JP2024088829A - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

Info

Publication number
JP2024088829A
JP2024088829A JP2022203816A JP2022203816A JP2024088829A JP 2024088829 A JP2024088829 A JP 2024088829A JP 2022203816 A JP2022203816 A JP 2022203816A JP 2022203816 A JP2022203816 A JP 2022203816A JP 2024088829 A JP2024088829 A JP 2024088829A
Authority
JP
Japan
Prior art keywords
groove
semiconductor layer
main surface
crystal
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022203816A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024088829A5 (https=
Inventor
孝仁 大島
Takahito Oshima
祐一 大島
Yuichi Oshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute for Materials Science
Original Assignee
National Institute for Materials Science
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Institute for Materials Science filed Critical National Institute for Materials Science
Priority to JP2022203816A priority Critical patent/JP2024088829A/ja
Publication of JP2024088829A publication Critical patent/JP2024088829A/ja
Publication of JP2024088829A5 publication Critical patent/JP2024088829A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
JP2022203816A 2022-12-21 2022-12-21 半導体装置およびその製造方法 Pending JP2024088829A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022203816A JP2024088829A (ja) 2022-12-21 2022-12-21 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022203816A JP2024088829A (ja) 2022-12-21 2022-12-21 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2024088829A true JP2024088829A (ja) 2024-07-03
JP2024088829A5 JP2024088829A5 (https=) 2025-11-18

Family

ID=91690405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022203816A Pending JP2024088829A (ja) 2022-12-21 2022-12-21 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP2024088829A (https=)

Similar Documents

Publication Publication Date Title
US7411274B2 (en) Silicon semiconductor substrate and its manufacturing method
JP4695824B2 (ja) 半導体ウエハの製造方法
JP7191322B2 (ja) 半導体基板の製造方法
WO2012017958A9 (ja) 半導体装置の製造方法
WO2013038862A1 (ja) 炭化珪素半導体装置の製造方法
CN103943563B (zh) 形成包含垂直纳米线的半导体结构的方法
JP5999687B2 (ja) SiCエピタキシャルウエハおよびそれを用いたSiC半導体素子
US11721721B2 (en) Germanium nitride layers on semiconductor structures, and methods for forming the same
JP2013069964A (ja) 炭化珪素半導体装置
JP7785399B2 (ja) 半導体装置、その用途、およびその製造方法
TW201725734A (zh) 鑽石電子元件
US20170047415A1 (en) Silicon carbide semiconductor device and method for manufacturing same
JP4152130B2 (ja) エピタキシャル膜の製造方法およびエピタキシャル膜被覆基板の製造方法
WO2013094287A1 (ja) 半導体装置
JP5682098B2 (ja) ウェル構造,その形成方法および半導体デバイス
JP5921089B2 (ja) エピタキシャルウエハの製造方法及び半導体装置の製造方法
JP2024088829A (ja) 半導体装置およびその製造方法
JP5055687B2 (ja) 半導体ウエハの製造方法
US11830915B2 (en) Nitride semiconductor device
US10103232B2 (en) Semiconductor device and method for manufacturing semiconductor device
JP6743933B2 (ja) 半導体装置
TW202517066A (zh) 半導體裝置及其形成方法
JP6707927B2 (ja) 炭化珪素半導体装置の製造方法
WO2025018165A1 (ja) n型ダイヤモンドMOSFETおよびその製造方法
CN114141622A (zh) 一种gaafet氮化镓场效应晶体管的制备方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251110

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20251110