JP2024041724A - 樹脂組成物、接着剤、コーティング剤、硬化物、接着シート、樹脂付銅箔、銅張積層板及びプリント配線板 - Google Patents

樹脂組成物、接着剤、コーティング剤、硬化物、接着シート、樹脂付銅箔、銅張積層板及びプリント配線板 Download PDF

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Publication number
JP2024041724A
JP2024041724A JP2023144523A JP2023144523A JP2024041724A JP 2024041724 A JP2024041724 A JP 2024041724A JP 2023144523 A JP2023144523 A JP 2023144523A JP 2023144523 A JP2023144523 A JP 2023144523A JP 2024041724 A JP2024041724 A JP 2024041724A
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Japan
Prior art keywords
bis
resin composition
resin
manufactured
copper foil
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Pending
Application number
JP2023144523A
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English (en)
Japanese (ja)
Inventor
太陽 中村
Taiyou Nakamura
眞花 山下
Madoka Yamashita
貴史 山口
Takashi Yamaguchi
啓輔 ▲杉▼本
Keisuke Sugimoto
淳 塩谷
Atsushi Shiotani
崇司 田▲崎▼
Takashi Tasaki
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Arakawa Chemical Industries Ltd
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Arakawa Chemical Industries Ltd
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Publication of JP2024041724A publication Critical patent/JP2024041724A/ja
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
JP2023144523A 2022-09-14 2023-09-06 樹脂組成物、接着剤、コーティング剤、硬化物、接着シート、樹脂付銅箔、銅張積層板及びプリント配線板 Pending JP2024041724A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022146004 2022-09-14
JP2022146004 2022-09-14

Publications (1)

Publication Number Publication Date
JP2024041724A true JP2024041724A (ja) 2024-03-27

Family

ID=90146769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023144523A Pending JP2024041724A (ja) 2022-09-14 2023-09-06 樹脂組成物、接着剤、コーティング剤、硬化物、接着シート、樹脂付銅箔、銅張積層板及びプリント配線板

Country Status (4)

Country Link
JP (1) JP2024041724A (ko)
KR (1) KR20240037163A (ko)
CN (1) CN117700990A (ko)
TW (1) TW202411305A (ko)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6805008B2 (ja) 2017-01-31 2020-12-23 株式会社日立製作所 超音波振動子を用いた送受信方法、超音波探触子および超音波診断装置

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Publication number Publication date
CN117700990A (zh) 2024-03-15
TW202411305A (zh) 2024-03-16
KR20240037163A (ko) 2024-03-21

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