242591 A1 WO 2022242591A1
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Prior art keywords
temperature
laser
refrigerant
thermal load
target operating
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Application number
PCT/CN2022/093034
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English (en)
Chinese (zh)
Inventor
孙思叡
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上海名古屋精密工具股份有限公司
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Priority to JP2023545737A priority Critical patent/JP2024508104A/ja
Publication of WO2022242591A1 publication Critical patent/WO2022242591A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0407—Liquid cooling, e.g. by water
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC

Definitions

  • the invention relates to a method for controlling temperature, in particular to a method for notifying the temperature of a laser, so as to facilitate precise laser processing and improve processing accuracy.
  • Lasers especially pulsed lasers, are widely used in industrial production. Due to their own characteristics, lasers will emit a lot of heat when they work. Generally, the working temperature range of lasers is ⁇ 5-10°C. However, the heat generated by lasers in actual working conditions (temperature ) far exceeds this range, so fine and constant temperature control is one of the technical obstacles to laser applications.
  • Water cooler is a widely used cooling mechanism, and is also widely used for constant temperature control of lasers.
  • the laser will also have a preset water-cooling connector, which is convenient for users to connect to cooling devices such as water coolers.
  • the water cooler generally uses cooling water/liquid as the refrigerant, and the low-temperature water output by it flows in the internal circulation pipeline of the laser and returns to the water cooler after taking away the heat.
  • the water cooler monitors the temperature of the return water and adjusts the cooling capacity so that The water temperature of the high-temperature reflux is stable near the set temperature.
  • the above-mentioned configuration is already sufficient, that is, the temperature of the laser is constantly controlled within a working range of less than ⁇ 5°C when the laser is working.
  • Precision laser processing is different from general laser applications in the following ways: 1) In precision laser processing, laser frequency and energy need to be controlled in real time, and the output power of the laser is constantly changing, and its calorific value is constantly changing, that is, the changing heat load. It only has a switch function and has a unique output power, and its calorific value remains unchanged, that is, a constant heat load; 2) The processing accuracy of precision laser processing is required to be at the micron to nanometer level, and a small change in the laser temperature will affect the processing accuracy. Cause significant impact, resulting in processing errors. Generally, the processing of laser processing should be at the millimeter level, and the temperature change of the laser is not enough to have a significant impact on the processing accuracy, and it is still within the allowable processing error range.
  • the current common laser cooling system has the following problems in the application of precision laser processing: 1) when the output power of the laser changes, the operating temperature of the laser cannot be kept constant, but fluctuates within a range of at least 3 to 5 degrees Celsius. The reason is that since the temperature control is a typical time-delay control system, the change of the laser power will immediately cause the change of the calorific value, and it takes time for the heat change to be detected by the water cooler after the temperature of the brine is raised.
  • the general laser cooling system used in precision laser processing will distort the constant temperature of the water cooler, and the temperature change rate and amplitude of the laser will be significantly greater than the change sensed by the sensor of the water cooler, which is extremely unfavorable for the stability of precision laser processing. and high-precision machining.
  • An object of the present invention is to provide a method for controlling the temperature of a laser, so that the actual temperature of the laser in the working state can be kept within the working range of less than ⁇ 1°C, so as to improve the laser processing accuracy.
  • Another object of the present invention is to provide a method for controlling the temperature of the laser, which coordinates the cooling power of the water cooler with the working power of the laser, reduces the oscillation amplitude of the PID parameters, and keeps the temperature of the laser constant.
  • Another object of the present invention is to provide a device for controlling the temperature of the laser, which is used for coordinating the cooling power of the water cooler and the working power of the laser, avoiding the delay in controlling the temperature of the laser, and suitable for the implementation of precision laser processing.
  • Yet another object of the present invention is to provide a machining device for performing precise laser machining.
  • the method of the present invention monitors the heat load of the laser and dynamically adjusts the temperature of the refrigerant in real time based on the change of the heat load of the laser, thereby achieving the effect that the temperature of the laser can be kept constant under different heat loads. That is, according to the change of the thermal load of the laser, the target operating temperature of the refrigerant is adjusted in real time, and then the target operating temperature of the refrigerant is finely adjusted according to the temperature change of the laser itself through PID control in real time. At the same time, the working temperature is controlled by the PID algorithm to realize the approach and constant of the actual temperature of the refrigerant to the target working temperature.
  • the method of the present invention adopts the PID control of the constant temperature target temperature, and constitutes a dual PID control system with the cooling PID control of the refrigerator itself, which greatly reduces the system coupling, and the monitoring of the laser power can monitor both the laser power and the control command of the laser, and the effect is same.
  • a laser temperature control method comprising:
  • the thermal load detection module and the temperature detection module respectively detect the real-time thermal load and real-time temperature of the laser, and when the output power of the laser changes, the cooling target temperature of the refrigerator is taken as the pre-programmed set temperature matching the current power of the laser;
  • the temperature detection module continuously detects the laser and obtains the temperature change curve, dynamically changes the refrigerant target operating temperature of the refrigerator according to the pre-programmed PID control parameters, and the refrigerator performs the actual temperature of the refrigerant based on the constantly refreshed refrigerant target operating temperature and the internal PID algorithm. adjust.
  • a specific embodiment of the method of the present invention monitors the thermal load and temperature of the laser through the control system (including a power detection module and a temperature detection module), and adjusts the refrigerant target operating temperature of the refrigerator according to the thermal load, and simultaneously takes the laser temperature as Based on the laser PID algorithm to fine-tune the target operating temperature of the refrigerator, that is, the current actual temperature of the laser is higher than the constant target temperature of the laser.
  • the target operating temperature of the refrigerant of the high refrigerator, PID determines the target operating temperature of the refrigerant according to the deviation between the current actual temperature of the laser and the constant target temperature of the laser;
  • the refrigerator maintains the temperature of the refrigerant at the target operating temperature of the refrigerant according to its own refrigeration PID algorithm, that is, the current actual temperature of the refrigerant is higher than the target operating temperature of the refrigerant, and the cooling is performed; the actual temperature of the refrigerant is lower than the target operating temperature of the refrigerant, and the heating or cooling is stopped.
  • the PID of the refrigerator determines the cooling power according to the deviation between the current actual temperature of the refrigerant and the target operating temperature of the refrigerant.
  • the thermal load detection module should be understood as a device for obtaining the output power of the laser, or a software module for obtaining the value of the output power, or a combination of a device and a software module.
  • the temperature detection module should be understood as a device for obtaining the real-time temperature of the laser, or a software module for obtaining real-time temperature values, or a combination of a device and a software module.
  • the method of the invention implements independent temperature control on the laser body and the laser head.
  • the method of the invention significantly improves the stability and responsiveness of the working temperature of the laser, and avoids the "false stability" phenomenon that the temperature of the water cooler is stable but the temperature of the laser is unstable.
  • the cooling capacity is dynamically adjusted according to the output power of the laser, and the maximum variation range of the laser temperature is guaranteed to be ⁇ 0.25°C when the laser works in the working range from zero to full power.
  • the temperature adjustment response of the laser is significantly improved.
  • the laser temperature can be controlled within ⁇ 0.1°C within 180 seconds.
  • the present invention also provides a device for controlling the temperature of the laser, including
  • the temperature detection module is used to obtain the real-time temperature data of the laser, such as: the internal temperature of the laser head and the internal temperature of the laser body, etc.;
  • the thermal load detection module is used to obtain real-time thermal load related data of the laser, such as: input/output voltage, input/output current and input/output power, etc.;
  • Refrigerator including cooling mechanism, cooling mechanism and PID electric control mechanism, etc.
  • Master controller including programmable controllers such as industrial PCs or embedded controllers, and communication modules.
  • the thermal load detection module and the temperature detection module provide the obtained data to the general controller, and the general controller adjusts the cooling target temperature of the refrigerator according to the measured data.
  • the cooling mechanism includes refrigerant, monitoring and circulation pumping mechanism (such as circulation pump, pipeline and flow sensor, etc.).
  • its cooling mechanism includes a refrigeration component (such as: a semiconductor refrigeration chip or a compressor) and a heat exchange device (such as: a heat exchange sheet, a heat exchange copper tube),
  • a refrigeration component such as: a semiconductor refrigeration chip or a compressor
  • a heat exchange device such as: a heat exchange sheet, a heat exchange copper tube
  • its PID electric control mechanism includes a controller (such as an embedded controller, a programmable controller, and a temperature sensor), a power supply, and the like.
  • a controller such as an embedded controller, a programmable controller, and a temperature sensor
  • a power supply and the like.
  • the master controller monitors the laser body and the laser head at the same time, and the laser body and the laser head are respectively equipped with coolers to independently adjust and control the temperature.
  • the machining equipment adopting the method of the present invention or installing the device of the present invention can realize precise laser processing.
  • Figure 1 is a diagram of the temperature change of the laser controlled by a constant frequency water cooler
  • Figure 2 is a diagram of the temperature change of the laser using a frequency conversion water cooler to control the temperature
  • Figure 3 is a diagram of the temperature change of the laser using a semiconductor water cooler to control the temperature
  • Fig. 4 is the laser temperature change diagram adopting the temperature control of the method of the present invention.
  • Fig. 5 is a schematic diagram of an embodiment of a device for implementing temperature control in the method of the present invention.
  • a picosecond laser with a maximum heating power of 300 watts is used as the laser light source and equipped with a constant frequency water cooler for laser (cooling capacity 1.5Kw, set target temperature 22°C, non-PID temperature control, temperature control range is ⁇ 0.1°C), for laser Frequency conversion water cooler (cooling capacity 0.6Kw, set target temperature 22°C, PID temperature control) and semiconductor water cooler for laser (cooling capacity 0.6Kw, set target temperature 22°C, PID temperature control) constitute the laser temperature control scheme.
  • the laser switches from 25% output power to 100% output power for 30 minutes, and then switches back to 25% power for 30 minutes to investigate the temperature control and adjustment capabilities of the refrigeration system.
  • Table 1 The results As shown in Table 1 below.
  • a picosecond laser with a maximum power of 300 watts is used as the laser light source, a refrigerator (cooling capacity 0.6Kw, set target temperature 22°C, PID temperature control) and the method of this embodiment, that is, through the control system (including power detector and temperature control) Detector) to monitor the thermal load and temperature of the laser, adjust the cooling target temperature according to the thermal load, and based on the laser temperature, finely adjust the cooling target temperature of the refrigerator according to the laser PID algorithm, that is, the laser temperature is higher than the cooling target temperature.
  • the set temperature of the refrigerator and increase the set temperature of the refrigerator when the laser temperature is lower than the cooling target temperature, and the PID determines the set temperature according to the degree of temperature deviation;
  • the refrigerator maintains the temperature of the cooling liquid at the set temperature according to its own refrigeration PID algorithm, that is, the refrigerant temperature is higher than the set temperature to cool, and the refrigerant temperature is lower than the set temperature to heat.
  • the refrigerator PID is determined according to the degree of temperature deviation. The size of the cooling power.
  • the device shown in Figure 5 can be used to control the temperature of the laser, including
  • the temperature detection module 100 is used to obtain the real-time temperature data of the laser 500, such as: the internal temperature of the laser head and the internal temperature of the laser body, etc.;
  • the thermal load detection module 200 is used to obtain real-time thermal load related data of the laser, such as: input/output voltage, input/output current and input/output power, etc.;
  • Refrigerator 300 which includes a cooling mechanism, a cooling mechanism and a PID electric control mechanism, etc.;
  • Master controller 400 which includes programmable controllers such as industrial PCs or embedded controllers, and communication modules;
  • the cooling mechanism includes a refrigerant 600 , a monitoring and circulation pumping mechanism, etc., and the refrigerant 600 flows in the refrigerator 300 and the laser 500 .
  • the thermal load detection module and the temperature detection module provide the obtained data to the general controller, and the general controller adjusts the cooling target temperature of the refrigerator according to the measured data.
  • the temperature variation of the obtained laser is shown in Fig. 4, the temperature fluctuation degree of the whole stage is ⁇ 0.2°C, and the temperature fluctuation degree of the stable output stage (after 10 minutes of output) is ⁇ 0.1°C.
  • the temperature fluctuation in the whole stage is significantly reduced, and the temperature fluctuation in the stable output stage is only ⁇ 0.1°C, making the temperature of the laser more constant.
  • the method and device of this embodiment can meet the requirements of precision laser processing after being applied to machining equipment.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Control Of Temperature (AREA)

Abstract

L'invention concerne un procédé de commande de la température d'un laser, consistant à réguler fortement une température de travail cible d'un réfrigérant en temps réel en fonction du changement de la charge thermique du laser; ensuite, à réguler finenement, au moyen d'une commande PID, la température de travail cible du réfrigérant en temps réel en fonction du changement de température du laser lui-même, de sorte que tout en régulant fortement et en régulant finement la température de travail cible du réfrigérant, la température réelle du réfrigérant peut s'approcher de la température de travail cible et être constante au moyen d'une commande par algorithme PID. Le procédé selon la présente invention améliore considérablement la stabilité de la température de travail et la réactivité du laser, et empêche le phénomène de « fausse stabilité » selon lequel la température d'un refroidisseur à eau est stable mais la température du laser est instable. La capacité de refroidissement est réglée dynamiquement en fonction de la puissance de sortie du laser afin de garantir que la plage de variation maximale de la température du laser est inférieure ou égale à ± 0,25 °C lorsque le laser fonctionne au sien d'une plage de travail entre zéro et la pleine puissance.
PCT/CN2022/093034 2021-05-20 2022-05-16 Procédé de commande de température de laser et dispositif d'usinage WO2022242591A1 (fr)

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JP2023545737A JP2024508104A (ja) 2021-05-20 2022-05-16 レーザ温度制御方法及び機械加工装置

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CN202110556119.7 2021-05-20
CN202110556119.7A CN115377777A (zh) 2021-05-20 2021-05-20 激光器控温方法和机加工设备

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Cited By (1)

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CN116649999A (zh) * 2023-07-25 2023-08-29 赛诺威盛科技(北京)股份有限公司 探测器的温度控制方法和系统

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CN116183184A (zh) * 2023-04-27 2023-05-30 深圳市星汉激光科技股份有限公司 激光器高温测试方法、电路、电子设备及存储介质

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CN107430369A (zh) * 2015-04-01 2017-12-01 惠普印迪格公司 用于成像激光器的温度控制
CN108539574A (zh) * 2017-03-06 2018-09-14 苏州旭创科技有限公司 激光器工作温度的低功耗控制方法、控制装置以及光模块

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Publication number Priority date Publication date Assignee Title
US20020009105A1 (en) * 1999-12-09 2002-01-24 Kenji Matsumoto Light emitting device
US20090154509A1 (en) * 2007-12-14 2009-06-18 Keyence Corporation Laser Processing Apparatus, Method For Making Settings For The Laser Processing Apparatus, Program For Making Settings For The Laser Processing Apparatus, and Computer-Readable Recording Medium
CN107430369A (zh) * 2015-04-01 2017-12-01 惠普印迪格公司 用于成像激光器的温度控制
CN204481323U (zh) * 2015-04-17 2015-07-15 山西中科华仪科技有限公司 设有数字温度补偿装置的可调谐半导体激光温控装置
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CN116649999B (zh) * 2023-07-25 2023-11-07 赛诺威盛科技(北京)股份有限公司 探测器的温度控制方法和系统

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