JP2015148399A - Temperature regulation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To control a temperature regulation object to desired temperature with higher accuracy.SOLUTION: A first flow rate regulating valve 11 for regulating a flow amount of a refrigerant is provided in a refrigerant flow passage 10. A heat exchanger 30 is provided between a portion on a further downstream side than the first flow rate regulating valve 11 of the refrigerant flow passage 10 and a part of a first heating medium circulation passage 20 for circulating a heating medium. A second heating medium circulation passage 40 is connected to the portion on the downstream side of the heat exchanger 30 of the first heating medium circulation passage 20 by a first connection passage 50. In the first connection passage 50, a second flow rate regulating valve 51 is provided for regulating a flow amount of the heating medium from the first heating medium circulation passage 20 to the second heating medium circulation passage 40. Opening of the first flow rate regulating valve 11 is controlled based on the detection result of a first temperature sensor 24 on the downstream side of the heat exchanger 30 of the first heating medium circulation passage 20. Also, a heater 41 is provided in the second heating medium circulation passage 40, and opening of the second flow rate regulating valve 51 is controlled based on the detection result of a second temperature sensor 44 on an upstream side of the heater 41.

Description

  The present invention relates to a temperature control device that controls a temperature adjustment target to a desired temperature by supplying a temperature-controlled heat medium to a load circuit in which the temperature adjustment target (work) is installed.

  In manufacturing processes of semiconductors, liquid crystal display panels, and photovoltaic power generation panels, it may be required to control a temperature adjustment object (work) such as a wafer or a panel to a desired constant temperature in a high temperature region. is there. For example, in a thin film processing process in a photovoltaic power generation panel, it may be required to control the panel, which is a temperature adjustment target, at a constant temperature in a high temperature region exceeding 200 ° C.

  As a device for controlling the temperature of the temperature adjustment object, a temperature control device using a heat medium (for example, brine) has been conventionally used. The temperature control device supplies the temperature-adjusted heat medium to a load circuit in which the temperature adjustment object is installed, and controls the temperature adjustment object to a desired temperature. Various types of such temperature control devices have been conventionally proposed (for example, Patent Documents 1 to 3).

Japanese Patent No. 2796955 JP 2002-22327 A JP 2000-88420 A

  However, any of the devices disclosed in Patent Documents 1 to 3 has room for improvement in accuracy regarding temperature control.

  The present invention has been created based on the above findings. An object of the present invention is to provide a temperature control device that can control a temperature adjustment object to a desired temperature with higher accuracy.

  The present invention provides a refrigerant flow path through which a refrigerant flows, a first flow rate adjustment valve that is provided in the refrigerant flow path and adjusts the flow rate of the refrigerant, and a first heat medium circulation that circulates the heat medium. Cooling of the heat medium by the refrigerant between the passage, a part of the refrigerant flow path on the downstream side of the first flow rate adjustment valve, and a part of the first heat medium circulation path A heat exchanger that circulates, a second heat medium circuit that circulates the heat medium, a part of the first heat medium circuit that is downstream of the part, and the second heat medium circuit And a heater that heats the heat medium, provided at a site downstream of a connection position with the first connection path of the second heat medium circulation path. A load circuit provided at a downstream side of the heater in the second heat medium circulation path, where a temperature adjustment target is installed; The downstream part of the connection position with the first connection path in the first heat medium circulation path, the downstream end of the heater or the heater in the second heat medium circulation path A second connection path connecting the downstream side and the upstream side of the load circuit, and the second connection from the first heat medium circulation path provided in the first connection path A second flow rate adjusting valve that adjusts the flow rate of the heat medium into the passage, and a downstream of the part of the first heat medium circulation path and a connection position of the first connection path. The first temperature sensor for detecting the temperature of the heat medium flowing through the upstream portion and the downstream side of the connection position of the first connection path in the second heat medium circulation path and the heating A second temperature sensor for detecting the temperature of the heat medium flowing through the upstream portion of the vessel, and a detection result of the first temperature sensor And a second flow control device for controlling the opening of the second flow rate adjustment valve based on a detection result of the second temperature sensor. And a temperature control device characterized by comprising:

  According to the present invention, the first flow rate control device controls the first flow rate adjustment valve based on the detection result of the first temperature sensor to adjust the flow rate of the refrigerant on the heat exchanger side in the refrigerant flow channel. In addition, the second flow rate control device controls the second flow rate adjustment valve based on the detection result of the second temperature sensor, and heat from the first heat medium circuit to the second heat medium circuit. By adjusting the flow rate of the medium, it is possible to supply a heat medium that is controlled to be cooled with high accuracy to the heater at a flow rate that is adjusted with high accuracy. Thereby, the heater can control the heat medium to the target temperature with higher accuracy. As a result, the temperature adjustment object can be controlled to a desired temperature with higher accuracy.

  For example, the first flow rate control device is configured so that the temperature of the heat medium in the first heat medium circuit is a predetermined constant temperature based on a detection result of the first temperature sensor. 1 Opening of the flow rate adjusting valve is controlled.

  According to this, the heat medium in the first heat medium circulation path is controlled to a predetermined constant temperature, whereby the heat medium before heating by the heater (the heat medium in the first connection path is the second heat medium). It is easy to control the temperature of the heat medium in the heat medium circuit.

  Preferably, the present invention provides a third temperature for detecting a temperature of the heat medium flowing through a portion of the second heat medium circuit that is downstream of the heater and upstream of the load circuit. And a temperature control device for adjusting a heating amount of the heater to the heat medium based on a detection result of the third temperature sensor.

  According to this, the heater can control the heat medium to the target temperature with higher accuracy. As a result, the temperature adjustment object can be controlled to a desired temperature with higher accuracy.

  According to the present invention, the first flow rate control device controls the first flow rate adjustment valve based on the detection result of the first temperature sensor to adjust the flow rate of the refrigerant on the heat exchanger side in the refrigerant flow channel. In addition, the second flow rate control device controls the second flow rate adjustment valve based on the detection result of the second temperature sensor, and heat from the first heat medium circuit to the second heat medium circuit. By adjusting the flow rate of the medium, it is possible to supply a heat medium that is controlled to be cooled with high accuracy to the heater at a flow rate that is adjusted with high accuracy. Thereby, the heater can control the heat medium to the target temperature with higher accuracy. As a result, the temperature adjustment object can be controlled to a desired temperature with higher accuracy.

It is a systematic diagram of the temperature control apparatus of one embodiment of this invention. It is the figure which showed the table | surface explaining the specific example (Example 1) of operation | movement at the time of the temperature control apparatus of one embodiment of this invention cooling a temperature control target object. It is the figure which showed the table | surface explaining the specific example (Example 2) of operation | movement at the time of the temperature control apparatus of one embodiment of this invention heating a temperature control target object.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is a system diagram of a temperature control apparatus 100 according to an embodiment of the present invention. As shown in FIG. 1, the temperature control device 100 includes a refrigerant flow path 10 through which a refrigerant flows, and a first flow rate adjustment valve 11 that is provided in the refrigerant flow path 10 and adjusts the flow rate of the refrigerant. I have. Further, the temperature control device 100 includes a first heat medium circulation path 20 that circulates the heat medium, a part of the refrigerant flow path 10 on the downstream side of the first flow rate adjustment valve 11, and the first heat medium circulation. And a heat exchanger 30 that enables cooling of the heat medium with the refrigerant between a part of the passage 20.

  Furthermore, the temperature control apparatus 100 includes the second heat medium circulation path 40 that circulates the heat medium and the part of the first heat medium circulation path 20 (the heat medium is cooled by the refrigerant in the heat exchanger 30). Downstream of the connection position of the first connection path 50 that connects the second part of the second heat medium circuit 40 and the second heat medium circuit 40. A heater 41 that heats the heat medium provided at the site on the side, and a temperature adjustment object (work such as a panel) provided at a site downstream of the heater 41 in the second heat medium circuit 40 Second connection path that connects the downstream portion of the heater 41 and the downstream portion of the connection position of the load circuit 42 to be connected to the first connection path 50 of the first heat medium circulation path 20 60 and the second heat medium circulation path 4 from the first heat medium circulation path 20 provided in the first connection path 50. A second flow control valve 51 for adjusting the through flow of the heat medium to the inner, and a.

  As shown in FIG. 1, the refrigerant flow path 10 is connected to a refrigerator 12. In the refrigerant flow path 10, the refrigerant cooled by the refrigerator 12 is supplied to the first flow rate adjustment valve 11 by a drive source (not shown) such as a pump. The refrigerant supplied to the first flow rate adjusting valve 11 flows through the first flow rate adjusting valve 11 according to the opening degree of the first flow rate adjusting valve 11 and is supplied to the heat exchanger 30 side. The refrigerant flowing through the heat exchanger 30 returns to the refrigerator 12.

  As shown in FIG. 1, the first heat medium circulation path 20 is provided with a tank 22 and a pump 23 immersed in the tank 22. By driving the pump 23, the heat medium in the first heat medium circuit 20 is circulated and moved. The heat medium that circulates and moves in the first heat medium circulation path 20 flows through the heat exchanger 30. A part of the heat medium after flowing through the heat exchanger 30 also flows to the first connection path 50 side. That is, if the second flow rate adjustment valve 51 is opened, the heat medium in the first heat medium circulation path 20 flows into the second heat medium circulation path 40. In this case, based on the balance of the pressure or flow rate of the heat medium in the first heat medium circuit 20 and the second heat medium circuit 40, the second heat medium circuit 40 passes through the second connection line 60. The heat medium is returned to the first heat medium circulation path 20. Specifically, the heat medium in the second heat medium circulation path 40 is passed through the second connection path 60 to the first heat medium circulation path 20 at a flow rate proportional to the opening of the second flow rate adjustment valve 51. It is supposed to be returned.

  Further, the temperature control device 100 of the present embodiment is a downstream side of the part of the first heat medium circulation path 20 (the portion where the heat medium is cooled by the refrigerant in the heat exchanger 30). The 1st temperature sensor 24 which detects the temperature of the heat carrier which flows through the site | part upstream of the connection position with the 1 connection path 50 is provided.

  Further, the first heat medium circulation path 20 has a connection position downstream of the connection position with the first connection path 50 in the first heat medium circulation path 20 and the connection position with the second connection path 60. A relief valve 25 that allows only the flow of the heat medium from the upstream side to the downstream side is provided in the upstream portion. The relief valve 25 opens more greatly as the pressure of the heat medium flowing through the first heat medium circuit 20 is higher.

  Here, the first flow rate control device 70 that controls the opening degree of the first flow rate adjustment valve 11 based on the detection result of the first temperature sensor 24 is electrically connected to the first temperature sensor 24 and the first flow rate adjustment valve 11. Connected. Based on the detection result of the first temperature sensor 24, the first flow control device 70 of the present embodiment is configured so that the temperature of the heat medium in the first heat medium circuit 20 becomes a predetermined constant temperature. The opening degree of the first flow rate adjusting valve 11 is controlled.

  As shown in FIG. 1, the second heat medium circulation path 40 has a pump 43 for circulating the heat medium in the second heat medium circulation path 40 in a portion between the heater 41 and the load circuit 42. have. By driving the pump 43, the heat medium in the second heat medium circuit 40 is circulated and moved. The heat medium that circulates in the second heat medium circulation path 40 flows through the load circuit 42. The load circuit 42 may have a separate configuration that can be separated from other parts of the temperature control device 100.

  Further, the second heat medium circulation path 40 flows through a portion downstream of the connection position with the first connection path 50 in the second heat medium circulation path 40 and upstream of the heater 41. A second temperature sensor 44 that detects the temperature of the heat medium to be heated, and a heat medium that flows through a portion of the second heat medium circuit 40 that is downstream of the heater 41 and upstream of the load circuit 42 And a third temperature sensor 45 for detecting the temperature of.

  Here, the second flow rate control device 71 that controls the opening degree of the second flow rate adjustment valve 51 based on the detection result of the second temperature sensor 44 is electrically connected to the second temperature sensor 44 and the second flow rate adjustment valve 51. Connected. The third temperature sensor 45 and the heater 41 are electrically connected to a temperature control device 72 that adjusts the heating amount of the heater 41 with respect to the heat medium based on the detection result of the third temperature sensor 45. Yes. In the present embodiment, the heater 41 has a configuration in which three heater main bodies 41A to 41C are connected in series, and the temperature control device 72 is separately provided for each of the heater main bodies 41A to 41C. Is provided to control each of the heater main bodies 41A to 41C.

  In the present embodiment, water is used as the refrigerant flowing through the refrigerant flow path 10. On the other hand, Galden (registered trademark) VB50H manufactured by Solvay Solexis is used as the heat medium circulating through the first heat medium circuit 20 and the second heat medium circuit 40 in the present embodiment.

Next, the effect | action of the temperature control apparatus 100 of this Embodiment is demonstrated.
When starting the operation of the temperature control device 100, first, the refrigerator 12 is driven to start cooling the refrigerant. Then, when the temperature of the refrigerant is cooled to a desired temperature, that is, 15 to 25 ° C. in the present embodiment, a driving source (not shown) is driven in the refrigerant flow path 10 and is cooled by the refrigerator 12. Begins to be supplied to the first flow control valve 11. At this time, the first flow rate control device 70 opens the first flow rate adjustment valve 11 at a low opening, and the refrigerant cooled by the refrigerator 12 starts to be supplied to the heat exchanger 30 side. On the other hand, in the first heat medium circulation path 20, the pump 23 is driven, and the heat medium in the first heat medium circulation path 20 (25 ° C. in the initial state of the present embodiment) starts circulating. Further, the pump 43 is driven in the second heat medium circulation path 40, and the heat medium in the second heat medium circulation path 40 (25 ° C. in the initial state of the present embodiment) starts to circulate (see FIG. 2 and FIG. 2). The “operation start” state in FIG.

  In this state, the second flow rate control device 71 opens the second flow rate adjustment valve 51 at a medium opening degree, and the heat medium in the first heat medium circulation path 20 passes through the first connection path 50 to generate the second heat. It flows into the medium circulation path 40. Accordingly, the heat medium in the second heat medium circulation path 40 passes through the second connection path 60 at a flow rate proportional to the opening degree (medium opening degree) of the second flow rate adjustment valve 51. Returned to the first heat medium circuit 20. When such heat medium flows (circulates and moves), if air is mixed in each heat medium circulation path 20, 40 or each connection path 50, 60, a known valve mechanism (not shown) is shown. It is discharged appropriately through This operation state is called an air bleeding operation (an “air bleeding operation” state in FIGS. 2 and 3).

  When air is not mixed in each heat medium circulation path 20, 40 or each connection path 50, 60, or after the mixed air is sufficiently exhausted by the air bleeding operation, the first flow rate adjustment valve 11. And the 2nd flow regulating valve 51 is closed again.

  From this state, heating of the heat medium is started. First, the case where the temperature of the heat medium supplied to the load circuit 42 is controlled to 100 ° C. will be described (Example 1: FIG. 2). Initially, since the temperature of the heat medium is considered to be about room temperature (about 25 ° C.), the heater 41 is in a state of heating the heat medium with a high heating amount (the “heating” state in FIG. 2).

  And when reaching | attaining 100 degreeC which is target temperature, the heater 41 is switched to the state which heats a heat medium with low heating amount.

  Furthermore, in the present embodiment, the first flow rate adjustment valve 11 and the second flow rate adjustment valve 51 are opened at a low opening degree in advance in order to improve the accuracy of temperature control of a temperature adjustment target to be described later. Thereby, in the refrigerant flow path 10, the refrigerant flows through the heat exchanger 30, and the heat medium in the first heat medium circulation path 20 is cooled. Then, the cooled heat medium flows into the second heat medium circulation path 40 through the first connection path 50. As a result, a heating medium having a temperature lower than the target temperature of 100 ° C., specifically a heating medium having reached 98 ° C., flows through the heater 41. And the heater 41 heats such a heat medium with a low heating amount, and again controls it to 100 degreeC which is target temperature. This operation state is called idling operation. In the present embodiment, during the idling operation, the temperature of the heat medium in the first heat medium circuit 40 is maintained at 42 ° C. (“temperature reached, being controlled (1)” state in FIG. 2).

  In this idling operation state, the temperature adjustment object is installed in the load circuit 42 of the second heat medium circuit 40. Here, the temperature of the temperature adjustment object has a tendency to be higher than 100 ° C., and an aspect in which the temperature of the temperature adjustment object having such a tendency is controlled to be 100 ° C. will be described. In this case, when the temperature adjustment object is installed in the load circuit 42 of the second heat medium circuit 40, the heat medium after flowing through the load circuit 42 changes to a temperature exceeding 100 ° C. Thereby, the detection temperature of the 2nd temperature sensor 44 which detects the temperature of a heat medium becomes the temperature which exceeds 100 degreeC. On the basis of this, the second flow rate control device 71 increases the opening degree of the second flow rate adjustment valve 51 (high opening degree), and the second heat medium circulation path 40 from the first heat medium circulation path 20. The flow rate of the heat medium into the inside is increased. Thereby, the temperature of the heat medium supplied to the heater 41 is slightly lower than the target temperature of 100 ° C., despite the temperature variation of the heat medium due to the setting of the temperature adjustment object. Specifically, it is stably adjusted with high accuracy so that the temperature becomes 98 ° C.

  Here, as the second flow rate adjustment valve 51 is opened, the heat medium in the second heat medium circulation path 40 is transferred from the heater 41 at a flow rate proportional to the opening of the second flow rate adjustment valve 51. It is returned to the first heat medium circulation path 20 through the second connection path 60. For this reason, the temperature of the heat medium in the first heat medium circuit 20 varies. That is, the detected temperature of the first temperature sensor 24 that detects the temperature of the heat medium in the first heat medium circuit 20 increases. Accordingly, in the present embodiment, the first flow rate control device 70 increases the opening degree of the first flow rate adjustment valve 11 (assuming a high opening degree), and the refrigerant flow rate in the refrigerant flow path 10 is increased. Increase. As a result, the heat medium in the first heat medium circulation path 20 is always stable to about 42 ° C. by the refrigerant in the heat exchanger 30 despite the temperature variation of the heat medium due to the setting of the temperature adjustment target. The cooling is controlled. As a result, the heat medium in the first heat medium circulation path 20 whose temperature is controlled with high accuracy in this way flows into the second heat medium circulation path 40, so that the temperature of the heater 41 is accurately determined. It is easy to supply a controlled heat medium (“temperature reached, being controlled (2)” state in FIG. 2).

  As described above, according to the temperature control device 100 of the present embodiment, the first flow rate control device 70 controls the first flow rate adjustment valve 11 based on the detection result of the first temperature sensor 24, and the refrigerant flow path. 10, the second flow rate controller 71 controls the second flow rate adjustment valve 51 on the basis of the detection result of the second temperature sensor 44 to adjust the flow rate of the refrigerant on the heat exchanger 30 side in the first flow rate. By adjusting the flow rate of the heat medium from the inside of the heat medium circuit 20 to the second heat medium circuit 40, the heat medium controlled to be cooled to 42 ° C. with high accuracy is supplied to the heater 41. The flow rate can be adjusted with high precision. Thereby, the heater 41 can control the heat medium to the target temperature of 100 ° C. with higher accuracy. As a result, the temperature adjustment object can be controlled to a desired temperature of 100 ° C. with higher accuracy.

  Moreover, in the temperature control apparatus 100 of this Embodiment, the 1st flow control apparatus 70 is based on the detection result of the 1st temperature sensor 24, and the temperature of the heat medium in the 1st heat-medium circulation path 20 is predetermined. The opening degree of the first flow rate adjusting valve 11 is controlled so as to be a constant temperature (that is, 42 ° C.). For this reason, the temperature of the heat medium before heating by the heater 41 (the heat medium in the first connection path 50 merged with the heat medium in the second heat medium circulation path 40) is constant (that is, 98 ° C.). ) Easily controlled.

  In addition, the temperature control device 100 of the present embodiment adjusts the temperature of the heat medium flowing through the portion of the second heat medium circuit 40 downstream of the heater 41 and upstream of the load circuit 42. A third temperature sensor 45 to be detected, and a temperature control device 72 that adjusts the heating amount of the heater 41 with respect to the heat medium based on the detection result of the third temperature sensor 45 are further provided. For this reason, the heater 41 can control the heat medium to the target temperature with higher accuracy, and as a result, can control the temperature adjustment object to the desired temperature with higher accuracy.

  Next, a case where the temperature of the heat medium supplied to the load circuit 42 is controlled to 250 ° C. after the air bleeding operation (Example 2: FIG. 3) will be described. Since the operation for starting operation and the operation for air bleeding operation are the same as those in the first embodiment (FIG. 2), description thereof is omitted. Also in the case of Example 2, since the temperature of the heat medium is initially considered to be about room temperature (about 25 ° C.), the heater 41 is in a state of heating the heat medium with a high heating amount (see “ "Heating" state).

  And when reaching | attaining 250 degreeC which is target temperature, the heater 41 is switched to the state which heats a heat medium with a low heating amount.

  Further, as in the first embodiment, the first flow rate adjustment valve 11 and the second flow rate adjustment valve 51 are opened at a low opening degree in advance in order to improve the accuracy of temperature control of the temperature adjustment object. Thereby, in the refrigerant flow path 10, the refrigerant flows through the heat exchanger 30, and the heat medium in the first heat medium circulation path 20 is cooled. Then, the cooled heat medium flows into the second heat medium circulation path 40 through the first connection path 50. As a result, a heating medium that has become lower than the target temperature of 250 ° C., specifically a heating medium that has reached about 248 ° C., flows through the heater 41. And the heater 41 heats such a heat medium with a low heating amount, and again controls it to 250 degreeC which is target temperature. This operation state is called idling operation. In the present embodiment, during the idling operation, the temperature of the heat medium in the first heat medium circuit 40 is maintained at 42 ° C. (“temperature reached, being controlled (1)” state in FIG. 3).

  Strictly speaking, in the present embodiment, the “low opening degree” of the second flow rate adjustment valve 51 in the idling operation at 250 ° C. is more than the “low opening degree” of the second flow rate adjustment valve 51 in the idling operation at 100 ° C. , Lower opening. The reason will be briefly described below.

  That is, regardless of the temperature condition, in the idling operation state, the heat generation amount in the second heat medium circuit 40 is the heat amount of the pump 43 (for example, 0.5 kW) and the heat amount by fine adjustment of the heater 41 ( For example, the amount of heat is 1.0 kW). Therefore, in order to maintain the temperature in the idling operation, it is necessary to perform cooling corresponding to this amount of heat (for example, 1.5 kW). For this purpose, the second heat medium circulation is achieved by flowing the heat medium at 42 ° C. in the first heat medium circulation path 20 from the second flow rate adjusting valve 51 into the second heat medium circulation path 40. The heat medium in the passage 40 is cooled.

Specifically, when the heat generation amount in the second heat medium circuit 40 is 1.5 kW, the specific heat of the heat medium is c, and the density of the heat medium is ρ, the second heat medium circuit The flow rate (L / sec) of the heat medium at 42 ° C. in the first heat medium circuit 20 to be flowed to 40 satisfies the following formula.
1.5 kW = flow rate × c × ρ × (temperature in the second heat medium circuit 40 of the heat medium−42 ° C.)
Therefore,
When the temperature of the heat medium in the second heat medium circuit 40 is 100 ° C .:
1.5 kW = flow rate × c × ρ × (100 ° C.−42 ° C.) = Flow rate × c × ρ × (58 ° C.)
Therefore, flow rate = 1.5 kW / c × ρ × (58 ° C.),
When the temperature of the heat medium in the second heat medium circuit 40 is 250 ° C .:
1.5 kW = flow rate × c × ρ × (250 ° C.−42 ° C.) = Flow rate × c × ρ × (208 ° C.)
Therefore, the flow rate is 1.5 kW / c × ρ × (208 ° C.).

  That is, the flow rate of the heat medium in the first heat medium circulation path 20 for performing the cooling corresponding to the heat generation amount of 1.5 kW in the second heat medium circulation path 40 is equal to that in the idling operation at 100 ° C. However, it is more than the idling operation at 250 ° C.

  In this idling operation state, the temperature adjustment object is installed in the load circuit 42 of the second heat medium circulation path 40. Here, the temperature of the temperature adjustment object has a tendency to be lower than 250 ° C., and a mode in which the temperature of the temperature adjustment object having such a tendency is controlled to 250 ° C. will be described. In this case, when a temperature adjustment object is installed in the load circuit 42 of the second heat medium circuit 40, the heat medium after flowing through the load circuit 42 changes to a temperature lower than 250 ° C. Thereby, the temperature detected by the second temperature sensor 44 that detects the temperature of the heat medium becomes a temperature lower than 250 ° C. (in this example, it is about 248 ° C.). Based on this, the second flow rate control device 71 closes the second flow rate adjustment valve 51 to change the flow rate of the heat medium from the first heat medium circulation path 20 to the second heat medium circulation path 40. Set to 0 (stop the flow). Thereby, the temperature of the heat medium supplied to the heater 41 is adjusted so as not to be lower than necessary than the target temperature of 250 ° C.

  Here, as the second flow rate adjustment valve 51 is closed, the heat medium in the second heat medium circulation path 40 returns from the heater 41 to the first heat medium circulation path 20 through the second connection path 60. It will not be done. For this reason, although the temperature of the heat medium in the first heat medium circuit 20 does not basically fluctuate, the first flow control device 70 sets the opening of the first flow control valve 11 to a low opening or a closed state. Control appropriately. Thus, the heat medium in the first heat medium circuit 20 is stably cooled and controlled to about 42 ° C. at all times by the refrigerant in the heat exchanger 30. For this reason, when it becomes necessary to flow the heat medium in the first heat medium circuit 20 into the second heat medium circuit 40, the cooling medium in the first heat medium circuit 20 controlled to be cooled is used. The heat medium (42 ° C. in the present embodiment) can be immediately passed through the second heat medium circuit 40. As a result, the heat medium in the first heat medium circulation path 20 that is temperature-controlled with high accuracy in this way can flow into the second heat medium circulation path 40, so that the temperature of the heater 41 can be accurately determined. It is easy to supply a controlled heat medium (“temperature reached, being controlled (2)” state in FIG. 3).

  As described above, according to the temperature control device 100 of the present embodiment, the first flow rate control device 70 controls the first flow rate adjustment valve 11 based on the detection result of the first temperature sensor 24, and the refrigerant flow path. 10, the second flow rate controller 71 controls the second flow rate adjustment valve 51 based on the detection result of the second temperature sensor, and adjusts the first flow rate of the refrigerant on the heat exchanger 30 side. By adjusting the flow rate of the heat medium from the heat medium circuit 20 to the second heat medium circuit 40, the heat medium that is controlled to be cooled to 42 ° C. with high accuracy as needed is heated by the heater 41. On the other hand, it can supply with the flow volume adjusted with high precision. Thereby, the heater 41 can control a heat medium to 250 degreeC which is target temperature with higher precision. As a result, the temperature adjustment object can be controlled to a desired temperature of 250 ° C. with higher accuracy.

  Moreover, in the temperature control apparatus 100 of this Embodiment, the 1st flow control apparatus 70 is based on the detection result of the 1st temperature sensor 24, and the temperature of the heat medium in the 1st heat-medium circulation path 20 is predetermined. The opening degree of the first flow rate adjusting valve 11 is controlled so as to be a constant temperature (that is, 42 ° C.). For this reason, when supplying the heating medium to the heater 41 with high precision cooling controlled to 42 ° C. as necessary, the heating medium before heating in the heater 41 (heat in the first connection path 50). The temperature of the medium joined with the heat medium in the second heat medium circuit 40 can be easily controlled to a constant temperature (ie, 248 ° C.).

  In addition, the temperature control device 100 of the present embodiment adjusts the temperature of the heat medium flowing through the portion of the second heat medium circuit 40 downstream of the heater 41 and upstream of the load circuit 42. A third temperature sensor 45 to be detected, and a temperature control device 72 that adjusts the heating amount of the heater 41 with respect to the heat medium based on the detection result of the third temperature sensor 45 are further provided. For this reason, the heater 41 can control the heat medium to the target temperature with higher accuracy, and as a result, can control the temperature adjustment object to the desired temperature with higher accuracy.

  FIG. 2 shows a table showing the state of each part of the temperature control device 100 for each operation when the temperature adjustment target is cooled to 100 ° C., and FIG. The table | surface which shows the state of each part of the temperature control apparatus 100 for every operation | movement at the time of heating to degreeC is shown.

  2 and 3, the closed state of the first flow rate adjusting valve 11 and the second flow rate adjusting valve 51 is indicated by “Close”, and the open state at a low opening is “Low” or “ “Very Low” (“Low”> “Very Low”), the state opened at medium opening is indicated by “Medium”, and the state opened at high opening is indicated by “High”. . The state where the heater 41 is stopped is indicated by “Off”, the case of heating at a low heating amount is indicated by “Low”, the case of heating at a medium heating amount is indicated by “Medium”, and the high heating amount is indicated by “High”. The case of heating with a heating amount is indicated by “High”.

DESCRIPTION OF SYMBOLS 10 Refrigerant flow path 11 1st flow regulating valve 12 Refrigerator 20 1st heat medium circuit 21 Heat exchanger 22 Tank 23 Pump 24 1st temperature sensor 25 Relief valve 30 Heat exchanger 40 2nd heat medium circuit 41 Heater 42 Load circuit 44 2nd temperature sensor 45 3rd temperature sensor 50 1st connection path 51 2nd flow regulating valve 60 2nd connection path 70 1st flow control apparatus 71 2nd flow control apparatus 72 Temperature control apparatus 100 Temperature Device

Claims (3)

A refrigerant flow path through which the refrigerant flows;
A first flow rate adjustment valve that is provided in the refrigerant flow path and adjusts the flow rate of the refrigerant;
A first heat medium circuit for circulating the heat medium;
Heat exchange enabling cooling of the heat medium by the refrigerant between a part of the refrigerant flow path on the downstream side of the first flow rate adjusting valve and a part of the first heat medium circulation path. And
A second heat medium circuit for circulating the heat medium;
A first connection path connecting the downstream part of the part of the first heat medium circulation path and the second heat medium circulation path;
A heater that is provided at a site downstream of the connection position with the first connection path in the second heat medium circulation path, and that heats the heat medium;
A load circuit provided at a site downstream of the heater in the second heat medium circulation path, where a temperature adjustment object is installed;
The downstream part of the connection position with the first connection path in the first heat medium circulation path, the downstream end of the heater, or the heater in the second heat medium circulation path. A second connection path for connecting the downstream side of the load circuit and the upstream side portion of the load circuit;
A second flow rate adjusting valve that is provided in the first connection path and adjusts the flow rate of the heat medium from the first heat medium circuit to the second heat medium circuit;
A first temperature sensor that detects a temperature of the heat medium that flows through a portion of the first heat medium circulation path downstream of the part and upstream of the connection position with the first connection path. When,
A second temperature sensor that detects the temperature of the heat medium that flows downstream from the connection position with the first connection path in the second heat medium circulation path and flows through the upstream portion of the heater. When,
A first flow rate control device for controlling an opening degree of the first flow rate adjustment valve based on a detection result of the first temperature sensor;
A second flow rate control device for controlling an opening degree of the second flow rate adjustment valve based on a detection result of the second temperature sensor;
A temperature control device characterized by comprising: The first flow rate controller controls the first flow rate so that the temperature of the heat medium in the first heat medium circuit becomes a predetermined constant temperature based on a detection result of the first temperature sensor. The temperature control device according to claim 1, wherein the opening degree of the regulating valve is controlled. A third temperature sensor for detecting a temperature of the heat medium flowing through a portion of the second heat medium circulation path downstream of the heater and upstream of the load circuit;
A temperature control device that adjusts a heating amount of the heating medium for the heating medium based on a detection result of the third temperature sensor;
The temperature control device according to claim 1, further comprising:

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