JP2024087682A - Semiconductor manufacturing device, pickup device, and method for manufacturing semiconductor device - Google Patents

Abstract

To provide technology with which it is possible to reduce die crack defects and chipping defects.SOLUTION: A semiconductor manufacturing device comprises: a push-up unit having a wafer holding table that holds die-pasted dicing tape, a plurality of blocks that come into contact with the dicing tape, a plurality of drive shafts that convey vertical movement to the plurality of blocks independently of each other, a plurality of plunger mechanisms that convey vertical movement to the plurality of drive shafts independently of each other, and a plurality of displacement meters for measuring the respective heights of the plurality of blocks; and a control part that controls the push-up unit. The plurality of displacement meters are disposed to the plurality of blocks or the plurality of drive shafts or the plurality of plunger mechanisms.SELECTED DRAWING: Figure 6

Description

This disclosure relates to semiconductor manufacturing equipment and is applicable, for example, to a die bonder having a push-up unit.

Semiconductor manufacturing equipment such as die bonders is equipment that uses a bonding material to bond (place and adhere) an element onto a substrate or other elements. The bonding material is, for example, liquid or film-like resin or solder. The element is, for example, a die or electronic component such as a semiconductor chip, a MEMS (Micro Electro Mechanical System), or a glass chip. The substrate is, for example, a wiring board, a lead frame formed from a thin metal plate, a glass substrate, etc.

For example, the die bonding process using a die bonder includes a peeling process in which dies separated from a semiconductor wafer (hereinafter simply referred to as a wafer) are peeled off from the dicing tape. In the peeling process, for example, the dies are pushed up from the back surface of the dicing tape by a push-up unit, peeled off one by one from the dicing tape held in the wafer supply unit, and the dies are picked up using a suction nozzle such as a collet provided on the pickup head or bond head.

For example, according to JP 2017-224640 A (Patent Document 1), when a die to be peeled out of multiple dies attached to a dicing tape is pushed up and peeled off from the dicing tape, the push-up unit uses multiple drive shafts to move multiple blocks up and down to peel off the dicing tape from around the die.

JP 2017-224640 A

Since the multiple drive shafts are moved up and down by multiple drive units (e.g., plunger mechanisms), if the drive units have low rigidity, the height (position) of the multiple blocks may fluctuate depending on the load. Alternatively, there may be a misalignment in the height (position) between the multiple blocks. Any of these can cause the die to crack or chip.

The objective of the present disclosure is to provide a technology that can reduce die cracking and chipping defects. Other objectives and novel features will become apparent from the description of this specification and the accompanying drawings.

A brief summary of representative aspects of this disclosure is given below.
That is, the semiconductor manufacturing apparatus includes a wafer holder that holds a dicing tape having a die attached thereto, a plurality of blocks that come into contact with the dicing tape, a plurality of drive shafts that transmit vertical motions independently to the plurality of blocks, a plurality of plunger mechanisms that transmit vertical motions independently to the plurality of drive shafts, and a plurality of displacement gauges for measuring the heights of the plurality of blocks, and a control unit that controls the thrust unit. The plurality of displacement gauges are provided on the plurality of blocks, the plurality of drive shafts, or the plurality of plunger mechanisms.

This disclosure makes it possible to reduce die cracking and chipping defects.

FIG. 1 is a schematic top view showing an example of the configuration of a die bonder according to an embodiment. FIG. 2 is a diagram for explaining the schematic configuration when viewed in the direction of the arrow A in FIG. FIG. 3 is a schematic cross-sectional view showing a main part of the wafer supply unit shown in FIG. FIG. 4 is a block diagram showing a schematic configuration of a control system of the die bonder shown in FIG. FIG. 5 is a flow chart showing a method for manufacturing a semiconductor device using the die bonder shown in FIG. FIG. 6 is a vertical cross-sectional view of the push-up unit in the embodiment. FIG. 7 is a vertical sectional view of another thrust-up unit shown in FIG. FIG. 8 is a top view of a portion of the first unit shown in FIG. FIG. 9 is a cross-sectional view of a portion of the second unit taken along line EE shown in FIG. FIG. 10 is a top view of a portion of the third unit shown in FIG. FIG. 11 is a block diagram showing the motor and the motor control device of the thrust-up unit. 12(a) to 12(d) are cross-sectional views of a thrust-up unit showing an example of a thrust-up sequence of an RMS, where Fig. 12(a) is a diagram showing a first state, Fig. 12(b) is a diagram showing a second state, Fig. 12(c) is a diagram showing a third state, and Fig. 12(d) is a diagram showing a fourth state. FIG. 13 is a diagram showing an example of the block operation timing of the sequence of FIGS. 12(a) to 12(d). FIG. 14 is a diagram showing an example of a time chart recipe in the case of height position control corresponding to the block operation timing of FIG. FIG. 15 is a diagram showing a time chart recipe in the first modified example corresponding to the block operation timing of FIG. FIG. 16 is a flowchart showing a method for controlling the block height in the second modified example. FIG. 17 is a flowchart showing a method for controlling the block height in the third modified example.

The following describes the embodiments and modifications with reference to the drawings. However, in the following description, the same components are given the same reference numerals and repeated description may be omitted. Note that in the drawings, the width, thickness, shape, etc. of each part may be shown diagrammatically compared to the actual embodiment in order to make the description clearer. Furthermore, the dimensional relationships between elements, the ratios of elements, etc. do not necessarily match between multiple drawings.

The configuration of a die bonder, which is one embodiment of a semiconductor manufacturing device, will be described with reference to Figures 1 to 3. Figure 1 is a schematic top view showing an example of the configuration of a die bonder in an embodiment. Figure 2 is a diagram explaining the schematic configuration as viewed from the direction of arrow A in Figure 1. Figure 3 is a schematic cross-sectional view showing the main parts of the wafer supply unit shown in Figure 1.

The die bonder 1 broadly comprises a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a bonding unit 40, a transport unit 50, a substrate supply unit 60, a substrate unloading unit 70, and a control unit (control device) 80. The Y direction is the front-to-rear direction of the die bonder 1, the X direction is the left-to-right direction, and the Z direction is the up-to-down direction. The wafer supply unit 10 is located at the front of the die bonder 1, and the bonding unit 40 is located at the rear.

The wafer supply section 10 has a wafer cassette lifter 11, a wafer holder 12, a push-up unit 13, and a wafer recognition camera 14.

The wafer cassette lifter 11 moves a wafer cassette (not shown), which stores multiple wafer rings WR, up and down to the wafer transport height. The wafer correction chute (not shown) aligns the wafer rings WR supplied from the wafer cassette lifter 11. The wafer extractor (not shown) removes the wafer rings WR from the wafer cassette and supplies them to the wafer holder 12, or removes them from the wafer holder 12 and stores them in the wafer cassette.

The wafer holder 12 has an expand ring 121 that holds the wafer ring WR, and a support ring 122 that is held by the wafer ring WR and horizontally positions the dicing tape DT. The push-up unit 13 is disposed inside the support ring 122.

A wafer W is attached (pasted) onto a dicing tape DT, and the wafer W is divided into multiple dies D. The dicing tape DT is transparent to visible light. A film-like adhesive material DF called a die attach film (DAF) is attached between the wafer W and the dicing tape DT. The adhesive material DF hardens when heated.

The wafer holder 12 is moved in the XY direction by a drive unit (not shown), and moves the die D to be picked up to the position of the push-up unit 13. The wafer holder 12 also rotates or moves the wafer ring WR in the XY plane by a drive unit (not shown). The push-up unit 13 moves in the vertical direction by a drive unit (not shown). The push-up unit 13 peels the die D from the dicing tape DT. The wafer holder 12 and the push-up unit 13 constitute a pickup device. The pickup device may include a pickup unit 20.

The wafer recognition camera 14 determines the pick-up position of the die D to be picked up from the wafer W and inspects the surface of the die D.

The pickup unit 20 has a pickup head 21 and a Y drive unit 23. The pickup head 21 is provided with a collet 22 that suction-holds the peeled die D at its tip. The pickup head 21 picks up the die D from the wafer supply unit 10 and places it on the intermediate stage 31. The Y drive unit 23 moves the pickup head 21 in the Y-axis direction. The pickup unit 20 has various drive units (not shown) that raise and lower, rotate, and move the pickup head 21 in the X direction.

The intermediate stage section 30 has an intermediate stage 31 on which the die D is placed, and a stage recognition camera 34 for recognizing the die D on the intermediate stage 31. The intermediate stage 31 has a suction hole that adsorbs the placed die D. The placed die D is temporarily held on the intermediate stage 31. The intermediate stage 31 is both a placement stage on which the die D is placed, and a pick-up stage on which the die D is picked up.

The bonding section 40 has a bond head 41, a Y drive section 43, a substrate recognition camera 44, and a bond stage 46. The bond head 41 is provided with a collet 42 that adsorbs and holds the die D at its tip. The Y drive section 43 moves the bond head 41 in the Y-axis direction. The substrate recognition camera 44 captures an image of a position recognition mark (not shown) on the substrate S and recognizes the bond position. Here, the substrate S has a plurality of product areas (hereinafter referred to as package areas P) that will eventually become one package. A position recognition mark is provided for each package area P. When the die D is placed on the substrate S, the bond stage 46 is raised and supports the substrate S from below. The bond stage 46 has a suction port (not shown) for vacuum adsorbing the substrate S, and can fix the substrate S. The bond stage 46 has a heating section (not shown) for heating the substrate S. The bonding section 40 has various drive units (not shown) that raise and lower, rotate, and move the bond head 41 in the X direction.

With this configuration, the bond head 41 corrects the pick-up position and posture based on the imaging data of the stage recognition camera 34, and picks up the die D from the intermediate stage 31. Then, the bond head 41 bonds the die D onto the package area P of the substrate S based on the imaging data of the substrate recognition camera 44, or bonds the die D by stacking it on top of a die that has already been bonded onto the package area P of the substrate S.

The transport section 50 has a transport claw 51 that grips and transports the substrate S, and a transport lane 52 along which the substrate S moves. The substrate S moves in the X direction by driving a nut (not shown) of the transport claw 51 provided on the transport lane 52 with a ball screw (not shown) provided along the transport lane 52. With this configuration, the substrate S moves from the substrate supply section 60 along the transport lane 52 to the bonding position, and after bonding, moves to the substrate unloading section 70 and hands the substrate S over to the substrate unloading section 70.

The substrate supply unit 60 removes the substrate S that was stored in the transport jig and transported in from the transport jig and supplies it to the transport unit 50. The substrate unloading unit 70 stores the substrate S transported by the transport unit 50 in the transport jig.

Next, the control unit 80 will be described with reference to FIG. 4. FIG. 4 is a block diagram showing the schematic configuration of the control system of the die bonder shown in FIG. 1.

The control system 8 includes a control unit (control device) 80, a drive unit 86, a signal unit 87, an optical system 88, etc. The control unit 80 is broadly divided into a control/arithmetic unit 81 mainly composed of a CPU (Central Processing Unit), a storage unit 82, an input/output unit 83, a bus line 84, and a power supply unit 85. The storage unit 82 includes a main storage unit 82a and an auxiliary storage unit 82b. The main storage unit 82a is composed of a RAM (Random Access Memory) that stores processing programs, etc. The auxiliary storage unit 82b is composed of a HDD (Hard Disk Drive) or SSD (Solid State Drive) that stores control data and image data necessary for control, etc.

The input/output device 83 includes a monitor 83a for displaying the device status and information, a touch panel 83b for inputting the operator's instructions, a mouse 83c for operating the monitor 83a, and an image capture device 83d for capturing image data from the optical system 88. The input/output device 83 further includes a motor control device 83e and an I/O signal control device 83f. The motor control device 83e controls the XY table (not shown) of the wafer supply unit 10, the ZY drive shaft of the bond head table, the drive unit of the thrust-up unit 13, and the like. The I/O signal control device 83f captures or controls signals from a signal unit 87 including various sensors such as a displacement meter described below and switches and volumes for controlling the brightness of lighting devices, and the like. The optical system 88 includes a wafer recognition camera 14, a stage recognition camera 34, and a substrate recognition camera 44. The control/arithmetic device 81 captures and calculates the necessary data via the bus line 84, controls the pickup head 21, and sends information to the monitor 83a, etc.

A part of the manufacturing process of a semiconductor device using the die bonder 1 (a method for manufacturing a semiconductor device) will be described with reference to FIG. 5. FIG. 5 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in FIG. 1. In the following description, the operation of each part constituting the die bonder 1 is controlled by the control unit 80.

(Wafer loading process: process S1)
The wafer ring WR is supplied to the wafer cassette of the wafer cassette lifter 11. The supplied wafer ring WR is then supplied to the wafer holder 12. The wafer W is previously inspected for each die by an inspection device such as a prober, and wafer map data indicating whether the die is good or bad is generated. This wafer map data is stored in a storage device of the control unit 80.

(Substrate loading process: process S2)
The transport jig storing the substrate S is supplied to the substrate supply section 60. In the substrate supply section 60, the substrate S is removed from the transport jig and fixed to the transport claws 51.

(Pickup process: process S3)
After step S1, the wafer holder 12 is moved so that the desired die D can be picked up from the dicing tape DT. The die D is photographed by the wafer recognition camera 14, and the die D is positioned and its surface inspected based on the image data acquired by photographing. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the die D on the wafer holder 12 from the die position reference point of the die bonder, and the die D is positioned. Note that the die position reference point is previously held at a predetermined position of the wafer holder 12 as the initial setting of the device. The image data is processed to inspect the surface of the die D.

The positioned die D is peeled off from the dicing tape DT by the push-up unit 13 and the pick-up head 21. The die D peeled off from the dicing tape DT is attracted to and held by the collet 22 provided on the pick-up head 21, and is transported to and placed on the intermediate stage 31.

The die D on the intermediate stage 31 is photographed by the stage recognition camera 34, and the die D is positioned and its surface inspected based on the image data acquired by photographing. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder, and positioning is performed. Note that the die position reference point is previously held at a predetermined position on the intermediate stage 31 as the initial setting of the device. The image data is processed to perform a surface inspection of the die D.

The pickup head 21 that transports the die D to the intermediate stage 31 is returned to the wafer supply section 10. The next die D is peeled off from the dicing tape DT according to the procedure described above, and thereafter, the dies D are peeled off one by one from the dicing tape DT according to the same procedure.

(Bonding process: process S4)
The substrate S is transported to the bond stage 46 by the transport unit 50. The substrate S placed on the bond stage 46 is imaged by the substrate recognition camera 44, and the substrate S is positioned and its surface is inspected based on the image data acquired by the image capture. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the substrate S from the substrate position reference point of the die bonder 1. Note that the substrate position reference point is previously held at a predetermined position of the bonding unit 40 as the initial setting of the device. The image data is processed to inspect the surface of the substrate S.

The suction position of the bond head 41 is corrected based on the deviation of the die D on the intermediate stage 31 calculated in step S3, and the die D is suctioned by the collet 42. The bond head 41, which has suctioned the die D from the intermediate stage 31, bonds the die D to a predetermined location on the substrate S supported by the bond stage 46. Here, the predetermined location on the substrate S is the package area P of the substrate S, or an area where an element is already placed and an element is to be bonded in addition to that, or a bonding area of an element to be stacked and bonded. The substrate recognition camera 44 photographs the die D bonded to the substrate S, and an inspection is performed based on the image data acquired by photographing to determine whether the die D has been bonded to the desired location, etc.

The bond head 41 that has bonded the die D to the substrate S is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This is repeated until a die D is bonded to all package areas P of the substrate S.

(Substrate removal process: process S5)
The substrate S with the die D bonded thereto is transported to the substrate unloading section 70. In the substrate unloading section 70, the substrate S is removed from the transport claws 51 and stored in a transport jig. The transport jig storing the substrate S is unloaded from the die bonder 1.

As described above, the die D is mounted on the substrate S and is removed from the die bonder 1. Thereafter, for example, the transport jig storing the substrate S on which the die D is mounted is transported to a wire bonding process, where the electrodes of the die D are electrically connected to the electrodes of the substrate S via Au wires or the like. The substrate S is then transported to a molding process, where the die D and the Au wires are sealed with molding resin (not shown) to complete the semiconductor package.

In the case of stacked bonding, following the wire bonding process, a transport jig on which a substrate S on which a die D is mounted is loaded and stored is transported into a die bonder, and the die D is stacked on top of the die D mounted on the substrate S. Then, after being transported out of the die bonder, the die D is electrically connected to the electrodes of the substrate S via Au wires in a wire bonding process. The dies D above the second level are peeled off from the dicing tape DT by the method described above, then transported to the bonding section and stacked on top of the die D. After the above process is repeated a predetermined number of times, the substrate S is transported to a molding process, and the multiple dies D and Au wires are sealed with molding resin (not shown) to complete the stacked package.

Next, the push-up unit 13 will be described with reference to Figures 6 to 10. Figure 6 is a diagram showing a vertical cross section of the push-up unit in the embodiment. Figure 7 is a diagram showing another vertical cross section of the push-up unit shown in Figure 6. Figure 8 is a top view of a portion of the first unit shown in Figure 6. Figure 9 is a diagram showing a cross section of a portion of the second unit taken along line E-E shown in Figure 7. Figure 10 is a top view of a portion of the third unit shown in Figure 6.

As shown in FIG. 6, the push-up unit 13 includes a first unit 131, a second unit 132 to which the first unit 131 is attached, and a third unit 133 to which the second unit 132 is attached. The second unit 132 and the third unit 133 are common parts regardless of the type, and the first unit 131 is a part that can be replaced for each type. The first unit 131 is also referred to as a tool.

As shown in Figures 6 to 8, the first unit 131 has a block portion 1311 having four blocks A1 to A4, a dome 1312, a conversion mechanism 1313, a peripheral die suction mechanism 1314, and a dome suction mechanism 1315. The dome 1312 has an opening at the top, and the blocks A1 to A4 move up and down through the opening. Note that while the first unit 131 will be described as being composed of four blocks A1 to A4, it can be composed of up to six blocks in this embodiment.

The conversion mechanism 1313 converts the up and down movement of the four concentric blocks B1 to B4 of the second unit 132 into the up and down movement of the four concentric square blocks A1 to A4. The four blocks A1 to A4 can move up and down independently. The planar shape of the concentric square blocks A1 to A4 is configured to match the shape of the die D. If the die size is large or finer peeling control is required, the number of concentric square blocks is configured to be more than four. This is possible because the multiple output sections of the third unit 133 and the concentric blocks of the second unit 132 move up and down independently of each other (do not move up and down). The thrust speed and thrust amount of the four blocks A1 to A4 can be set programmably.

The suction mechanism 1314 communicates with a suction hole provided on the upper surface of the dome 1312 and is connected to a vacuum pump. The suction mechanism 1314 communicates with the gaps between the blocks A1 to A4 and is connected to a vacuum pump.

As shown in Figures 6, 7 and 9, the second unit 132 has cylindrical blocks B1 to B6, a conversion mechanism 1323, magnets MG1 to MG6, an outer periphery (dome) 1322 that covers them, and detection units KC1 to KC6 provided on the outer surface side of the outer periphery 1322. The outer periphery 1322 is made of a magnetically permeable material. This configuration makes it possible to measure the height of blocks B1 to B6. It becomes possible to determine (measure) the height of blocks A1 to A6 based on the relative heights of blocks B1 to B6 or conversion mechanism 1323 and blocks A1 to A6, and the measured height of blocks B1 to B6 or conversion mechanism 1323. The magnets MG1 to MG6 and detection units KC1 to KC6 form six magnet sensors (displacement gauges). Note that the displacement gauge does not measure the flatness of each block, but only needs to grasp the relative positional relationship of the blocks, so a sensor with low accuracy such as a magnet sensor will suffice as the displacement gauge.

The conversion mechanism 1323 converts the up and down movement of the pins C1 to C6 arranged on the circumference of the third unit 133 into the up and down movement of the six concentric blocks B1 to B6. At the bottom of the conversion mechanism 1323, each of the blocks B1 to B6 has a portion adjacent to the outer periphery 1322. Magnets MG1 to MG6 are attached to the portion adjacent to the outer periphery 1322 of each of the blocks B1 to B6. At the top of the conversion mechanism 1323, block B6 is located on the outermost periphery, block B5 is located on the inside adjacent to block B6, block B4 is located on the inside adjacent to block B5, block B3 is located on the inside adjacent to block B4, block B2 is located on the inside adjacent to block B3, and block B1 is located on the innermost side adjacent to block B2. The six blocks B1 to B6 can move up and down independently. Blocks B1 to B6 or the conversion mechanism 1323 are called the drive shaft. Note that blocks B1 to B6 and the conversion mechanism 1323 are formed integrally, but this is not limited to this.

As shown in Figures 6, 7 and 10, the third unit 133 has a central portion 1330 and six peripheral portions 1331-1336. A cylindrical output portion 1330a is provided on the upper portion of the central portion 1330. The output portion 1330a has six pins C1-C6 that are arranged at equal intervals on the circumference of the upper surface and move up and down independently. The peripheral portions 1331-1336 can drive the pins C1-C6 independently of each other. The peripheral portions 1331-1336 have motors M1-M6, respectively, and the central portion 1330 has plunger mechanisms P1-P6 that convert the rotation of the motor into up and down movement by a cam or link. The plunger mechanisms P1-P6 provide up and down movement to the pins C1-C6. Motors M2, M5 and plunger mechanisms P2, P5 are not shown.

Magnets MG1 to MG6 may be provided on pins C1 to C6, and detectors KC1 to KC6 may be provided on the outer surface of output section 1330a or outer periphery 1322 of second unit 132. In this case, pins C1 to C6 are called drive shafts. This makes it possible to measure the height of pins C1 to C6. It becomes possible to determine (measure) the height of blocks A1 to A6 based on the relative heights of pins C1 to C6 and blocks A1 to A6 and the measured heights of pins C1 to C6.

An example of the configuration of motors M1 to M6 will be described with reference to Figure 11. Figure 11 is a block diagram showing the motors and motor control devices of the thrust-up unit.

Motors M1 to M6 are, for example, AC servo motors or α-step pulse motors (hybrid control stepping motors that normally perform open-loop control and perform closed-loop control when overloaded). Each of motors M1 to M6 is equipped with an encoder (ENC) Ma that detects the rotational angular velocity and a current sensor (CS) Mb that obtains the motor current.

Here, since the first unit 131 has only four blocks A1 to A4, blocks B5 and B6 of the second unit 132, pins C5 and C6 of the third unit 133, plunger mechanisms P5 and P6, motors M5 and M6, magnets MG5 and MG6, and detectors KC5 and KC6 are not used.

The thrust unit 13 can, for example, thrust up blocks A1 to A4 simultaneously, then further thrust up blocks A1 to A3 simultaneously, then further thrust up blocks A1 and A2 simultaneously, and then further thrust up block A1 to form a pyramid shape. The thrust unit 13 can thrust up blocks A1 to A4 simultaneously, and then lower blocks A4, A3, and A2 in that order. In this disclosure, the former is referred to as MS (Multi Step) operation, and the latter as RMS (Reverse Multi Step) operation.

The RMS operation will be explained using Figures 12(a) to 12(d). Figures 12(a) to 12(d) are cross-sectional views of a thrust unit showing an example of an RMS thrust sequence, where Figure 12(a) shows the first state, Figure 12(b) shows the second state, Figure 12(c) shows the third state, and Figure 12(d) shows the fourth state.

The pickup operation begins with the target die D on the dicing tape DT being positioned by the push-up unit 13 and collet 22. Once positioning is complete, the dicing tape DT is adsorbed to the upper surface of the push-up unit 13 by drawing a vacuum through suction holes and gaps (not shown) in the push-up unit 13. At this time, the upper surfaces of blocks A1 to A4 are at the same height (initial position) as the upper surface of the dome 1312. In this state, a vacuum is supplied from the vacuum supply source, and the collet 22 descends while drawing a vacuum toward the device surface of the die D, until it lands.

After that, as shown in FIG. 12(a), blocks A1 to A4 simultaneously rise to a predetermined height at a constant speed and enter the first state. Collet 22 is controlled to rise in conjunction with blocks A1 to A4 (synchronized with their height). Thus, die D rises while being sandwiched between collet 22 and blocks A1 to A4. As the peripheral portion of dicing tape DT remains vacuum-adsorbed to dome 1312, which is the periphery of push-up unit 13, tension is generated around die D. As a result, peeling of dicing tape DT begins around die D.

Next, as shown in FIG. 12(b), block A4 descends at a constant speed to a predetermined height below the upper surface of dome 1312, entering the second state. As block A4 descends below the upper surface of dome 1312, it is no longer supported by dicing tape DT, and the tension of dicing tape DT causes the dicing tape DT to peel off.

Next, as shown in FIG. 12(c), block A3 descends at a constant speed to a predetermined height below the upper surface of dome 1312, entering the third state. As block A3 descends below the upper surface of dome 1312, the support of dicing tape DT is lost, and the tension of dicing tape DT causes further peeling of dicing tape DT.

Next, as shown in FIG. 12(d), block A2 descends at a constant speed to a predetermined height below the upper surface of dome 1312, entering the fourth state. As block A2 descends below the upper surface of dome 1312, the support of dicing tape DT is lost, and the tension of dicing tape DT causes further peeling of dicing tape DT.

Then, the collet 22 is pulled upward. After a predetermined time from the fourth state, blocks A2 to A4 rise at a constant speed, and block A1 descends at a constant speed and returns to the initial position. This completes the operation of peeling the die D from the dicing tape DT.

Next, the method of setting and controlling the operation of the RMS will be described. In the time chart recipe, for example, the step time, the speed of the block rising or falling, and the block height (position) are set for each block and each step of the operation of each block A1, A2, A3, A4 of the thrust-up unit 13. In the case of time control, the step time is set, and in the case of position control, the block height is set. The control unit 80 controls the motors M1 to M4 that drive each of the blocks A1 to A4 via the pins C1 to C4 and the blocks B1 to B4, respectively, based on the time chart recipe.

A number of time chart recipes with different setting items are prepared, and the operator selects one of the time chart recipes using a GUI (Graphical User Interface) and inputs setting values to the items of the selected time chart recipe. Alternatively, the operator transmits data of the time chart recipe with the setting values input in advance from an external device to a semiconductor manufacturing device such as a die bonder, or installs the time chart recipe from an external storage device to the semiconductor manufacturing device. Here, the external storage device is, for example, a magnetic tape, a magnetic disk such as a flexible disk or a hard disk, an optical disk such as a CD or a DVD, a magneto-optical disk such as an MO, or a semiconductor memory such as a USB memory or a memory card. In addition, the control unit 80 can rewrite the time chart recipe in real time based on the heights of the blocks A1 to A4 detected by the detection units KC1 to KC4, and instruct the push-up unit 13 to change the push-up operation.

An example of a time chart recipe will be described with reference to Figures 13 and 14. Figure 13 is a diagram showing an example of block operation timing in RMS operation. Figure 14 is a diagram showing an example of a time chart recipe in the case of height position control corresponding to the block operation timing of Figure 13. The horizontal axis of Figure 13 is time (t), and the vertical axis is thrust height (h).

The time chart recipe shown in Figure 14 ends each step by giving priority to the arrival of the specified block position (height) for the operation of each block, and executes each block operation by inputting an operation time difference (time difference or interval time) to adjust the processing time between each block. In other words, the time difference is the time from when the rise or fall of each block ends to when the next step begins. The end of the rise or fall of the block is determined by comparing the measurement value of the displacement meter with the block position (height) set in the time chart recipe. This allows the operation of each block to be performed reliably at each step, and also allows the operation to be synchronized with the operations of other blocks.

(1) Block A4
The control unit 80 raises the block A4 to a height of h1 at a speed of s1 from the beginning of the first step, and maintains the state at the height of h1. Here, as shown in Fig. 13, if the time it takes for the block A4 to reach h1 is t1, then t1 = h1/s1. The first step (STEP 1) of the block A1 corresponds to the first state in Fig. 12(a). The time difference in the first step (STEP 1), i.e., the time (standby time) from the end of the rise of the block A4 until the start of the second step (STEP 2) is t2.

The control unit 80 lowers block A4 to a height of -h2 at a speed of s2 from the start of the second step (STEP 2), and maintains the state at the height of -h2. Here, as shown in FIG. 13, if the time it takes for block A1 to reach a predetermined height (-h2) is t3, then t3 = (h1 + h2) / s2. The second step (STEP 2) of block A1 corresponds to the second state to the fourth state in FIG. 12(b). The time difference in the second step (STEP 2), that is, the time from the end of the descent of block A1 to the start of the third step (STEP 3), is (t4 + t5 + t6).

The control unit 80 raises block A4 to the initial position (height is 0) at a speed of s3 from the start of the third step (STEP 3). If the time it takes for block A1 to reach the initial position is t8, then t8 = h2/s3. The time difference in the third step (STEP 3), that is, the time from when block A4 finishes rising to when the fourth step (STEP 4) begins, is t9.

(2) Block A3
The control unit 80 raises the block A3 to a height of h1 at a speed of s1 from the beginning of the first step (STEP 1) and maintains the state at the height of h1. The first step (STEP 1) of the block A2 corresponds to the first state in Fig. 12(a) and the second state in Fig. 12(b). The time difference in the first step (STEP 1), that is, the time from the end of the rise of the block A3 to the start of the second step (STEP 2), is (t2 + t10).

The control unit 80 lowers block A3 from the start of the second step at a speed of s2 to a height of -h2, and maintains the state at the height of -h2. The second step (STEP 2) of block A3 corresponds to the third state in FIG. 12(c) and the fourth state in FIG. 12(d). The time difference in the second step (STEP 2), that is, the time from the end of the descent of block A3 to the start of the third step (STEP 3), is (t5 + t6).

The control unit 80 raises block A3 to the initial position (height is 0) at a speed of s3 from the start of the third step (STEP 3). The time difference in the third step (STEP 3), that is, the time from when block A3 finishes rising to when the fourth step (STEP 4) starts, is t9.

(3) Block A2
The control unit 80 raises the block A2 from the beginning of the first step at a speed of s1 to a height of h1 and maintains the state at the height of h1. The first step (STEP 1) of the block A3 corresponds to the first state in Fig. 12(a), the second state in Fig. 12(b), and the third state in Fig. 12(c). The time difference in the first step (STEP 1), that is, the time from the end of the rise of the block A2 to the start of the second step (STEP 2), is (t2+t10+t11).

The control unit 80 lowers block A2 from the start of the second step at a speed of s2 to a height of -h2, and maintains the state at the height of -h2. The second step (STEP 2) of block A2 corresponds to the fourth state in FIG. 12(d). The time difference in the second step (STEP 2), that is, the time from the end of the descent of block A2 to the start of the third step (STEP 3), is t6.

The control unit 80 raises block A2 to the initial position (height is 0) at a speed of s3 from the start of the third step (STEP 3). The time difference in the third step (STEP 3), that is, the time from when block A2 finishes rising to when the fourth step (STEP 4) starts, is t9.

(4) Block A1
The control unit 80 raises the block A1 from the beginning of the first step at a speed of s1 to a height of h1 and maintains the state at the height of h1. The first step (STEP 1) of the block A1 corresponds to the first state in Fig. 12(a), the second state in Fig. 12(b), the third state in Fig. 12(c), and the fourth state in Fig. 12(d). The time difference in the first step (STEP 1), that is, the time from the end of the rise of the block A1 to the start of the second step (STEP 2), is (t2+t10+t11+t12).

The control unit 80 lowers block A1 from the start of the second step to the initial position (height is 0) at a speed of s4. Here, if the time it takes block A1 to reach the initial position is t9, then t9 = h1/s4. The time difference in the second step (STEP 2), that is, the time from when block A4 finishes descending to when the third step (STEP 3) begins, is 0.

The above-mentioned time chart recipe ends each step by giving priority to the block reaching the specified block position (height) for the operation of each block. The height of each block is measured individually using a displacement meter, and the height of each block is controlled based on the measurement results (block position) of the displacement meter. This makes it possible to reproduce at least the block position (height) and operation sequence, even if a delay occurs in the motor operation due to the influence of load, etc.

According to the embodiment, at least one of the following effects is obtained:

(a) When the mechanical rigidity is low, the load applied to the plunger mechanism changes depending on the dicing tape, the number and size of dies on the dicing tape, the type of tool used (first unit 131), etc., causing the plunger mechanism to deflect. Deflection can cause fluctuations in the height of the drive shaft and height fluctuations (positional misalignment) between multiple drive shafts. However, by measuring the height of the drive shafts with a displacement meter and correcting the positional misalignment of the blocks, it is possible to ensure thrust height accuracy while lowering the mechanical rigidity to a certain extent.

(b) It is possible to reduce the rigidity of the mechanism, making it possible to make the thrust unit smaller and lighter.

(c) The height of each block can be measured individually using a displacement meter, ensuring repeatability of the relative movement between multiple blocks using multiple drive axes.

(d) The displacement meter makes it possible to constantly monitor the thrust-up operation for abnormalities while the device is in operation, making it possible to prevent malfunctions before they occur.

(e) The above (a) to (d) improve pickup accuracy and reliability, and reduce die cracks and chipping defects.

<Modification>
Below, some representative modified examples of the embodiment are exemplified. In the following description of the modified examples, the same reference numerals as those in the above-mentioned embodiment may be used for parts having the same configuration and function as those described in the above-mentioned embodiment. The description of such parts may be appropriately cited within the scope of technical inconsistency. Furthermore, a part of the above-mentioned example and all or a part of the multiple modified examples may be appropriately applied in a composite manner within the scope of technical inconsistency.

(First Modification)
The time chart recipe in the first modified example will be described with reference to Fig. 13 and Fig. 15. Fig. 15 is a diagram showing the time chart recipe in the first modified example corresponding to the block operation timing in Fig. 13.

In the time chart recipe in the embodiment, the start of the next step is set by the height of the block in each step, but in the time chart recipe in the first modified example, the length of each step is set by time. In the time chart recipe in the embodiment, each step ends with the priority being reached when the block position (height) instructed to operate each block is reached. However, in the time chart recipe in the first modified example, a step ends with the priority being reached when the time instructed to operate each block is reached. The "speed" and "height (position)" of the time chart recipe in the first modified example are the same as those in the time chart recipe in the embodiment.

The following explains the "time" that is set in the time chart recipe shown in Figure 15.

(1) Block A4
The time of the first step (STEP 1) is (t1+t2), the time of the second step (STEP 2) is (t3+t4+t5+t6), and the time of the third step (STEP 3) is (t8+t9).

(2) Block A3
The time for the first step (STEP 1) is (t1+t2+t10), the time for the second step (STEP 2) is (t3-t10+t4+t5+t6), and the time for the third step (STEP 3) is (t8+t9).

(3) Block A2
The time for the first step (STEP 1) is (t1+t2+t10+t11), the time for the second step (STEP 2) is (t3+t4+t5-t10-t11+t6), and the time for the third step (STEP 3) is (t8+t9).

(4) Block A1
The time for the first step (STEP 1) is (t1+t2+t10+t11+t12), and the time for the second step (STEP 2) is t7.

In the time chart recipe of the first variant, the step ends when the time specified for the operation of each block has arrived. The actual height of each block may differ from the height set in the time chart recipe. Therefore, the height of each block is measured individually using a displacement meter and the measured value is recorded. As the height of the blocks is measured using a displacement meter, it is possible to constantly monitor for abnormalities in the push-up operation while the device is in operation. This makes it possible to prevent malfunctions before they occur.

(Second Modification)
The method of controlling the block height in the second modified example will be described with reference to Fig. 16. Fig. 16 is a flow chart showing the method of controlling the block height in the second modified example.

(Step S11)
Before production, the control unit 80 performs the operation sequence defined by the same time chart recipe as that used during production, for example, the time chart recipe shown in Fig. 14, without bringing the blocks A1 to A4 into contact with the dicing tape DT. This is called the predetermined operation sequence during idle operation. The control unit 80 measures the heights of the blocks A1 to A4 at each step of the predetermined operation sequence and records the measured values.

(Step S12)
During production, the control unit 80 brings the blocks A1 to A4 into contact with the dicing tape DT as shown in Figures 12(a) to 12(d), and performs an operation sequence defined by the time chart recipe shown in Figure 14, for example. This is called a predetermined operation sequence during production. The control unit 80 measures the heights of the blocks A1 to A4 at each step of the predetermined operation sequence.

(Step S13)
The control unit 80 calculates the amount of change between the measured heights of the blocks A1 to A4 during idle operation and the measured heights of the blocks A1 to A4 during production.

(Step S14)
The control unit 80 controls the height of the blocks A1 to A4 by feeding back the amount of change, thereby making it possible to make the height of the blocks A1 to A4 during production the same as the height of the blocks A1 to A4 during idle operation.

(Third Modification)
The control based on the load of the motor in the third modified example will be described with reference to Fig. 17. Fig. 17 is a flow chart showing a method of controlling the block height in the third modified example.

The motor control device (MC) 83e corrects (e.g., adds) the command values (CV) of the motors M1 to M4 based on the measured values from the displacement meter, the command values (CV) of the motors M1 to M4, and the rotation angles of the motors M1 to M4 detected by the encoders Ma provided on each of the motors M1 to M4.

In other words, the heights of the blocks A1 to A4 measured by the displacement gauges are compared with the rotational positions of the motors M1 to M4 detected by the encoders Ma, and the blocks A1 to A4 are operated. The heights of the blocks A1 to A4 measured by the displacement gauges are compared with the rotational positions of the motors M1 to M4 detected by the encoders Ma, and a determination may be made as to whether the blocks A1 to A4 are malfunctioning.

An example has been described in which the height of the block is measured using a displacement meter, and the height of the block is controlled (feedback controlled) based on the measurement results of the displacement meter, but the optimal feedback gain may differ depending on the load amount. For example, the load amount on the motor changes depending on the number of dies attached to the dicing tape (the number that have not been picked up and remain on the dicing tape). Therefore, the load amount on the motor may also be measured.

(Step S21)
Before production, the motor control device 83e operates the blocks A1 to A4 of the push-up unit 13 by the motors M1 to M4 according to a predetermined operation sequence defined by the same time chart recipe as during production, for example, the time chart recipe shown in FIG.

Then, for each rotation angle of the motors M1 to M4 detected by the encoder Ma provided on the motors M1 to M4, the motor control device 83e measures the torque value (load amount) from the current detected by the current sensor Mb (motor current based on the load received by the motors M1 to M4). The measured load amount and the feedback gain corresponding to this load amount are stored in a storage device. The above process is repeated by changing the load, and a table of the relationship between the load amount and the feedback gain is created.

(Step S22)
During production, the motor control device 83e operates the blocks A1 to A4 of the push-up unit 13 by the motors M1 to M4 in accordance with a predetermined operation sequence.

Then, for each rotation angle of the motors M1 to M4 detected by the encoder Ma provided on the motors M1 to M4, the motor control device 83e measures the torque value (load amount) from the current detected by the current sensor Mb (motor current based on the load received by the motors M1 to M4).

(Step S23)
The control unit 80 obtains the feedback gain for the measured load from the table and controls the heights of the blocks A1 to A4, thereby enabling control with an optimal feedback gain according to the load.

In addition, the displacement meter value, motor load, and motor command value can be constantly monitored during production. This makes it possible to detect mechanical malfunctions and changes in characteristics such as the viscosity of the dicing tape at an early stage, and to display an alert or correct the command value for the thrust amount.

The disclosure made by the present inventors has been specifically described above based on the embodiments and modifications, but it goes without saying that the present disclosure is not limited to the above embodiments and modifications, and various modifications are possible.

For example, in the embodiment, a magnet sensor has been described as an example of a displacement meter, but this is not limited to this. If high accuracy is required, a laser displacement sensor or a spectroscopic interference sensor may be used, and if cost is prioritized and relatively low accuracy is acceptable, an eddy current sensor may be used.

In the embodiment, an example was described in which a displacement gauge was provided on blocks B1 to B6 as the drive shaft, conversion mechanism 1323, or pins C1 to C6 to measure the block height, but the displacement gauge may also be provided on blocks A1 to A6 or plunger mechanisms P1 to P6.

In addition, in the embodiment, an example in which the number of blocks is four has been described, but the number of blocks may be three or less or five or more depending on the die size.

In the embodiment, the multiple blocks of the thrust unit are described as being concentric rectangular, but they may be concentric circular or elliptical, or may be configured by arranging rectangular blocks in parallel.

In addition, in the embodiment, an example in which a die attachment film is used has been described, but it is also possible to provide a preform portion for applying adhesive to the substrate, without using a die attachment film.

In the embodiment, a die bonder has been described in which a pick-up head picks up a die from a wafer supply unit and places it on an intermediate stage, and a bonding head bonds the die placed on the intermediate stage to a substrate. However, this is not limited to this, and the present invention can be applied to any die bonding device that picks up a die from a die supply unit.

For example, it can also be applied to a die bonder that does not have an intermediate stage and a pickup head, and bonds the die from the wafer supply section to the substrate with the bonding head.

It can also be applied to flip chip bonders that do not have an intermediate stage and pick up a die from a wafer supply unit, rotate the die pickup head upwards to hand the die over to the bonding head, which then bonds the die to a substrate.

In the embodiment, a die bonder has been used as an example, but the invention can also be applied to semiconductor manufacturing equipment that places picked-up dies on a tray.

1...Die bonder (semiconductor manufacturing equipment)
12: Wafer holder 13: Thrust-up unit A1 to A4: Blocks B1 to B4: Blocks (drive shaft)
1323...Conversion mechanism (drive shaft)
C1 to C4: Pins (drive shafts)
P1 to P4: Plunger mechanism 80: Control unit

Claims (15)

a wafer holder that holds a dicing tape having a die attached thereto;
a push-up unit including a plurality of blocks that come into contact with the dicing tape, a plurality of drive shafts that transmit vertical motions to the plurality of blocks independently, a plurality of plunger mechanisms that transmit vertical motions to the plurality of drive shafts independently, and a plurality of displacement gauges that measure the heights of the plurality of blocks;
A control unit for controlling the push-up unit;
Equipped with
The semiconductor manufacturing apparatus, wherein the plurality of displacement gauges are provided on the plurality of blocks, the plurality of drive shafts, or the plurality of plunger mechanisms. 2. The semiconductor manufacturing apparatus according to claim 1,
The thrust-up unit of the semiconductor manufacturing apparatus includes a plurality of motors that actuate the respective plunger mechanisms, and a plurality of encoders that detect the rotational positions of the respective motors. 3. The semiconductor manufacturing apparatus according to claim 2,
The control unit of the semiconductor manufacturing apparatus is configured to operate the multiple blocks by comparing the heights of each of the multiple blocks measured by the multiple displacement meters with the rotational positions of each of the multiple motors detected by the multiple encoders. 3. The semiconductor manufacturing apparatus according to claim 2,
The control unit of the semiconductor manufacturing apparatus is configured to compare the heights of each of the multiple blocks measured by the multiple displacement meters with the rotational positions of each of the multiple motors detected by the multiple encoders to determine whether or not the multiple blocks are operating abnormally. 5. The semiconductor manufacturing apparatus according to claim 1,
The push-up unit further includes an outer periphery that houses the drive shaft and is made of a magnetic permeable material,
The displacement meter of the semiconductor manufacturing equipment includes a magnet provided on the drive shaft and a detection unit provided on the outer surface of the outer periphery. 5. The semiconductor manufacturing apparatus according to claim 1,
The semiconductor manufacturing equipment, wherein the displacement meter is a laser displacement sensor, a spectroscopic interference sensor, or an eddy current sensor. 3. The semiconductor manufacturing apparatus according to claim 2,
The push-up unit of the semiconductor manufacturing apparatus includes a first unit having the plurality of blocks, a second unit having the drive shaft, and a third unit having the plurality of plunger mechanisms. 3. The semiconductor manufacturing apparatus according to claim 2,
The thrust-up unit of the semiconductor manufacturing apparatus comprises: a first unit having the plurality of blocks; a second unit transmitting the up and down movement of the drive shaft to the plurality of blocks; and a third unit having the drive shaft and the plurality of plunger mechanisms. 5. The semiconductor manufacturing apparatus according to claim 1,
Further, a control unit configured to control heights of the plurality of blocks based on measurement results of the plurality of displacement meters in a predetermined operation sequence of the plurality of blocks,
The specified operation sequence is composed of a plurality of steps for each of the plurality of blocks, and the length of each of the plurality of steps is set as the time from the end of raising or lowering of a block to the start of raising or lowering of the block in the next step. 5. The semiconductor manufacturing apparatus according to claim 1,
the control unit is configured to measure a height of each block of the plurality of blocks in a predetermined movement sequence of the plurality of blocks and record the measurements;
The predetermined operation sequence is composed of a plurality of steps for each of a plurality of blocks, and the length of each of the plurality of steps is set in terms of time. 5. The semiconductor manufacturing apparatus according to claim 1,
The control unit is
measuring heights of the plurality of blocks during an idle operation in which a predetermined operation sequence is performed without the plurality of blocks being in contact with the dicing tape, and recording the measured values;
The semiconductor manufacturing apparatus is configured to measure heights of the multiple blocks during production when the multiple blocks are brought into contact with the dicing tape and the specified operation sequence is performed, calculate the amount of change between the recorded measurement value and the measurement value during production, and control the heights of the multiple blocks by feeding back the amount of change so as to maintain the heights of the multiple blocks at the same level as during the idle operation. 5. The semiconductor manufacturing apparatus according to claim 2,
The motor further includes a current sensor for obtaining a current of the motor;
The control unit is
Before production, for each load, a load amount in operation of the plurality of blocks is measured based on a current detected by the current sensor when the plurality of blocks are operated in a predetermined operation sequence, and a feedback gain for the measured load amount is calculated, and a table of the relationship between the load amount and the feedback gain is created;
The semiconductor manufacturing apparatus is configured to measure a load amount during operation of the plurality of blocks based on a current detected by the current sensor when the plurality of blocks are moved in a predetermined operation sequence during production, and to obtain a feedback gain for the measured load amount from the table to control the heights of the plurality of blocks. 5. The semiconductor manufacturing apparatus according to claim 1,
a head having a collet for adsorbing the die;
The control unit is configured to control the height of the collet based on the measured heights of the multiple blocks. a wafer holder that holds a dicing tape having a die attached thereto;
a push-up unit including a plurality of blocks that come into contact with the dicing tape, a plurality of drive shafts that transmit vertical movements to the plurality of blocks independently, a plurality of plunger mechanisms that transmit vertical movements to the plurality of drive shafts independently, and a plurality of displacement gauges that measure the heights of the plurality of blocks;
A pickup device comprising: carrying a wafer ring into a semiconductor manufacturing device including a wafer holder that holds a dicing tape having a die attached thereto, and a push-up unit having a plurality of blocks that come into contact with the dicing tape, a plurality of drive shafts that transmit vertical movements independently to the plurality of blocks, a plurality of plunger mechanisms that transmit vertical movements independently to the plurality of drive shafts, and a plurality of displacement gauges that measure the heights of the plurality of blocks;
picking up a die from a dicing tape held by the wafer ring;
A method for manufacturing a semiconductor device having the above structure.

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