JP2024064922A - 色変換パネル及びディスプレイ装置 - Google Patents
色変換パネル及びディスプレイ装置 Download PDFInfo
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 74
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 239000000463 material Substances 0.000 claims abstract description 55
- 229910052594 sapphire Inorganic materials 0.000 claims abstract description 37
- 239000010980 sapphire Substances 0.000 claims abstract description 37
- 239000002096 quantum dot Substances 0.000 claims abstract description 35
- 239000011159 matrix material Substances 0.000 claims description 15
- 101000611441 Solanum lycopersicum Pathogenesis-related leaf protein 6 Proteins 0.000 description 30
- 238000004519 manufacturing process Methods 0.000 description 16
- 102200084388 rs121918345 Human genes 0.000 description 14
- 102220495430 Glutaredoxin-like protein C5orf63_S12A_mutation Human genes 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 102220240346 rs764757062 Human genes 0.000 description 9
- 102220070930 rs794728599 Human genes 0.000 description 8
- 229910002601 GaN Inorganic materials 0.000 description 6
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 102220609844 AP-1 complex subunit sigma-1A_P14A_mutation Human genes 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 102200115048 rs1445404 Human genes 0.000 description 3
- 102200010892 rs1805192 Human genes 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 102220621241 Proline-rich membrane anchor 1_S32A_mutation Human genes 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 102220247977 rs758942502 Human genes 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- 101000804670 Beet necrotic yellow vein virus (isolate Japan/S) Probable suppressor of RNA silencing Proteins 0.000 description 1
- 101000922061 Homo sapiens Beta-catenin-like protein 1 Proteins 0.000 description 1
- 101000686685 Homo sapiens Ribonuclease P protein subunit p14 Proteins 0.000 description 1
- 101000616188 Homo sapiens Splicing factor 3B subunit 6 Proteins 0.000 description 1
- 101000612136 Mus musculus Procollagen C-endopeptidase enhancer 1 Proteins 0.000 description 1
- 101000654577 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Protein transport protein SFT1 Proteins 0.000 description 1
- 101000879638 Streptomyces mobaraensis Transglutaminase-activating metalloprotease inhibitor Proteins 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
Description
52、82:発光画素アレイパネル
52A、82A:発光素子
100、200、300A、300B1、300B2、300C、300D、300E:色変換パネル
110、110A:不透明基板
112、112A:反射層
120、220、320:サファイア基板
130:高屈折材料層
140、140A:分布型ブラッグ反射層
142:開口
150:メタレンズ
150A:窒化ガリウム層
160:マイクロレンズ
BM10、BM20、BM30:遮光マトリックス
P12、P12A:第1画素開口
P14、P14A:第2画素開口
P16、P16A:第3画素開口
P20A、P20B、P20C:透光開口
R10:赤色量子ドット材料
G10:緑色量子ドット材料
B10:青色量子ドット材料
S12、S22:第1表面
S14、S24:第2表面
S12A、S22A、S32A:第1弧面
S12B、S22B、S32B:第2弧面
S12C、S22C、S32C:第3弧面
Claims (9)
- 複数の発光素子を備えた発光画素アレイパネルと、
前記発光画素アレイパネル上に設けられた色変換パネルと
を含む
ディスプレイ装置であって、
上記色変換パネルが、
複数の第1画素開口と、複数の第2画素開口と、複数の第3画素開口とを含む不透明基板と、
前記不透明基板上に設けられたサファイア基板と
を含み、
前記第1画素開口が赤色量子ドット材料で充填され、前記第2画素開口が緑色量子ドット材料で充填され、
前記不透明基板に面した前記サファイア基板の第1表面が、前記第1画素開口に対応する複数の第1弧面と、前記第2画素開口に対応する複数の第2弧面と、前記第3画素開口に対応する複数の第3弧面とを有する、
ディスプレイ装置。 - 前記色変換パネルが、前記不透明基板から遠い前記サファイア基板の第2表面上に位置して前記第1画素開口、前記第2画素開口、及び前記第3画素開口に対応する、複数のメタレンズ又はマイクロレンズを更に含む、
請求項1に記載のディスプレイ装置。 - 前記色変換パネルが、前記不透明基板から遠い前記サファイア基板の第2表面上に設けられた分布型ブラッグ反射層を更に含む、
請求項1に記載のディスプレイ装置。 - 前記色変換パネルが、前記第1弧面と前記第1画素開口との間、前記第2弧面と前記第2画素開口との間、及び前記第3弧面と前記第3画素開口との間に位置する複数の高屈折材料層を更に含み、
前記高屈折材料層の屈折率が1.7~2.0の間である、
請求項1に記載のディスプレイ装置。 - 前記第1弧面の内側凹面、前記第2弧面の内側凹面、及び前記第3弧面の内側凹面が、前記不透明基板に面する、
請求項1に記載のディスプレイ装置。 - 前記色変換パネルが、前記不透明基板と前記サファイア基板との間に設けられた遮光マトリックスを更に含み、
前記遮光マトリックスが、前記第1画素開口、前記第2画素開口、及び前記第3画素開口に対応する複数の透光開口を備える、
請求項1に記載のディスプレイ装置。 - 前記発光画素アレイパネルと前記色変換パネルとの間に設けられた遮光マトリックスを更に含み、
前記遮光マトリックスが、前記第1画素開口、前記第2画素開口、及び前記第3画素開口に対応する複数の透光開口を備える、
請求項1に記載のディスプレイ装置。 - 前記発光画素アレイパネルが遮光マトリックスを更に含み、
前記遮光マトリックスが前記発光素子に対応する複数の透光開口を備え、前記発光素子が前記透光開口に位置する、
請求項1に記載のディスプレイ装置。 - 前記色変換パネルに面する前記発光素子の表面が弧面である、
請求項1に記載のディスプレイ装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111141246A TWI857379B (zh) | 2022-10-28 | 色轉換面板與顯示器 | |
TW111141246 | 2022-10-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2024064922A true JP2024064922A (ja) | 2024-05-14 |
JP7523199B2 JP7523199B2 (ja) | 2024-07-26 |
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JP2022198658A Active JP7523199B2 (ja) | 2022-10-28 | 2022-12-13 | 色変換パネル及びディスプレイ装置 |
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US (1) | US20240145641A1 (ja) |
JP (1) | JP7523199B2 (ja) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3925341B2 (ja) | 2002-07-30 | 2007-06-06 | 豊田合成株式会社 | 結晶成長基板及び半導体発光素子の製造方法 |
JP2006165041A (ja) | 2004-12-02 | 2006-06-22 | Toshiba Corp | 光半導体装置およびその製造方法 |
JP2017175004A (ja) | 2016-03-24 | 2017-09-28 | ソニー株式会社 | チップサイズパッケージ、製造方法、電子機器、および内視鏡 |
KR102399464B1 (ko) | 2017-06-27 | 2022-05-19 | 주식회사 루멘스 | 엘이디 패널 |
TWI827564B (zh) | 2017-11-17 | 2024-01-01 | 美商康寧公司 | 量子點顯示器以及製造量子點顯示器的方法 |
JP2019179111A (ja) | 2018-03-30 | 2019-10-17 | Jsr株式会社 | 表示素子用積層体、及び隔壁形成用組成物 |
JP7484457B2 (ja) | 2019-06-12 | 2024-05-16 | 東レ株式会社 | マイクロledディスプレイ装置 |
JP2021140028A (ja) | 2020-03-05 | 2021-09-16 | 凸版印刷株式会社 | カラーフィルタ基板及び表示装置 |
CN111769109B (zh) | 2020-06-30 | 2022-02-18 | 上海天马微电子有限公司 | 显示面板和显示装置 |
JP2022118915A (ja) | 2021-02-03 | 2022-08-16 | 凸版印刷株式会社 | カラーフィルタおよび表示装置 |
CN113178513B (zh) | 2021-04-29 | 2023-01-03 | 上海天马微电子有限公司 | 一种发光器件、显示面板和显示装置 |
CN216053106U (zh) | 2021-07-01 | 2022-03-15 | 北京极豪科技有限公司 | 一种指纹识别模组及电子设备 |
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- 2022-12-13 JP JP2022198658A patent/JP7523199B2/ja active Active
- 2022-12-15 US US18/082,540 patent/US20240145641A1/en active Pending
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Publication number | Publication date |
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US20240145641A1 (en) | 2024-05-02 |
JP7523199B2 (ja) | 2024-07-26 |
TW202418577A (zh) | 2024-05-01 |
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