WO2022242591A1 - Laser temperature control method and machining device - Google Patents

Laser temperature control method and machining device Download PDF

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Publication number
WO2022242591A1
WO2022242591A1 PCT/CN2022/093034 CN2022093034W WO2022242591A1 WO 2022242591 A1 WO2022242591 A1 WO 2022242591A1 CN 2022093034 W CN2022093034 W CN 2022093034W WO 2022242591 A1 WO2022242591 A1 WO 2022242591A1
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temperature
laser
refrigerant
thermal load
target operating
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PCT/CN2022/093034
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French (fr)
Chinese (zh)
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孙思叡
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上海名古屋精密工具股份有限公司
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Priority to JP2023545737A priority Critical patent/JP2024508104A/en
Publication of WO2022242591A1 publication Critical patent/WO2022242591A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0407—Liquid cooling, e.g. by water
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC

Definitions

  • the invention relates to a method for controlling temperature, in particular to a method for notifying the temperature of a laser, so as to facilitate precise laser processing and improve processing accuracy.
  • Lasers especially pulsed lasers, are widely used in industrial production. Due to their own characteristics, lasers will emit a lot of heat when they work. Generally, the working temperature range of lasers is ⁇ 5-10°C. However, the heat generated by lasers in actual working conditions (temperature ) far exceeds this range, so fine and constant temperature control is one of the technical obstacles to laser applications.
  • Water cooler is a widely used cooling mechanism, and is also widely used for constant temperature control of lasers.
  • the laser will also have a preset water-cooling connector, which is convenient for users to connect to cooling devices such as water coolers.
  • the water cooler generally uses cooling water/liquid as the refrigerant, and the low-temperature water output by it flows in the internal circulation pipeline of the laser and returns to the water cooler after taking away the heat.
  • the water cooler monitors the temperature of the return water and adjusts the cooling capacity so that The water temperature of the high-temperature reflux is stable near the set temperature.
  • the above-mentioned configuration is already sufficient, that is, the temperature of the laser is constantly controlled within a working range of less than ⁇ 5°C when the laser is working.
  • Precision laser processing is different from general laser applications in the following ways: 1) In precision laser processing, laser frequency and energy need to be controlled in real time, and the output power of the laser is constantly changing, and its calorific value is constantly changing, that is, the changing heat load. It only has a switch function and has a unique output power, and its calorific value remains unchanged, that is, a constant heat load; 2) The processing accuracy of precision laser processing is required to be at the micron to nanometer level, and a small change in the laser temperature will affect the processing accuracy. Cause significant impact, resulting in processing errors. Generally, the processing of laser processing should be at the millimeter level, and the temperature change of the laser is not enough to have a significant impact on the processing accuracy, and it is still within the allowable processing error range.
  • the current common laser cooling system has the following problems in the application of precision laser processing: 1) when the output power of the laser changes, the operating temperature of the laser cannot be kept constant, but fluctuates within a range of at least 3 to 5 degrees Celsius. The reason is that since the temperature control is a typical time-delay control system, the change of the laser power will immediately cause the change of the calorific value, and it takes time for the heat change to be detected by the water cooler after the temperature of the brine is raised.
  • the general laser cooling system used in precision laser processing will distort the constant temperature of the water cooler, and the temperature change rate and amplitude of the laser will be significantly greater than the change sensed by the sensor of the water cooler, which is extremely unfavorable for the stability of precision laser processing. and high-precision machining.
  • An object of the present invention is to provide a method for controlling the temperature of a laser, so that the actual temperature of the laser in the working state can be kept within the working range of less than ⁇ 1°C, so as to improve the laser processing accuracy.
  • Another object of the present invention is to provide a method for controlling the temperature of the laser, which coordinates the cooling power of the water cooler with the working power of the laser, reduces the oscillation amplitude of the PID parameters, and keeps the temperature of the laser constant.
  • Another object of the present invention is to provide a device for controlling the temperature of the laser, which is used for coordinating the cooling power of the water cooler and the working power of the laser, avoiding the delay in controlling the temperature of the laser, and suitable for the implementation of precision laser processing.
  • Yet another object of the present invention is to provide a machining device for performing precise laser machining.
  • the method of the present invention monitors the heat load of the laser and dynamically adjusts the temperature of the refrigerant in real time based on the change of the heat load of the laser, thereby achieving the effect that the temperature of the laser can be kept constant under different heat loads. That is, according to the change of the thermal load of the laser, the target operating temperature of the refrigerant is adjusted in real time, and then the target operating temperature of the refrigerant is finely adjusted according to the temperature change of the laser itself through PID control in real time. At the same time, the working temperature is controlled by the PID algorithm to realize the approach and constant of the actual temperature of the refrigerant to the target working temperature.
  • the method of the present invention adopts the PID control of the constant temperature target temperature, and constitutes a dual PID control system with the cooling PID control of the refrigerator itself, which greatly reduces the system coupling, and the monitoring of the laser power can monitor both the laser power and the control command of the laser, and the effect is same.
  • a laser temperature control method comprising:
  • the thermal load detection module and the temperature detection module respectively detect the real-time thermal load and real-time temperature of the laser, and when the output power of the laser changes, the cooling target temperature of the refrigerator is taken as the pre-programmed set temperature matching the current power of the laser;
  • the temperature detection module continuously detects the laser and obtains the temperature change curve, dynamically changes the refrigerant target operating temperature of the refrigerator according to the pre-programmed PID control parameters, and the refrigerator performs the actual temperature of the refrigerant based on the constantly refreshed refrigerant target operating temperature and the internal PID algorithm. adjust.
  • a specific embodiment of the method of the present invention monitors the thermal load and temperature of the laser through the control system (including a power detection module and a temperature detection module), and adjusts the refrigerant target operating temperature of the refrigerator according to the thermal load, and simultaneously takes the laser temperature as Based on the laser PID algorithm to fine-tune the target operating temperature of the refrigerator, that is, the current actual temperature of the laser is higher than the constant target temperature of the laser.
  • the target operating temperature of the refrigerant of the high refrigerator, PID determines the target operating temperature of the refrigerant according to the deviation between the current actual temperature of the laser and the constant target temperature of the laser;
  • the refrigerator maintains the temperature of the refrigerant at the target operating temperature of the refrigerant according to its own refrigeration PID algorithm, that is, the current actual temperature of the refrigerant is higher than the target operating temperature of the refrigerant, and the cooling is performed; the actual temperature of the refrigerant is lower than the target operating temperature of the refrigerant, and the heating or cooling is stopped.
  • the PID of the refrigerator determines the cooling power according to the deviation between the current actual temperature of the refrigerant and the target operating temperature of the refrigerant.
  • the thermal load detection module should be understood as a device for obtaining the output power of the laser, or a software module for obtaining the value of the output power, or a combination of a device and a software module.
  • the temperature detection module should be understood as a device for obtaining the real-time temperature of the laser, or a software module for obtaining real-time temperature values, or a combination of a device and a software module.
  • the method of the invention implements independent temperature control on the laser body and the laser head.
  • the method of the invention significantly improves the stability and responsiveness of the working temperature of the laser, and avoids the "false stability" phenomenon that the temperature of the water cooler is stable but the temperature of the laser is unstable.
  • the cooling capacity is dynamically adjusted according to the output power of the laser, and the maximum variation range of the laser temperature is guaranteed to be ⁇ 0.25°C when the laser works in the working range from zero to full power.
  • the temperature adjustment response of the laser is significantly improved.
  • the laser temperature can be controlled within ⁇ 0.1°C within 180 seconds.
  • the present invention also provides a device for controlling the temperature of the laser, including
  • the temperature detection module is used to obtain the real-time temperature data of the laser, such as: the internal temperature of the laser head and the internal temperature of the laser body, etc.;
  • the thermal load detection module is used to obtain real-time thermal load related data of the laser, such as: input/output voltage, input/output current and input/output power, etc.;
  • Refrigerator including cooling mechanism, cooling mechanism and PID electric control mechanism, etc.
  • Master controller including programmable controllers such as industrial PCs or embedded controllers, and communication modules.
  • the thermal load detection module and the temperature detection module provide the obtained data to the general controller, and the general controller adjusts the cooling target temperature of the refrigerator according to the measured data.
  • the cooling mechanism includes refrigerant, monitoring and circulation pumping mechanism (such as circulation pump, pipeline and flow sensor, etc.).
  • its cooling mechanism includes a refrigeration component (such as: a semiconductor refrigeration chip or a compressor) and a heat exchange device (such as: a heat exchange sheet, a heat exchange copper tube),
  • a refrigeration component such as: a semiconductor refrigeration chip or a compressor
  • a heat exchange device such as: a heat exchange sheet, a heat exchange copper tube
  • its PID electric control mechanism includes a controller (such as an embedded controller, a programmable controller, and a temperature sensor), a power supply, and the like.
  • a controller such as an embedded controller, a programmable controller, and a temperature sensor
  • a power supply and the like.
  • the master controller monitors the laser body and the laser head at the same time, and the laser body and the laser head are respectively equipped with coolers to independently adjust and control the temperature.
  • the machining equipment adopting the method of the present invention or installing the device of the present invention can realize precise laser processing.
  • Figure 1 is a diagram of the temperature change of the laser controlled by a constant frequency water cooler
  • Figure 2 is a diagram of the temperature change of the laser using a frequency conversion water cooler to control the temperature
  • Figure 3 is a diagram of the temperature change of the laser using a semiconductor water cooler to control the temperature
  • Fig. 4 is the laser temperature change diagram adopting the temperature control of the method of the present invention.
  • Fig. 5 is a schematic diagram of an embodiment of a device for implementing temperature control in the method of the present invention.
  • a picosecond laser with a maximum heating power of 300 watts is used as the laser light source and equipped with a constant frequency water cooler for laser (cooling capacity 1.5Kw, set target temperature 22°C, non-PID temperature control, temperature control range is ⁇ 0.1°C), for laser Frequency conversion water cooler (cooling capacity 0.6Kw, set target temperature 22°C, PID temperature control) and semiconductor water cooler for laser (cooling capacity 0.6Kw, set target temperature 22°C, PID temperature control) constitute the laser temperature control scheme.
  • the laser switches from 25% output power to 100% output power for 30 minutes, and then switches back to 25% power for 30 minutes to investigate the temperature control and adjustment capabilities of the refrigeration system.
  • Table 1 The results As shown in Table 1 below.
  • a picosecond laser with a maximum power of 300 watts is used as the laser light source, a refrigerator (cooling capacity 0.6Kw, set target temperature 22°C, PID temperature control) and the method of this embodiment, that is, through the control system (including power detector and temperature control) Detector) to monitor the thermal load and temperature of the laser, adjust the cooling target temperature according to the thermal load, and based on the laser temperature, finely adjust the cooling target temperature of the refrigerator according to the laser PID algorithm, that is, the laser temperature is higher than the cooling target temperature.
  • the set temperature of the refrigerator and increase the set temperature of the refrigerator when the laser temperature is lower than the cooling target temperature, and the PID determines the set temperature according to the degree of temperature deviation;
  • the refrigerator maintains the temperature of the cooling liquid at the set temperature according to its own refrigeration PID algorithm, that is, the refrigerant temperature is higher than the set temperature to cool, and the refrigerant temperature is lower than the set temperature to heat.
  • the refrigerator PID is determined according to the degree of temperature deviation. The size of the cooling power.
  • the device shown in Figure 5 can be used to control the temperature of the laser, including
  • the temperature detection module 100 is used to obtain the real-time temperature data of the laser 500, such as: the internal temperature of the laser head and the internal temperature of the laser body, etc.;
  • the thermal load detection module 200 is used to obtain real-time thermal load related data of the laser, such as: input/output voltage, input/output current and input/output power, etc.;
  • Refrigerator 300 which includes a cooling mechanism, a cooling mechanism and a PID electric control mechanism, etc.;
  • Master controller 400 which includes programmable controllers such as industrial PCs or embedded controllers, and communication modules;
  • the cooling mechanism includes a refrigerant 600 , a monitoring and circulation pumping mechanism, etc., and the refrigerant 600 flows in the refrigerator 300 and the laser 500 .
  • the thermal load detection module and the temperature detection module provide the obtained data to the general controller, and the general controller adjusts the cooling target temperature of the refrigerator according to the measured data.
  • the temperature variation of the obtained laser is shown in Fig. 4, the temperature fluctuation degree of the whole stage is ⁇ 0.2°C, and the temperature fluctuation degree of the stable output stage (after 10 minutes of output) is ⁇ 0.1°C.
  • the temperature fluctuation in the whole stage is significantly reduced, and the temperature fluctuation in the stable output stage is only ⁇ 0.1°C, making the temperature of the laser more constant.
  • the method and device of this embodiment can meet the requirements of precision laser processing after being applied to machining equipment.

Abstract

A laser temperature control method, comprising: greatly regulating a target working temperature of a refrigerant in real time according to the change of laser heat load, next, finely regulating, by means of PID control, the target working temperature of the refrigerant in real time according to the temperature change of the laser itself, such that while greatly regulating and finely regulating the target working temperature of the refrigerant, the actual temperature of the refrigerant can approach to the target working temperature and be constant by means of PID algorithm control. The method of the present invention significantly improves the working temperature stability and responsiveness of the laser, and prevents the "false stability" phenomenon that the temperature of a water cooler is stable but the temperature of the laser is unstable. The cooling capacity is dynamically adjusted according to the output power of the laser to ensure that the maximum variation range of the laser temperature is smaller than or equal to ±0.25℃ when the laser works within a working range of zero to full power.

Description

激光器控温方法和机加工设备Laser temperature control method and machining equipment 技术领域technical field
本发明涉及一种控制温度的方法，尤其涉及一种激光器温度的通知方法，以利于实施精密激光加工，提高加工精度。The invention relates to a method for controlling temperature, in particular to a method for notifying the temperature of a laser, so as to facilitate precise laser processing and improve processing accuracy.
背景技术Background technique
激光器，特别是脉冲激光器被广泛应用于工业生产，激光器由于其自身特性工作时会大量放热，一般激光器的可工作温度区间为±5～10℃，但实际工作状态下激光器产生的热量(温度)远超这一区间，因此温度精细恒定控制是激光器应用的技术阻碍之一。Lasers, especially pulsed lasers, are widely used in industrial production. Due to their own characteristics, lasers will emit a lot of heat when they work. Generally, the working temperature range of lasers is ±5-10°C. However, the heat generated by lasers in actual working conditions (temperature ) far exceeds this range, so fine and constant temperature control is one of the technical obstacles to laser applications.
水冷机是一种广泛应用的冷却机构，亦被大量用于激光器的恒温控制。激光器也会预设水冷接头，方便用户对接水冷机等冷却装置。Water cooler is a widely used cooling mechanism, and is also widely used for constant temperature control of lasers. The laser will also have a preset water-cooling connector, which is convenient for users to connect to cooling devices such as water coolers.
一般而言，水冷机一般以冷却水/液作为冷媒，其输出的低温水流于激光器内部循环管路流动并带走热量后重返水冷机，水冷机监控回流水温度并调节制冷量，以使得高温回流的水温稳定于设定温度附近。在一般的激光加工应用中，上述配置已经能满足使用，即在激光器工作时将其温度恒定控制在一个小于±5℃的工作区间内。Generally speaking, the water cooler generally uses cooling water/liquid as the refrigerant, and the low-temperature water output by it flows in the internal circulation pipeline of the laser and returns to the water cooler after taking away the heat. The water cooler monitors the temperature of the return water and adjusts the cooling capacity so that The water temperature of the high-temperature reflux is stable near the set temperature. In general laser processing applications, the above-mentioned configuration is already sufficient, that is, the temperature of the laser is constantly controlled within a working range of less than ±5°C when the laser is working.
精密激光加工与一般激光应用有如下不同：1)精密激光加工中需要实时控制激光频率和能量，其激光器输出功率不断变化，其发热量不断变化，即变化的热负载，而一般激光加工中激光器仅具有开关功能，具有唯一的输出功率，其发热量维持不变，即不变的热负载；2)精密激光加工的加工精度要求在微米至纳米级别，激光器温度的微小变化即会对加工精度造成显著影响，产生加工误差。一般激光加工的加工要去在毫米级别，激光器温度变化不足以对加工精度造成显著影响，仍在允许的加工误差范围内。Precision laser processing is different from general laser applications in the following ways: 1) In precision laser processing, laser frequency and energy need to be controlled in real time, and the output power of the laser is constantly changing, and its calorific value is constantly changing, that is, the changing heat load. It only has a switch function and has a unique output power, and its calorific value remains unchanged, that is, a constant heat load; 2) The processing accuracy of precision laser processing is required to be at the micron to nanometer level, and a small change in the laser temperature will affect the processing accuracy. Cause significant impact, resulting in processing errors. Generally, the processing of laser processing should be at the millimeter level, and the temperature change of the laser is not enough to have a significant impact on the processing accuracy, and it is still within the allowable processing error range.
因此，目前常见的激光冷却系统在应用于精密激光加工中存在如下问题：1)在激光器输出功率变化时，激光器的工作温度无法恒定，而是在一个至少3～5摄氏度的范围内波动，其原因是由于温度控制属于典型的延时控制系统，激光器功率的变化会即时造成发热量的变化，而这一热量变化通过载冷剂升温再被水冷机察觉到需要时间。当水冷机根据察觉到的温度变化调整制冷功率，激光器的输出功率已经又发生了(多次)变化，这样就会造成水冷机的制冷功率无法与激光功率相协调，造成比例-积分-微分控制(Proportional Integral Derivative，PID)参数振荡。同样的，基于上述相同理由，即使在激光器功率不变时，控制温度达到均衡也较为缓慢，一般需要5分钟以上时间。Therefore, the current common laser cooling system has the following problems in the application of precision laser processing: 1) when the output power of the laser changes, the operating temperature of the laser cannot be kept constant, but fluctuates within a range of at least 3 to 5 degrees Celsius. The reason is that since the temperature control is a typical time-delay control system, the change of the laser power will immediately cause the change of the calorific value, and it takes time for the heat change to be detected by the water cooler after the temperature of the brine is raised. When the water cooler adjusts the cooling power according to the perceived temperature change, the output power of the laser has changed (multiple times), which will cause the cooling power of the water cooler to be unable to coordinate with the laser power, resulting in proportional-integral-derivative control (Proportional Integral Derivative, PID) parameter oscillation. Similarly, based on the same reason as above, even when the laser power is constant, it is relatively slow to control the temperature to reach equilibrium, which generally takes more than 5 minutes.
综上，一般激光用冷却系统用于精密激光加工会使得水冷机的恒温温度失真，激 光器的温度变化速率和幅度都将显著大于水冷机传感器所感知的变化，极其不利于精密激光加工的稳定进行和高精度加工的实现。To sum up, the general laser cooling system used in precision laser processing will distort the constant temperature of the water cooler, and the temperature change rate and amplitude of the laser will be significantly greater than the change sensed by the sensor of the water cooler, which is extremely unfavorable for the stability of precision laser processing. and high-precision machining.
发明内容Contents of the invention
本发明的一个目的在于提供一种激光器控温方法，使得工作状态的激光器的实际温度保持在小于±1℃的工作区间内，提高激光加工精度。An object of the present invention is to provide a method for controlling the temperature of a laser, so that the actual temperature of the laser in the working state can be kept within the working range of less than ±1°C, so as to improve the laser processing accuracy.
本发明的另一个目的在于提供一种激光器控温方法，使得水冷机的制冷功率与激光器的工作功率相协调，降低PID参数振荡幅度，保持激光器温度恒定。Another object of the present invention is to provide a method for controlling the temperature of the laser, which coordinates the cooling power of the water cooler with the working power of the laser, reduces the oscillation amplitude of the PID parameters, and keeps the temperature of the laser constant.
本发明的再一个目的在于提供一种控制激光器温度的装置，用于协调水冷机的制冷功率与激光器的工作功率，避免激光器温度控制延迟，适合于精密激光加工的实施。Another object of the present invention is to provide a device for controlling the temperature of the laser, which is used for coordinating the cooling power of the water cooler and the working power of the laser, avoiding the delay in controlling the temperature of the laser, and suitable for the implementation of precision laser processing.
本发明的又一个目的在于提供一种机加工设备，以实施精密激光加工。Yet another object of the present invention is to provide a machining device for performing precise laser machining.
本发明的方法，通过监控激光器热负载，并基于激光器的热负载的变化对冷媒温度实时动态调节，从而达到激光器在不同热负载下均能实现温度恒定的效果。即根据激光器热负载变化情况先实时地对冷媒目标工作温度进行大幅度调整，再实时地通过PID控制根据激光器自身温度变化对冷媒的目标工作温度进行精细调整，在大幅度调整和精细调整冷媒目标工作温度的同时通过PID算法控制实现冷媒实际温度向该目标工作温度的趋近和恒定。The method of the present invention monitors the heat load of the laser and dynamically adjusts the temperature of the refrigerant in real time based on the change of the heat load of the laser, thereby achieving the effect that the temperature of the laser can be kept constant under different heat loads. That is, according to the change of the thermal load of the laser, the target operating temperature of the refrigerant is adjusted in real time, and then the target operating temperature of the refrigerant is finely adjusted according to the temperature change of the laser itself through PID control in real time. At the same time, the working temperature is controlled by the PID algorithm to realize the approach and constant of the actual temperature of the refrigerant to the target working temperature.
本发明方法通过采用恒温目标温度PID控制，与制冷器自身的制冷PID控制构成双PID控制系统，大大降低了系统耦合，对激光功率的监控既可以监控激光器功率也可以监控激光器的控制指令，效果相同。The method of the present invention adopts the PID control of the constant temperature target temperature, and constitutes a dual PID control system with the cooling PID control of the refrigerator itself, which greatly reduces the system coupling, and the monitoring of the laser power can monitor both the laser power and the control command of the laser, and the effect is same.
一种激光器控温方法，包括：A laser temperature control method, comprising:
将热负载探测模块和温度探测模块分别探测激光器的实时热负载和实时温度，当激光器的输出功率发生变化时，根据预先编程的与激光器当前功率匹配的设定温度作为制冷器的制冷目标温度；The thermal load detection module and the temperature detection module respectively detect the real-time thermal load and real-time temperature of the laser, and when the output power of the laser changes, the cooling target temperature of the refrigerator is taken as the pre-programmed set temperature matching the current power of the laser;
温度探测模块持续探测激光器并得到温度变化曲线，根据预先编程的PID控制参数动态变更制冷器的冷媒目标工作温度，而制冷器则依据不断刷新的冷媒目标工作温度及内部PID算法进行冷媒实际温度的调节。The temperature detection module continuously detects the laser and obtains the temperature change curve, dynamically changes the refrigerant target operating temperature of the refrigerator according to the pre-programmed PID control parameters, and the refrigerator performs the actual temperature of the refrigerant based on the constantly refreshed refrigerant target operating temperature and the internal PID algorithm. adjust.
一种本发明方法的具体的实施方式，通过控制系统(包括功率探测模块和温度探测模块)监控激光器热负载和温度，根据热负载大幅度调节制冷器的冷媒目标工作温度，同时以激光器温度为依据，根据激光器PID算法来精细调节制冷器的目标工作温度，即激光器当前实际温度高于激光器恒定目标温度就调低制冷器的冷媒目标工作温度，激光器当前实际温度低于激光器恒定目标温度就调高制冷器的冷媒目标工作温度，PID根据激光器当前实际温度和激光器恒定目标温度的偏离情况决定冷媒目标工作温度的高低；A specific embodiment of the method of the present invention monitors the thermal load and temperature of the laser through the control system (including a power detection module and a temperature detection module), and adjusts the refrigerant target operating temperature of the refrigerator according to the thermal load, and simultaneously takes the laser temperature as Based on the laser PID algorithm to fine-tune the target operating temperature of the refrigerator, that is, the current actual temperature of the laser is higher than the constant target temperature of the laser. The target operating temperature of the refrigerant of the high refrigerator, PID determines the target operating temperature of the refrigerant according to the deviation between the current actual temperature of the laser and the constant target temperature of the laser;
制冷器根据自身的制冷PID算法把冷媒的温度维持在冷媒目标工作温度上，即冷媒当前实际温度高于冷媒目标工作温度就制冷，冷媒当前实际温度低于冷媒目标工作 温度就制热或停止制冷，制冷器PID根据即冷媒当前实际温度和冷媒目标工作温度偏离情况决定制冷功率的大小。The refrigerator maintains the temperature of the refrigerant at the target operating temperature of the refrigerant according to its own refrigeration PID algorithm, that is, the current actual temperature of the refrigerant is higher than the target operating temperature of the refrigerant, and the cooling is performed; the actual temperature of the refrigerant is lower than the target operating temperature of the refrigerant, and the heating or cooling is stopped. , the PID of the refrigerator determines the cooling power according to the deviation between the current actual temperature of the refrigerant and the target operating temperature of the refrigerant.
本发明的方法，热负载探测模块应当理解为获取激光器输出功率的器件，或者取得输出功率数值的软件模块，或者器件与软件模块的组合。In the method of the present invention, the thermal load detection module should be understood as a device for obtaining the output power of the laser, or a software module for obtaining the value of the output power, or a combination of a device and a software module.
本发明的方法，温度探测模块应当理解为获取激光器实时温度的器件，或者取得实时温度数值的软件模块，或者器件与软件模块的组合。In the method of the present invention, the temperature detection module should be understood as a device for obtaining the real-time temperature of the laser, or a software module for obtaining real-time temperature values, or a combination of a device and a software module.
本发明的方法，对激光器本体和激光头实施单独温度控制。The method of the invention implements independent temperature control on the laser body and the laser head.
本发明的方法，显著提高激光器工作温度稳定性和响应性，避免了水冷机温度稳而激光器温度不稳的“假稳定”现象。跟随激光器输出功率动态调节制冷量，激光器在零至全功率工作范围内工作时保证激光器温度最大变化范围≤±0.25℃。同时，还使得激光器温度调整响应性显著提高，激光器输出稳定在某一功率时，在180秒内就能将激光器温度变化范围控制在±0.1℃以内。The method of the invention significantly improves the stability and responsiveness of the working temperature of the laser, and avoids the "false stability" phenomenon that the temperature of the water cooler is stable but the temperature of the laser is unstable. The cooling capacity is dynamically adjusted according to the output power of the laser, and the maximum variation range of the laser temperature is guaranteed to be ≤±0.25°C when the laser works in the working range from zero to full power. At the same time, the temperature adjustment response of the laser is significantly improved. When the laser output is stable at a certain power, the laser temperature can be controlled within ±0.1°C within 180 seconds.
为了实施上述方法，本发明还提供一种控制激光器温度的装置，包括In order to implement the above method, the present invention also provides a device for controlling the temperature of the laser, including
温度探测模块，用于获取激光器的实时温度数据，如：激光头内部温度和激光器本体内部温度等；The temperature detection module is used to obtain the real-time temperature data of the laser, such as: the internal temperature of the laser head and the internal temperature of the laser body, etc.;
热负载探测模块，用于获取激光器的实时热负载相关数据，如：输入/输出电压、输入/输出电流和输入/输出功率等；The thermal load detection module is used to obtain real-time thermal load related data of the laser, such as: input/output voltage, input/output current and input/output power, etc.;
制冷器，包括载冷机构、冷却机构和PID电控机构等；Refrigerator, including cooling mechanism, cooling mechanism and PID electric control mechanism, etc.;
总控器，包括工业PC或嵌入式控制器等可编程控制器及通信模块。Master controller, including programmable controllers such as industrial PCs or embedded controllers, and communication modules.
热负载探测模块和温度探测模块将获得数据提供给总控器，由总控器依据测得数据对制冷器的制冷目标温度进行调节。The thermal load detection module and the temperature detection module provide the obtained data to the general controller, and the general controller adjusts the cooling target temperature of the refrigerator according to the measured data.
本发明的装置，其载冷机构包括冷媒、监测及循环泵送机构(如：循环泵、管路和流量传感器等)。In the device of the present invention, the cooling mechanism includes refrigerant, monitoring and circulation pumping mechanism (such as circulation pump, pipeline and flow sensor, etc.).
本发明的装置，其冷却机构包括制冷部件(如：半导体制冷片或压缩机)和换热装置(如：换热片、换热铜管)，In the device of the present invention, its cooling mechanism includes a refrigeration component (such as: a semiconductor refrigeration chip or a compressor) and a heat exchange device (such as: a heat exchange sheet, a heat exchange copper tube),
本发明的装置，其PID电控机构包括控制器(如：嵌入式控制器、可编程控制器和温度传感器)和电源等。In the device of the present invention, its PID electric control mechanism includes a controller (such as an embedded controller, a programmable controller, and a temperature sensor), a power supply, and the like.
本发明的装置，总控器同时监控激光器本体和激光头，激光器本体和激光头分别设置冷却器，对温度进行独立地调节和控制。In the device of the present invention, the master controller monitors the laser body and the laser head at the same time, and the laser body and the laser head are respectively equipped with coolers to independently adjust and control the temperature.
采用本发明的方法或安装本发明的装置的机加工设备能够实现精密激光加工。The machining equipment adopting the method of the present invention or installing the device of the present invention can realize precise laser processing.
附图说明Description of drawings
图1为采用恒频水冷机控温的激光器温度变化图；Figure 1 is a diagram of the temperature change of the laser controlled by a constant frequency water cooler;
图2为采用变频水冷机控温的激光器温度变化图；Figure 2 is a diagram of the temperature change of the laser using a frequency conversion water cooler to control the temperature;
图3为采用半导体水冷机控温的激光器温度变化图；Figure 3 is a diagram of the temperature change of the laser using a semiconductor water cooler to control the temperature;
图4为采用本发明方法控温的激光器温度变化图；Fig. 4 is the laser temperature change diagram adopting the temperature control of the method of the present invention;
图5为用于实施本发明方法控温的装置一实施例的示意图。Fig. 5 is a schematic diagram of an embodiment of a device for implementing temperature control in the method of the present invention.
具体实施方式Detailed ways
以下结合附图详细描述本发明的技术方案。本发明实施例仅用以说明本发明的技术方案而非限制，尽管参照较佳实施例对本发明进行了详细说明，本领域的普通技术人员应当理解，可以对发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的精神和范围，其均应涵盖在本发明的权利要求范围中。The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings. The embodiments of the present invention are only used to illustrate the technical solutions of the present invention without limitation. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the invention can be modified or equivalently replaced , without departing from the spirit and scope of the technical solution of the present invention, all of which shall be covered by the claims of the present invention.
采用最大发热功率300瓦的皮秒激光器作为激光光源并配置激光用恒频水冷机(制冷量1.5Kw，设定目标温度22℃，非PID温控，温控范围为±0.1℃)、激光用变频水冷机(制冷量0.6Kw，设定目标温度22℃，PID温控)和激光用半导体水冷机(制冷量0.6Kw，设定目标温度22℃，PID温控)组成激光器控温方案，在25℃室温下，预设22℃水温，激光器从25％输出功率至100％输出功率各功率连续输出30分钟后切换，最后再换回25％功率30分钟，考察制冷系统温控调节能力，结果如下如表1所示。A picosecond laser with a maximum heating power of 300 watts is used as the laser light source and equipped with a constant frequency water cooler for laser (cooling capacity 1.5Kw, set target temperature 22°C, non-PID temperature control, temperature control range is ±0.1°C), for laser Frequency conversion water cooler (cooling capacity 0.6Kw, set target temperature 22°C, PID temperature control) and semiconductor water cooler for laser (cooling capacity 0.6Kw, set target temperature 22°C, PID temperature control) constitute the laser temperature control scheme. At a room temperature of 25°C, with a preset water temperature of 22°C, the laser switches from 25% output power to 100% output power for 30 minutes, and then switches back to 25% power for 30 minutes to investigate the temperature control and adjustment capabilities of the refrigeration system. The results As shown in Table 1 below.
表1Table 1
Figure PCTCN2022093034-appb-000001
Figure PCTCN2022093034-appb-000001
由此可见，现有的水冷机应用实施激光器的冷却时，激光器的波动范围在约为3℃以上，不能满足激光精加工的需要。It can be seen that when the existing water cooler is used to cool the laser, the fluctuation range of the laser is above about 3°C, which cannot meet the needs of laser finishing.
采用最大功率300瓦的皮秒激光器作为激光光源，制冷器(制冷量0.6Kw，设定目标温度22℃，PID温控)和本实施例的方法，即通过控制系统(包括功率探测器和温度探测器)监控激光器热负载及温度，根据热负载大幅度调整制冷目标温度，并以激光器温度为依据，根据激光器PID算法来精细调节制冷器的制冷目标温度，即激光器温度高于制冷目标温度就调低制冷器的设定温度，激光器温度低于制冷目标温度就调高制冷器的设定温度，PID根据温度偏离程度决定设定温度的大小；A picosecond laser with a maximum power of 300 watts is used as the laser light source, a refrigerator (cooling capacity 0.6Kw, set target temperature 22°C, PID temperature control) and the method of this embodiment, that is, through the control system (including power detector and temperature control) Detector) to monitor the thermal load and temperature of the laser, adjust the cooling target temperature according to the thermal load, and based on the laser temperature, finely adjust the cooling target temperature of the refrigerator according to the laser PID algorithm, that is, the laser temperature is higher than the cooling target temperature. Lower the set temperature of the refrigerator, and increase the set temperature of the refrigerator when the laser temperature is lower than the cooling target temperature, and the PID determines the set temperature according to the degree of temperature deviation;
制冷器根据自身的制冷PID算法把冷却液的温度维持在设定温度上，即冷媒温度高于设定温度就制冷，冷媒温度低于设定温度就制热，制冷器PID根据温度偏离程度决定制冷功率的大小。The refrigerator maintains the temperature of the cooling liquid at the set temperature according to its own refrigeration PID algorithm, that is, the refrigerant temperature is higher than the set temperature to cool, and the refrigerant temperature is lower than the set temperature to heat. The refrigerator PID is determined according to the degree of temperature deviation. The size of the cooling power.
为实施本实施例的方法，可采用如图5所示的装置控制激光器温度，包括In order to implement the method of this embodiment, the device shown in Figure 5 can be used to control the temperature of the laser, including
温度探测模块100，用于获取激光器500的实时温度数据，如：激光头内部温度和 激光器本体内部温度等；The temperature detection module 100 is used to obtain the real-time temperature data of the laser 500, such as: the internal temperature of the laser head and the internal temperature of the laser body, etc.;
热负载探测模块200，用于获取激光器的实时热负载相关数据，如：输入/输出电压、输入/输出电流和输入/输出功率等；The thermal load detection module 200 is used to obtain real-time thermal load related data of the laser, such as: input/output voltage, input/output current and input/output power, etc.;
制冷器300，其包括载冷机构、冷却机构和PID电控机构等； Refrigerator 300, which includes a cooling mechanism, a cooling mechanism and a PID electric control mechanism, etc.;
总控器400，其包括工业PC或嵌入式控制器等可编程控制器及通信模块； Master controller 400, which includes programmable controllers such as industrial PCs or embedded controllers, and communication modules;
载冷机构包括冷媒600、监测及循环泵送机构等，冷媒600在制冷器300和激光器500流动。The cooling mechanism includes a refrigerant 600 , a monitoring and circulation pumping mechanism, etc., and the refrigerant 600 flows in the refrigerator 300 and the laser 500 .
热负载探测模块和温度探测模块将获得数据提供给总控器，由总控器依据测得数据对制冷器的制冷目标温度进行调节。The thermal load detection module and the temperature detection module provide the obtained data to the general controller, and the general controller adjusts the cooling target temperature of the refrigerator according to the measured data.
所得的激光器温度变化情况如图4所示，其全阶段温度波动程度为±0.2℃，稳定输出阶段(输出10分钟后)温度波动程度为±0.1℃。与表1相比，全阶段温度波动显著下降，稳定输出阶段的温度波动仅为±0.1℃，使得激光器的温度更为恒定。The temperature variation of the obtained laser is shown in Fig. 4, the temperature fluctuation degree of the whole stage is ±0.2°C, and the temperature fluctuation degree of the stable output stage (after 10 minutes of output) is ±0.1°C. Compared with Table 1, the temperature fluctuation in the whole stage is significantly reduced, and the temperature fluctuation in the stable output stage is only ±0.1°C, making the temperature of the laser more constant.
将本实施例的方法和装置应用于机加工设备后能满足精密激光加工的要求。The method and device of this embodiment can meet the requirements of precision laser processing after being applied to machining equipment.

Claims (5)

  1. 一种激光器控温方法，其特征在于：A laser temperature control method, characterized in that:
    根据激光器热负载变化情况先实时地对冷媒目标工作温度进行大幅度调整，再实时地通过PID控制根据激光器自身温度变化对冷媒的目标工作温度进行精细调整，在大幅度调整和精细调整冷媒目标工作温度的同时通过PID算法控制实现冷媒实际温度向该目标工作温度的趋近和恒定。According to the thermal load change of the laser, the target operating temperature of the refrigerant is adjusted substantially in real time, and then the target operating temperature of the refrigerant is finely adjusted according to the temperature change of the laser itself through PID control in real time. At the same time, the temperature is controlled by the PID algorithm to achieve the approach and constant of the actual temperature of the refrigerant to the target working temperature.
  2. 根据权利要求1所述的激光器控温方法，其特征在于：The laser temperature control method according to claim 1, characterized in that:
    监控激光器的热负载，根据其变化情况先实时地对冷媒目标工作温度进行大幅度调整，再实时地通过PID控制根据激光器自身温度变化对冷媒的目标工作温度进行精细调整，在大幅度调整和精细调整冷媒目标工作温度的同时通过PID算法控制实现冷媒实际温度向该目标工作温度的趋近和恒定，从而构成双PID控制系统，降低了系统耦合；其中对激光器热负载的监控既可以是对激光器热负载的监控也可以是对激光器热负载调整的控制指令的监控。Monitor the thermal load of the laser, adjust the target operating temperature of the refrigerant in real time according to its changes, and then finely adjust the target operating temperature of the refrigerant in real time through PID control according to the temperature change of the laser itself. While adjusting the target operating temperature of the refrigerant, the actual temperature of the refrigerant is approached and constant to the target operating temperature through PID algorithm control, thus forming a dual-PID control system and reducing system coupling; the monitoring of the thermal load of the laser can be used for laser The monitoring of the thermal load may also be the monitoring of the control instruction for adjusting the thermal load of the laser.
  3. 根据权利要求1所述的激光器控温方法，其特征在于：The laser temperature control method according to claim 1, characterized in that:
    通过热负载监控和激光器温度监控分别测得激光器的实时热负载和实时温度，当激光器的热负载发生变化时，根据预先编程的与激光器当前热负载匹配的设定温度作为制冷器的冷媒目标工作温度；The real-time thermal load and real-time temperature of the laser are respectively measured through thermal load monitoring and laser temperature monitoring. When the thermal load of the laser changes, the pre-programmed set temperature that matches the current thermal load of the laser is used as the refrigerant target of the refrigerator. temperature;
    温度探测模块持续探测激光器并得到温度变化曲线，根据预先编程的PID控制参数动态变更制冷器的冷媒目标工作温度，而制冷器则依据不断刷新的冷媒目标工作温度及内部PID算法进行冷媒温度的调节。The temperature detection module continuously detects the laser and obtains the temperature change curve, dynamically changes the refrigerant target operating temperature of the refrigerator according to the pre-programmed PID control parameters, and the refrigerator adjusts the refrigerant temperature according to the constantly refreshed refrigerant target operating temperature and internal PID algorithm .
  4. 根据权利要求1所述的激光器控温方法，其特征在于对激光器本体和激光头实施单独温度控制。The laser temperature control method according to claim 1, characterized in that the laser body and the laser head are individually temperature controlled.
  5. 一种机加工设备，其特征在于包括权利要求1所述的激光器控温方法。A kind of machining equipment, characterized in that it comprises the laser temperature control method described in claim 1.
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