JP2024025025A - Resin composition, cured product, laminate, transparent antenna and image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition capable of obtaining a cured product having high adhesiveness to a member having a polar group.

SOLUTION: A resin composition that contains an elastomer, a polymerizable compound and a polymerization initiator contains a phosphorus-containing compound. A laminate comprises a base material film, and a transparent resin layer disposed on the base material film, and the transparent resin layer contains at least one kind selected from a group consisting of the resin composition and a cured product thereof. A transparent antenna 210 includes a transparent member 210a formed of glass, a transparent base material 210b disposed on the transparent member 210a, and a conductive member 210c disposed on the transparent base material 210b, and the transparent base material 210b includes the cured product of the resin composition. An image display device 200 includes the transparent antenna 210.

SELECTED DRAWING: Figure 4

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present disclosure relates to a resin composition, a cured product, a laminate, a transparent antenna, an image display device, and the like.

Antennas for receiving radio waves are installed in image display devices (for example, image display devices in various electronic devices such as personal computers, navigation systems, mobile phones, watches, and electronic dictionaries), components of automobiles, buildings, etc. . For example, an image display device with a built-in antenna is sometimes used.In recent years, image display devices have become smaller, thinner, and more diverse in shape, and in order to ensure design plausibility, image display devices are being used. It has been proposed to arrange a transparent antenna with low visibility (hereinafter also referred to as a "transparent antenna") on an image display unit for displaying images. Various members have been considered for obtaining a transparent antenna (for example, see Patent Document 1 below).

JP2011-091788A

As a constituent member of a transparent antenna, a laminate including a cured product of a resin composition and a member that comes into contact with the cured product may be used. The cured product of the resin composition in such a laminate is required to have high adhesion to members that come into contact with the cured product, especially members having polar groups (for example, members containing glass (glass members)). High adhesion is required.

One aspect of the present disclosure aims to provide a resin composition capable of obtaining a cured product having high adhesion to members having polar groups. Another aspect of the present disclosure aims to provide a cured product of the resin composition. Another aspect of the present disclosure aims to provide a laminate using the resin composition or a cured product thereof. Another aspect of the present disclosure aims to provide a transparent antenna using a cured product of the resin composition. Another aspect of the present disclosure aims to provide an image display device using the transparent antenna.

In some aspects, the present disclosure relates to the following [1] to [21].
[1] A resin composition containing an elastomer, a polymerizable compound, and a polymerization initiator, the resin composition containing a phosphorus-containing compound.
[2] The resin composition according to [1], wherein the phosphorus-containing compound contains a phosphoric acid ester having a (meth)acryloyl group.
[3] The resin composition according to [1] or [2], wherein the content of the phosphorus-containing compound is 0.1 to 30 parts by mass based on 100 parts by mass of the polymerizable compound.
[4] The resin composition according to any one of [1] to [3], wherein the elastomer contains a styrenic block copolymer.
[5] The resin composition according to any one of [1] to [4], wherein the elastomer contains a styrene-butadiene-styrene block copolymer.
[6] The resin composition according to any one of [1] to [5], wherein the content of the elastomer is 50% by mass or more based on the total mass of the resin composition.
[7] The resin composition according to any one of [1] to [6], wherein the polymerizable compound contains a (meth)acrylic compound.
[8] The resin composition according to any one of [1] to [7], wherein the polymerizable compound contains an alkanediol di(meth)acrylate.
[9] The resin composition according to any one of [1] to [8], wherein the polymerizable compound includes a compound represented by the following general formula (I).

[In the formula, R ¹ represents a group containing 9 or less carbon atoms and 2 or more oxygen atoms, and R ^2a and R ^2b each independently represent a hydrogen atom or a methyl group. ]
[10] The resin composition according to any one of [1] to [9], wherein the polymerization initiator contains a peroxide.
[11] The resin composition according to any one of [1] to [10], wherein the polymerization initiator contains a peroxyester.
[12] A cured product of the resin composition according to any one of [1] to [11].
[13] A base film and a transparent resin layer disposed on the base film, the transparent resin layer comprising the resin composition according to any one of [1] to [11] and A laminate containing at least one selected from the group consisting of cured products thereof.
[14] The laminate according to [13], further comprising a conductive member disposed on the transparent resin layer.
[15] The laminate according to [14], wherein the conductive member contains copper.
[16] The laminate according to [14] or [15], wherein the conductive member has a thickness of 5 μm or less.
[17] A transparent base material and a conductive member disposed on the transparent base material, wherein the transparent base material is cured of the resin composition according to any one of [1] to [11]. Transparent antenna containing objects.
[18] The transparent antenna according to [17], further comprising a support member that supports the transparent base material, and the support member includes glass.
[19] The transparent antenna according to [17] or [18], wherein the conductive member has a mesh shape.
[20] The transparent antenna according to any one of [17] to [19], wherein the conductive member contains copper.
[21] An image display device comprising the transparent antenna according to any one of [17] to [20].

According to one aspect of the present disclosure, it is possible to provide a resin composition capable of obtaining a cured product having high adhesion to members having polar groups. According to another aspect of the present disclosure, a cured product of the resin composition can be provided. According to another aspect of the present disclosure, a laminate using the resin composition or a cured product thereof can be provided. According to another aspect of the present disclosure, a transparent antenna using a cured product of the resin composition can be provided. According to another aspect of the present disclosure, an image display device using the transparent antenna can be provided.

FIG. 2 is a schematic cross-sectional view showing an example of a laminate. FIG. 2 is a schematic cross-sectional view showing an example of a laminate. 1 is a schematic cross-sectional view showing an example of an image display device. 1 is a schematic cross-sectional view showing an example of an image display device.

Embodiments of the present disclosure will be described in detail below. However, the present disclosure is not limited to the following embodiments.

In this specification, a numerical range indicated using "~" indicates a range that includes the numerical values written before and after "~" as the minimum and maximum values, respectively. The numerical range "A or more" means A and a range exceeding A. The numerical range "A or less" means a range of A and less than A. In the numerical ranges described stepwise in this specification, the upper limit or lower limit of the numerical range of one step can be arbitrarily combined with the upper limit or lower limit of the numerical range of another step. In the numerical ranges described in this specification, the upper limit or lower limit of the numerical range may be replaced with the values shown in the examples. "A or B" may include either A or B, or may include both. The materials exemplified herein can be used alone or in combination of two or more, unless otherwise specified. In the present specification, if there are multiple substances corresponding to each component in the composition, the content of each component in the composition refers to the total amount of the multiple substances present in the composition, unless otherwise specified. means. When observed as a plan view, the term "layer" includes a structure having a shape formed on the entire surface as well as a structure having a shape formed in a part of the layer. The term "process" is included in the term not only an independent process but also a process that cannot be clearly distinguished from other processes as long as the intended effect of the process is achieved. "(Meth)acrylate" means at least one of acrylate and methacrylate corresponding thereto. The same applies to other similar expressions such as "(meth)acrylic". The content of the (meth)acrylic compound means the total amount of the acrylic compound and the methacrylic compound. The content of the elastomer, polymerizable compound, or polymerization initiator includes the content of phosphorus-containing compounds that fall under these components, and includes components under the subconcepts of the elastomer, polymerizable compound, or polymerization initiator (for example, (meth)acrylic compounds). The same applies to the content of ).

The resin composition according to this embodiment is a resin composition containing an elastomer, a polymerizable compound, and a polymerization initiator, and also contains a phosphorus-containing compound. The resin composition according to the present embodiment contains at least one phosphorus-containing compound, and may contain at least one selected from the group consisting of an elastomer, a polymerizable compound, and a polymerization initiator. It may contain a phosphorus-containing compound that is not an elastomer, a polymerizable compound, or a polymerization initiator. When at least one selected from the group consisting of an elastomer, a polymerizable compound, and a polymerization initiator is a phosphorus-containing compound, the resin composition according to this embodiment is a phosphorus-containing compound that does not fall under the elastomer, polymerizable compound, and polymerization initiator. May contain.

The resin composition according to this embodiment may be used as a thermosetting resin composition or as a photocurable resin composition. The cured product according to this embodiment is obtained by curing the resin composition according to this embodiment, and is a cured product of the resin composition according to this embodiment. The cured product according to this embodiment may be in a semi-cured state or in a fully cured state.

According to the resin composition according to the present embodiment, it is possible to obtain a cured product that has high adhesion to a member having a polar group (a member (such as a substrate) having a polar group on the surface that contacts the cured product; for example, a glass member). Can be done. According to the resin composition according to the present embodiment, in the evaluation method described in Examples below, for example, 0.20 kN/m or more (preferably 0.40 kN/m or more, 0.50 kN/m or more, 0. A tensile stress of 60 kN/m or more can be obtained. It is presumed that a cured product having high adhesiveness can be obtained by interaction between a polar group (hydroxy group, carboxyl group, etc.) and a phosphorus-containing part (for example, P=O(OH) structure). However, the factors for obtaining high adhesion are not limited to this content. The resin composition according to the present embodiment may be used as long as it is possible to obtain a cured product having high adhesion to a member having a polar group, and it is not limited to a mode in which the cured product comes into contact with a member having a polar group. It may be used in an embodiment in which the cured product does not come into contact with the member having the base.

According to one aspect of the resin composition according to the present embodiment, a cured product having high adhesion to members having polar groups and excellent transparency can be obtained.

The resin composition according to this embodiment contains a phosphorus-containing compound (a compound containing a phosphorus atom). The phosphorus-containing compound may be at least one selected from the group consisting of elastomers, polymerizable compounds, and polymerization initiators, and may be a compound that does not fall under the elastomers, polymerizable compounds, and polymerization initiators. The phosphorus-containing compound may be a polymerizable compound from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups.

The phosphorus-containing compound may include a phosphorus-containing compound having a P=O(OH) structure from the viewpoint of easily obtaining a cured product having high adhesion to a member having a polar group. In a phosphorus-containing compound having a P=O(OH) structure, as shown in the general formula (P1) below, an oxygen atom is bonded to a phosphorus atom via a double bond, and a hydroxyl atom is bonded to the phosphorus atom via a single bond. The groups are bonded. In the phosphorus-containing compound, the number of P=O(OH) structures (number in one molecule) may be one.

[In the formula, p11 represents an integer of 1 to 3, p12 represents an integer of 0 to 2, p11+p12 is 3, and R ^p1 represents a monovalent group. ]

p11 may be 1 to 2 or 2 to 3 from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups.

The phosphorus-containing compound may have a monovalent group (R ^p1 in general formula (P1)) different from a hydroxy group as a functional group bonded to a phosphorus atom. Examples of the monovalent group include a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group (for example, a phenyl group), a (meth)acryloyl group-containing group, and the like. The (meth)acryloyl group-containing group is a group having at least one type selected from the group consisting of an acryloyl group and a methacryloyl group.

The phosphorus-containing compound may include a (meth)acrylate compound having a P=O(OH) structure and having a (meth)acryloyl group from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. It may contain a phosphoric acid ester, and may contain at least one selected from the group consisting of a compound represented by the following general formula (P2) and a compound represented by the following general formula (P3).

[Wherein, p21 represents an integer of 1 or 2, p22 represents an integer of 1 or 2, p21+p22 represents 3, p23 represents an integer of 1 or more, and R ^p2 represents a hydrogen atom or a methyl group. ]

[In the formula, p31 represents an integer of 1 or 2, p32 represents an integer of 1 or 2, p31+p32 is 3, p33 and p34 each independently represent an integer of 1 or more, R ^p3 is a hydrogen atom Or represents a methyl group. ]

p21 may be 2 from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. p23 may be 1 to 4, 2 to 4, 1 to 3, or 1 to 2 from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. p33 is 1 to 8, 1 to 6, 1 to 5, 3 to 8, 3 to 6, 3 to 5, 5 to 8, Alternatively, it may be 5 to 6. p34 may be 1 to 4, 2 to 4, 1 to 3, or 1 to 2 from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups.

Examples of the phosphorus-containing compound include phosphoric acid ester, phosphoric acid, phenylphosphonic acid, triphenylphosphine, triphenylphosphine oxide, and the like. The phosphorus-containing compound may contain a phosphoric acid ester, and may contain at least one selected from the group consisting of a phosphoric acid monoester and a phosphoric diester, from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. That's fine. A phosphoric acid ester is a compound having a structure in which at least a portion of the three hydrogen atoms (hydrogen atoms bonded to a phosphorus atom) of phosphoric acid are substituted with an organic group.

Examples of phosphoric acid esters include mono- or bis(2-(meth)acryloyloxyethyl) phosphoric ester, mono- or bis(2-(meth)acryloyloxypropyl) phosphoric ester, mono- or bis(3-(meth)acryloyl) oxypropyl) phosphate ester, mono- or bis(6-(meth)acryloyloxyhexyl) phosphate ester, mono- or bis(10-(meth)acryloyloxydecyl) phosphate ester, mono- or bis(1-chloromethyl- 2-(meth)acryloyloxyethyl) phosphate ester, 2-(meth)acryloyloxyethyl phenyl phosphate ester, reaction product of 6-hexanolide addition polymer of 2-hydroxyethyl methacrylate and phosphoric anhydride; Examples include lactone-modified products and polyoxyalkylene-modified products.

Content P1 as the content of a phosphorus-containing compound, the content of a phosphorus-containing compound having a P=O(OH) structure, the content of a phosphoric ester, or the content of a phosphoric ester having a (meth)acryloyl group may be in the following range based on 100 parts by mass of elastomer, 100 parts by mass of styrenic polymer, or 100 parts by mass of styrenic block copolymer. The content P1 is 0.01 parts by mass or more, 0.05 parts by mass or more, 0.1 parts by mass or more, 0.2 parts by mass, from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. The amount may be 0.3 parts by mass or more, 0.4 parts by mass or more, 0.5 parts by mass or more, or 0.6 parts by mass or more. From the viewpoint of adjusting the adhesion to a member having a polar group, the content P1 is 0.7 parts by mass or more, 0.8 parts by mass or more, 1 part by mass or more, 1.5 parts by mass or more, 2 parts by mass or more, The amount may be 3 parts by mass or more, or 5 parts by mass or more. The content P1 is 10 parts by mass or less, 8 parts by mass or less, 5 parts by mass or less, 3 parts by mass or less, 2 parts by mass or less, 1 The amount may be .5 parts by weight or less, 1 part by weight or less, 0.8 parts by weight or less, or 0.7 parts by weight or less. The content P1 is 0.6 parts by mass or less, 0.5 parts by mass or less, 0.4 parts by mass or less, 0.6 parts by mass or less, 0.5 parts by mass or less, 0.6 parts by mass or less, 0.4 parts by mass or less, from the viewpoint of adjusting the adhesion to a member having a polar group and from the viewpoint of excellent compatibility. It may be 3 parts by mass or less, or 0.2 parts by mass or less. From these viewpoints, the content P1 is 0.01 to 10 parts by mass, 0.01 to 3 parts by mass, 0.01 to 1 part by mass, 0.1 to 10 parts by mass, 0.1 to 3 parts by mass, 0.1 to 1 part by mass, 0.3 to 10 parts by mass, 0.3 to 3 parts by mass, 0.3 to 1 part by mass, 0.5 to 10 parts by mass, 0.5 to 3 parts by mass, or It may be 0.5 to 1 part by weight.

If the polymerizable compound contains a compound that does not fall under the category of phosphorus-containing compounds, the content of phosphorus-containing compounds, the content of phosphorus-containing compounds having a P=O(OH) structure, the content of phosphoric acid esters, or the content of (meth) ) As the content of the phosphoric acid ester having an acryloyl group, the content P2 may be in the following range based on 100 parts by mass of the polymerizable compound or 100 parts by mass of the (meth)acrylic compound. Content P2 is 0.1 parts by mass or more, 0.3 parts by mass or more, 0.4 parts by mass or more, 0.5 parts by mass, from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. The amount may be 1 part by mass or more, or 2 parts by mass or more. Content P2 is 3 parts by mass or more, 4 parts by mass or more, 5 parts by mass or more, 8 parts by mass or more, 10 parts by mass or more, or 15 parts by mass or more, from the viewpoint of adjusting the adhesion to a member having a polar group. It may be. The content P2 is 30 parts by mass or less, 20 parts by mass or less, 15 parts by mass or less, 10 parts by mass or less, 8 parts by mass or less, 5 The amount may be less than or equal to 4 parts by mass, or less than or equal to 3 parts by mass. The content P2 may be 2 parts by mass or less, 1 part by mass or less, or 0.5 parts by mass or less, from the viewpoint of adjusting the adhesion to the member having a polar group and from the viewpoint of improving compatibility. . From these points of view, the content P2 is 0.1 to 30 parts by mass, 0.1 to 10 parts by mass, 0.1 to 3 parts by mass, 0.4 to 30 parts by mass, 0.4 to 10 parts by mass, It may be 0.4 to 3 parts by weight, 1 to 30 parts by weight, 1 to 10 parts by weight, 1 to 3 parts by weight, 2 to 30 parts by weight, 2 to 10 parts by weight, or 2 to 3 parts by weight.

Content P3 as the content of a phosphorus-containing compound, the content of a phosphorus-containing compound having a P=O(OH) structure, the content of a phosphoric ester, or the content of a phosphoric ester having a (meth)acryloyl group is the total weight of the resin composition (excluding the weight of the organic solvent), the total amount of the elastomer, the polymerizable compound, and the polymerization initiator, the total amount of the elastomer, the (meth)acrylic compound, and the polymerization initiator, and the total amount of the styrene block copolymer. total amount of the (meth)acrylic compound and polymerization initiator, total amount of the elastomer and polymerizable compound, total amount of the elastomer and (meth)acrylic compound, or total amount of the styrenic block copolymer and (meth)acrylic compound. It may be in the following range based on the total amount. Content P3 is 0.01% by mass or more, 0.05% by mass or more, 0.09% by mass or more, 0.1% by mass from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. 0.15% by mass or more, 0.2% by mass or more, 0.25% by mass or more, 0.3% by mass or more, 0.35% by mass or more, 0.4% by mass or more, or 0.45% by mass % or more. Content P3 is 0.5% by mass or more, 0.6% by mass or more, 0.7% by mass or more, 0.8% by mass or more, 0.9% from the viewpoint of adjusting the adhesion to a member having a polar group. mass% or more, 1 mass% or more, 1.5 mass% or more, 1.8 mass% or more, 2 mass% or more, 2.5 mass% or more, 3 mass% or more, or 3.5 mass% or more. You can. Content P3 is 10% by mass or less, 8% by mass or less, 5% by mass or less, 4% by mass or less, 3.5% by mass or less, from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. , 3% by mass or less, 2.5% by mass or less, 2% by mass or less, 1.8% by mass or less, 1.5% by mass or less, 1% by mass or less, 0.9% by mass or less, 0.8% by mass or less , 0.7% by mass or less, 0.6% by mass or less, or 0.5% by mass or less. The content P3 is 0.45 mass% or less, 0.4 mass% or less, 0.35 mass% or less, 0.45 mass% or less, 0.4 mass% or less, 0.45 mass% or less, 0.45 mass% or less, from the viewpoint of adjusting adhesiveness to a member having a polar group and from the viewpoint of excellent compatibility. It may be 3% by mass or less, 0.25% by mass or less, 0.2% by mass or less, 0.15% by mass or less, or 0.1% by mass or less. From these points of view, the content P3 is 0.01 to 10% by mass, 0.01 to 2% by mass, 0.01 to 1% by mass, 0.01 to 0.5% by mass, 0.2 to 10% by mass. %, 0.2-2% by mass, 0.2-1% by mass, 0.2-0.5% by mass, 0.4-10% by mass, 0.4-2% by mass, 0.4-1% by mass % or 0.4 to 0.5% by mass.

The resin composition according to this embodiment contains an elastomer. Examples of the elastomer include styrene elastomer, olefin elastomer, urethane elastomer, polyester elastomer, polyamide elastomer, silicone elastomer, and the like. The elastomer may include a styrene-based elastomer from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. As the elastomer, an elastomer containing no phosphorus atom may be used.

The styrenic elastomer may be a polymer having a styrene compound as a monomer unit (a polymer having a monomer unit derived from a styrene compound; hereinafter referred to as a "styrene polymer"). Styrene compounds include styrene; alkylstyrenes such as methylstyrene, dimethylstyrene, trimethylstyrene, ethylstyrene, diethylstyrene, triethylstyrene, propylstyrene, butylstyrene, hexylstyrene, heptylstyrene, and octylstyrene; fluorostyrene, chlorostyrene, Examples include halogenated styrenes such as bromostyrene, dibromostyrene, and iodostyrene; nitrostyrene; acetylstyrene; and methoxystyrene. The styrenic polymer may have styrene as a monomer unit from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups.

Examples of styrene-based polymers include styrene-butadiene random copolymer, styrene-butadiene-styrene block copolymer, styrene-butylene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, and styrene-ethylene block copolymer. -butylene-styrene block copolymers, styrene-ethylene-propylene-styrene block copolymers, and hydrogenated copolymers thereof.

The elastomer may contain a styrenic block copolymer from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. The styrenic block copolymer may be a block copolymer having one styrene compound monomer unit and another styrene compound monomer unit, and the styrenic compound monomer unit, and It may be a block copolymer having monomer units of compounds other than styrene compounds. The elastomer may contain a styrene-butadiene-styrene block copolymer from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups.

The styrenic polymer may be modified with a carboxylic acid anhydride or not modified with a carboxylic acid anhydride. Examples of the carboxylic anhydride include dicarboxylic anhydrides such as maleic anhydride, phthalic anhydride, and itaconic anhydride. The elastomer may contain a styrenic block copolymer modified with a carboxylic acid anhydride, and a styrenic block copolymer modified with a maleic anhydride, from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. block copolymers, which may include carboxylic anhydride-modified styrene-butadiene-styrene block copolymers, and maleic anhydride-modified styrene-butadiene-styrene block copolymers. good.

The content of the monomer unit of the styrene compound or the content of the monomer unit of styrene is determined based on the total mass of the styrenic polymer from the viewpoint of making it easier to obtain a cured product with high adhesion to members having polar groups. Or, it may be in the following range based on the total mass of the styrenic block copolymer. The content of monomer units is 5% by mass or more, 10% by mass or more, 15% by mass or more, 20% by mass or more, 25% by mass or more, 30% by mass or more, 35% by mass or more, or 40% by mass or more. It may be. The content of monomer units is 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, 55% by mass or less, 50% by mass or less, 45% by mass or less, or , 40% by mass or less. From these viewpoints, the content of monomer units is 5 to 80% by mass, 5 to 60% by mass, 5 to 50% by mass, 20 to 80% by mass, 20 to 60% by mass, 20 to 50% by mass, It may be 30-80% by weight, 30-60% by weight, or 30-50% by weight.

The content of the styrenic polymer or the content of the styrene block copolymer is set at 50% by mass based on the total mass of the elastomer, from the viewpoint of easily obtaining a cured product with high adhesion to members having polar groups. % or more, more than 50 mass%, 70 mass% or more, 90 mass% or more, 95 mass% or more, or 99 mass% or more. An embodiment in which the elastomer contained in the resin composition substantially consists of a styrenic polymer or a styrenic block copolymer (the content of the styrenic polymer or the content of the styrenic block copolymer is The content may be substantially 100% by mass based on the total mass of the elastomer contained in the elastomer.

As the content of the elastomer, the content of the styrene polymer, or the content of the styrene block copolymer, the content A is determined from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. The total mass of the resin composition (excluding the mass of the organic solvent), the total amount of the elastomer, the polymerizable compound, and the polymerization initiator, the total amount of the elastomer, the (meth)acrylic compound, and the polymerization initiator, the styrenic block copolymer, Total amount of (meth)acrylic compound and polymerization initiator, total amount of elastomer and polymerizable compound, total amount of elastomer and (meth)acrylic compound, or total amount of styrenic block copolymer and (meth)acrylic compound It may be in the following range based on . Content A is 20% by mass or more, more than 20% by mass, 30% by mass or more, more than 30% by mass, 40% by mass or more, more than 40% by mass, 50% by mass or more, more than 50% by mass, 60% by mass or more, It may be 65% by mass or more, 70% by mass or more, 75% by mass or more, or 78% by mass or more. Content A may be 99% by mass or less, 95% by mass or less, 90% by mass or less, 85% by mass or less, 82% by mass or less, or 80% by mass or less. From these points of view, content A is 20-99% by mass, 20-90% by mass, 20-85% by mass, 50-99% by mass, 50-90% by mass, 50-85% by mass, 70-99% by mass. %, 70-90% by weight, or 70-85% by weight.

The resin composition according to this embodiment contains a polymerizable compound. As the polymerizable compound, a polymerizable compound containing a phosphorus atom (the above-mentioned phosphorus-containing compound) may be used, or a polymerizable compound not containing a phosphorus atom may be used. As the polymerizable compound, a compound that is polymerized by heating, irradiation with actinic rays (ultraviolet rays, etc.), etc. can be used.

Examples of the polymerizable compound include radical polymerizable compounds, cationic polymerizable compounds, anionic polymerizable compounds, and the like. The polymerizable compound may include a radically polymerizable compound from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups.

Examples of polymerizable compounds include (meth)acrylic compounds (compounds having a (meth)acryloyl group), epoxy compounds (compounds having an epoxy group), maleimide compounds, vinylidene halide compounds, vinyl ether compounds, vinyl ester compounds, vinylamide compounds, Aromatic vinyl compounds (e.g. vinylpyridine compounds), allyl compounds, styrene compounds, (meth)acrylamide compounds, nadimide compounds, natural rubber, isoprene rubber, butyl rubber, nitrile rubber, butadiene rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, Examples include carboxylated nitrile rubber, oxetane compounds, and lactone compounds. The polymerizable compound may include a compound having an ethylenically unsaturated bond, and may include a (meth)acrylic compound, from the viewpoint of easily obtaining a cured product having high adhesion to a member having a polar group. As the (meth)acrylic compound, a compound having no epoxy group may be used.

The (meth)acrylic compound is selected from the group consisting of monofunctional (meth)acrylic compounds and polyfunctional (meth)acrylic compounds (bifunctional (meth)acrylic compounds or trifunctional or more functional (meth)acrylic compounds). may contain at least one type of For example, a "bifunctional (meth)acrylic compound" means a compound in which the total number of acryloyl groups and methacryloyl groups in one molecule is 2. The (meth)acrylic compound may include a bifunctional (meth)acrylic compound from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups.

Monofunctional (meth)acrylic compounds (excluding compounds that fall under phosphorus-containing compounds) include methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, and tert-butyl (meth)acrylate. ) acrylate, butoxyethyl (meth)acrylate, isoamyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, heptyl (meth)acrylate, octylheptyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, undecyl (meth)acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, stearyl (meth)acrylate, behenyl (meth)acrylate ) acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-chloro-2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, methoxypolyethylene glycol (meth)acrylate , ethoxypolyethylene glycol (meth)acrylate, methoxypolypropylene glycol (meth)acrylate, ethoxypolypropylene glycol (meth)acrylate, mono(2-(meth)acryloyloxyethyl)succinate; aliphatic (meth)acrylates such as cyclopentyl (meth)acrylate; ) acrylate, cyclohexyl (meth)acrylate, cyclopentyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, isobornyl (meth)acrylate, mono(2-(meth)acryloyloxyethyl) Alicyclic (meth)acrylates such as tetrahydrophthalate, mono(2-(meth)acryloyloxyethyl)hexahydrophthalate; benzyl (meth)acrylate, phenyl (meth)acrylate, o-biphenyl (meth)acrylate, 1- naphthyl (meth)acrylate, 2-naphthyl (meth)acrylate, phenoxyethyl (meth)acrylate, p-cumylphenoxyethyl (meth)acrylate, o-phenylphenoxyethyl (meth)acrylate, 1-naphthoxyethyl (meth)acrylate, 2-naphthoxyethyl (meth)acrylate, phenoxypolyethylene glycol (meth)acrylate, nonylphenoxypolyethylene glycol (meth)acrylate, phenoxypolypropylene glycol (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-hydroxy- Aromas such as 3-(o-phenylphenoxy)propyl (meth)acrylate, 2-hydroxy-3-(1-naphthoxy)propyl (meth)acrylate, 2-hydroxy-3-(2-naphthoxy)propyl (meth)acrylate, etc. Heterocyclic (meth)acrylates such as 2-tetrahydrofurfuryl (meth)acrylate, N-(meth)acryloyloxyethyl hexahydrophthalimide, 2-(meth)acryloyloxyethyl-N-carbazole, etc. Acrylate; examples include caprolactone modified products of these.

Bifunctional (meth)acrylic compounds (excluding compounds that fall under phosphorus-containing compounds) include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, and tetraethylene glycol di(meth)acrylate. meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, tetrapropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate (meth)acrylate, ethoxylated polypropylene glycol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 3- Methyl-1,5-pentanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 2-butyl-2-ethyl-1,3-propanediol di(meth)acrylate, nonanediol di( meth)acrylate (e.g. 1,9-nonanediol di(meth)acrylate), decanediol di(meth)acrylate (e.g. 1,10-decanediol di(meth)acrylate), dodecanediol di(meth)acrylate (e.g. 1 , 12-dodecanediol di(meth)acrylate), glycerin di(meth)acrylate, and aliphatic (meth)acrylates such as ethoxylated 2-methyl-1,3-propanediol di(meth)acrylate (e.g. alkanediol di(meth)acrylate) cyclohexanedimethanol di(meth)acrylate); cyclohexanedimethanol di(meth)acrylate, ethoxylated cyclohexanedimethanol di(meth)acrylate, propoxylated cyclohexanedimethanol di(meth)acrylate, ethoxylated propoxylated cyclohexanedimethanol di(meth)acrylate, Cyclodecane dimethanol di(meth)acrylate, Ethoxylated tricyclodecane dimethanol di(meth)acrylate, Propoxylated tricyclodecane dimethanol di(meth)acrylate, Ethoxylated propoxylated tricyclodecane dimethanol di(meth)acrylate , ethoxylated hydrogenated bisphenol A di(meth)acrylate, propoxylated hydrogenated bisphenol A di(meth)acrylate, ethoxylated propoxylated hydrogenated bisphenol A di(meth)acrylate, ethoxylated hydrogenated bisphenol F di(meth)acrylate , propoxylated hydrogenated bisphenol F di(meth)acrylate, cycloaliphatic (meth)acrylates such as ethoxylated propoxylated hydrogenated bisphenol F di(meth)acrylate; ethoxylated bisphenol A di(meth)acrylate, propoxylated bisphenol A di(meth)acrylate, ethoxylated propoxylated bisphenol A di(meth)acrylate, ethoxylated bisphenol F di(meth)acrylate, propoxylated bisphenol F di(meth)acrylate, ethoxylated propoxylated bisphenol F di(meth)acrylate, Ethoxylated bisphenol AF di(meth)acrylate, propoxylated bisphenol AF di(meth)acrylate, ethoxylated propoxylated bisphenol AF di(meth)acrylate, ethoxylated fluorene type di(meth)acrylate, propoxylated fluorene type di(meth)acrylate Aromatic (meth)acrylates such as acrylate, ethoxylated propoxylated fluorene type di(meth)acrylate; dioxane glycol di(meth)acrylate, ethoxylated isocyanuric acid di(meth)acrylate, propoxylated isocyanuric acid di(meth)acrylate, Heterocyclic (meth)acrylates such as ethoxylated propoxylated isocyanuric acid di(meth)acrylates; caprolactone modified versions of these; aliphatic epoxy (meth)acrylates such as neopentyl glycol type epoxy (meth)acrylates; cyclohexanedimethanol type Alicyclic epoxy (meth)acrylates such as epoxy (meth)acrylate, hydrogenated bisphenol A type epoxy (meth)acrylate, hydrogenated bisphenol F type epoxy (meth)acrylate; resorcinol type epoxy (meth)acrylate, bisphenol A type epoxy Examples include aromatic epoxy (meth)acrylates such as (meth)acrylate, bisphenol F type epoxy (meth)acrylate, bisphenol AF type epoxy (meth)acrylate, and fluorene type epoxy (meth)acrylate.

Trimethylolpropane tri(meth)acrylates, ethoxylated trimethylolpropane tri(meth)acrylates, propoxylated trimethylolpropane tri(meth)acrylates, trimethylolpropane tri(meth)acrylates, trimethylolpropane tri(meth)acrylates, propoxylated trimethylolpropane tri(meth)acrylates, etc. meth)acrylate, ethoxylated propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, ethoxylated pentaerythritol tri(meth)acrylate, propoxylated pentaerythritol tri(meth)acrylate, ethoxylated propoxylated penta Erythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ethoxylated pentaerythritol tetra(meth)acrylate, propoxylated pentaerythritol tetra(meth)acrylate, ethoxylated propoxylated pentaerythritol tetra(meth)acrylate, ditrimethylolpropane Aliphatic (meth)acrylates such as tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, ethoxylated dipentaerythritol hexa(meth)acrylate, propoxylated dipentaerythritol hexa(meth)acrylate; ethoxylated isocyanuric acid tri Heterocyclic (meth)acrylates such as (meth)acrylate, propoxylated isocyanuric acid tri(meth)acrylate, and ethoxylated propoxylated isocyanuric acid tri(meth)acrylate; caprolactone modified products of these; phenol novolac type epoxy (meth)acrylates , aromatic epoxy (meth)acrylates such as cresol novolac type epoxy (meth)acrylates, and the like.

The (meth)acrylic compound may contain aliphatic (meth)acrylate from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. The (meth)acrylic compound may contain alkanediol di(meth)acrylate, nonanediol di(meth)acrylate, and dodecanediol, from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. It may contain at least one selected from the group consisting of di(meth)acrylates. The (meth)acrylic compound may include an acrylic compound.

The (meth)acrylic compound may include a compound represented by the following general formula (I) from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups.

[In the formula, R ¹ represents a group containing 9 or less carbon atoms and 2 or more oxygen atoms, and R ^2a and R ^2b each independently represent a hydrogen atom or a methyl group. ]

R ¹ has 1 to 9 carbon atoms. The carbon atoms of ^R1 are 2 or more, 3 or more, 4 or more, 5 or more, 6 or more, 7 or more, or 8 or more, from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. It's fine. The number of oxygen atoms in R ¹ may be 6 or less, 5 or less, 4 or less, 3 or less, or 2 or less, from the viewpoint of easily obtaining a cured product having high adhesion to a member having a polar group. R ¹ may be a hydrocarbon group having oxygen atoms bonded to both ends, and may be a "-O-C _n H _2n -O-" group (n=1 to 9). R ¹ does not need to contain a phosphorus atom. The (meth)acrylic compound may include a compound in which R ¹ in the general formula (I) does not have a cyclic structure, from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups; I) may include a compound in which R ¹ does not have an alicyclic ring.

The content of the compound represented by general formula (I) is determined based on the total mass of the polymerizable compound or the total mass of the (meth)acrylic compound, from the viewpoint of easily obtaining a cured product with high adhesion to members having polar groups. Based on the mass, 50% by mass or more, more than 50% by mass, 70% by mass or more, 90% by mass or more, 95% by mass or more, 96% by mass or more, 97% by mass or more, 98% by mass or more, 99% by mass or more, Or it may be more than 99% by mass. An embodiment in which the polymerizable compound or (meth)acrylic compound contained in the resin composition substantially consists of a compound represented by general formula (I) (the content of the compound represented by general formula (I) is The content may be substantially 100% by mass based on the total mass of the polymerizable compound or (meth)acrylic compound contained in the resin composition.

The (meth)acrylic compound may include a (meth)acrylic compound having a hydroxy group, and may not include a (meth)acrylic compound having a hydroxy group. The content of the (meth)acrylic compound having a hydroxy group is 5% by mass or less, less than 5% by mass, 1% by mass or less, based on the total mass of the polymerizable compound or the total mass of the (meth)acrylic compound. It may be 0.1% by weight or less, 0.01% by weight or less, or substantially 0% by weight.

The molecular weight of the (meth)acrylic compound may be within the following range from the viewpoint of easily obtaining a cured product having high adhesiveness to members having polar groups. The molecular weight of the (meth)acrylic compound may be 80 or more, 100 or more, 120 or more, 150 or more, 180 or more, 200 or more, 220 or more, 250 or more, or 260 or more. The molecular weight of the (meth)acrylic compound may be 1000 or less, 800 or less, 600 or less, 550 or less, 500 or less, 450 or less, 400 or less, 350 or less, 320 or less, 300 or less, or 280 or less. From these viewpoints, the molecular weight of the (meth)acrylic compound is 80-1000, 80-500, 80-400, 80-300, 200-1000, 200-500, 200-400, 200-300, 250-1000, It may be 250-500, 250-400, or 250-300.

As the content of the polymerizable compound or the content of the (meth)acrylic compound, the content B1 is determined by 100 parts by mass of the elastomer, styrene-based The amount may be in the following range based on 100 parts by mass of the polymer or 100 parts by mass of the styrenic block copolymer. Content B1 may be 1 part by mass or more, 5 parts by mass or more, 10 parts by mass or more, 15 parts by mass or more, 20 parts by mass or more, or 25 parts by mass or more. Content B1 is 300 parts by mass or less, 200 parts by mass or less, 100 parts by mass or less, 80 parts by mass or less, 60 parts by mass or less, 50 parts by mass or less, 40 parts by mass or less, 30 parts by mass or less, 28 parts by mass or less, Alternatively, it may be 26 parts by mass or less. From these points of view, content B1 is 1 to 300 parts by mass, 10 to 300 parts by mass, 20 to 300 parts by mass, 1 to 100 parts by mass, 10 to 100 parts by mass, 20 to 100 parts by mass, 1 to 50 parts by mass. parts, 10 to 50 parts by weight, or 20 to 50 parts by weight.

As the content of the polymerizable compound or the content of the (meth)acrylic compound, content B2 is determined based on the total mass of the resin composition ( (excluding mass of organic solvent), total amount of elastomer, polymerizable compound and polymerization initiator, total amount of elastomer, (meth)acrylic compound and polymerization initiator, styrenic block copolymer, (meth)acrylic compound and polymerization Within the following range based on the total amount of initiator, the total amount of elastomer and polymerizable compound, the total amount of elastomer and (meth)acrylic compound, or the total amount of styrenic block copolymer and (meth)acrylic compound. It's good. Content B2 may be 1% by mass or more, 5% by mass or more, 10% by mass or more, 15% by mass or more, 18% by mass or more, or 20% by mass or more. Content B2 is 80% by mass or less, less than 80% by mass, 70% by mass or less, less than 70% by mass, 60% by mass or less, less than 60% by mass, 50% by mass or less, less than 50% by mass, 40% by mass or less, It may be 35% by mass or less, 30% by mass or less, 25% by mass or less, or 22% by mass or less. From these viewpoints, the content B2 is 1 to 80% by mass, 1 to 50% by mass, 1 to 30% by mass, 10 to 80% by mass, 10 to 50% by mass, 10 to 30% by mass, 15 to 80% by mass. %, 15-50% by weight, or 15-30% by weight.

The resin composition according to this embodiment contains a polymerization initiator. The polymerization initiator is not particularly limited as long as it is a compound that initiates polymerization by heating, irradiation with active light (ultraviolet light, etc.), but examples include thermal polymerization initiators and photopolymerization initiators (which fall under thermal polymerization initiators). (excluding compounds that do). As the polymerization initiator, a polymerization initiator containing no phosphorus atom may be used.

Examples of thermal polymerization initiators include ketone peroxides such as methyl ethyl ketone peroxide, cyclohexanone peroxide, and methylcyclohexanone peroxide; 1,1-bis(tert-butylperoxy)cyclohexane, 1,1-bis(tert-butylperoxy); )-2-methylcyclohexane, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(tert-hexylperoxy)cyclohexane, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(tert-hexylperoxy)cyclohexane, -hexylperoxy)-3,3,5-trimethylcyclohexane; hydroperoxides such as p-menthane hydroperoxide; α,α'-bis(tert-butylperoxy)diisopropylbenzene, dicumyl peroxide, dialkyl peroxide such as tert-butylcumyl peroxide, di-tert-butyl peroxide; diacyl peroxide such as octanoyl peroxide, lauroyl peroxide, stearyl peroxide, benzoyl peroxide; bis(4-tert tert-butyl peroxy pivalate, tert-hexylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis(2-ethylhexanoylperoxy) oxy)hexane, tert-hexylperoxy-2-ethylhexanoate, tert-butylperoxy-2-ethylhexanoate, tert-butylperoxyisobutyrate, tert-hexylperoxyisopropyl monocarbonate, tert- Butylperoxy-3,5,5-trimethylhexanoate, tert-butylperoxylaurylate, tert-butylperoxyisopropyl monocarbonate, tert-butylperoxy-2-ethylhexyl monocarbonate, tert-butylperoxybenzoate , tert-hexyl peroxybenzoate, 2,5-dimethyl-2,5-bis(benzoyl peroxy)hexane, tert-butyl peroxy acetate, and other peroxy esters; phthalic anhydride, maleic anhydride, trimellitic anhydride , hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylnadic anhydride, nadic anhydride, glutaric anhydride, dimethylglutaric anhydride, diethylglutaric anhydride, succinic anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride , 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 4,4'-biphthalic anhydride, 4,4'-carbonyldiphthalic anhydride, 4,4'-sulfonyldiphthalic anhydride , 4,4'-(hexafluoroisopropylidene) diphthalic anhydride, 4,4'-oxydiphthalic anhydride, 9,9-bis(3,4-dicarboxyphenyl)fluorene dianhydride, 2,3, Acid anhydrides such as 6,7-naphthalenetetracarboxylic dianhydride; 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'- Examples include azo compounds such as azobis(4-methoxy-2'-dimethylvaleronitrile).

Examples of the photopolymerization initiator include acylphosphine oxide compounds, acetophenone compounds, anthraquinone compounds, benzophenone compounds, imidazole compounds, acridine compounds, and oxime ester compounds.

The polymerization initiator may include a thermal radical polymerization initiator or a thermal cationic polymerization initiator from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. The polymerization initiator may contain a peroxide, may contain a peroxy ester, and may contain a 2,5-dimethyl-2,5- Bis(2-ethylhexanoylperoxy)hexane may be included.

The content of the polymerization initiator is the total mass of the resin composition (excluding the mass of the organic solvent), the total amount of the elastomer, the polymerizable compound, and the polymerization initiator, and the total amount of the elastomer, (meth)acrylic compound, and polymerization initiator. , total amount of styrenic block copolymer, (meth)acrylic compound and polymerization initiator, total amount of elastomer and polymerizable compound, total amount of elastomer and (meth)acrylic compound, or styrenic block copolymer and The amount may be within the following range based on the total amount of the (meth)acrylic compound. The content of the polymerization initiator is 0.01% by mass or more and 0.05% by mass from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups and from the viewpoint of easily obtaining excellent curability. The content may be 0.1% by mass or more, 0.3% by mass or more, 0.5% by mass or more, 0.8% by mass or more, or 0.9% by mass or more. The content of the polymerization initiator is 10% by mass or less, 8% by mass or less, 5% by mass or less, 3% by mass or less, 2% by mass from the viewpoint of easily obtaining a cured product having high adhesion to members having polar groups. Below, it may be 1.5% by mass or less, or 1% by mass or less. From these viewpoints, the content of the polymerization initiator is 0.01 to 10% by mass, 0.01 to 5% by mass, 0.01 to 2% by mass, 0.1 to 10% by mass, 0.1 to 5% by mass. % by weight, 0.1-2% by weight, 0.5-10% by weight, 0.5-5% by weight, or 0.5-2% by weight.

The resin composition according to this embodiment may contain additives other than the elastomer, polymerizable compound, and polymerization initiator. Such additives include curing accelerators, antioxidants, ultraviolet absorbers, visible light absorbers, colorants, plasticizers, stabilizers, fillers, reducing agents, bicarbonates, etc. . Examples of the reducing agent include vanadyl acetylacetonate, vanadium acetylacetonate, cobalt acetylacetonate, copper acetylacetonate, vanadyl naphthenate, vanadyl stearate, copper naphthenate, copper acetate, cobalt octylate, and the like.

The content of filler is based on the total amount of elastomer and polymerizable compound, the total amount of elastomer and (meth)acrylic compound, or the total amount of styrenic block copolymer and (meth)acrylic compound. , 100% by mass or less, less than 100% by mass, 50% by mass or less, 20% by mass or less, less than 20% by mass, 10% by mass or less, 1% by mass or less, 0.1% by mass or less, or substantially 0 mass% It may be %. The content of the reducing agent is 0.01 parts by mass or less, less than 0.01 parts by mass, 0.001 parts by mass or less, or 100 parts by mass of the polymerizable compound or 100 parts by mass of the (meth)acrylic compound. , may be substantially 0 parts by weight. The content of hydrogen carbonate is 0.1 parts by mass or less, less than 0.1 parts by mass, 0.01 parts by mass or less, based on 100 parts by mass of the polymerizable compound or 100 parts by mass of the (meth)acrylic compound. It may be 0.001 parts by weight or less, or substantially 0 parts by weight.

The resin composition according to this embodiment may contain an organic solvent. The resin composition according to this embodiment may be used as a resin varnish by diluting it with an organic solvent. Examples of organic solvents include aromatic hydrocarbons such as toluene, xylene, mesitylene, cumene, and p-cymene; cyclic ethers such as tetrahydrofuran and 1,4-dioxane; acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, and 4-hydroxy-4 - Ketones such as methyl-2-pentanone; Esters such as methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, γ-butyrolactone; Carbonic esters such as ethylene carbonate and propylene carbonate; N,N-dimethylformamide, N , N-dimethylacetamide, N-methylpyrrolidone, and the like.

The laminate according to the present embodiment includes a base film (supporting film) and a transparent resin layer disposed on the base film, and the transparent resin layer is made of the resin composition according to the present embodiment and the like. Contains at least one selected from the group consisting of cured products.

The constituent materials of the base film include polyester (polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate, etc.), polyolefin (polyethylene, polypropylene, cycloolefin polymer, etc.), polycarbonate, polyamide, polyimide, polyamideimide, polyether. Examples include imide, polyether sulfide, polyether sulfone, polyether ketone, polyphenylene ether, and polyphenylene sulfide. The thickness of the base film may be 1 to 200 μm, 10 to 100 μm, or 20 to 80 μm.

The thickness of the transparent resin layer may be 1000 μm or less, 800 μm or less, 500 μm or less, 300 μm or less, 250 μm or less, 200 μm or less, 150 μm or less, or 100 μm or less, from the viewpoint of easily reducing the thickness of the transparent antenna. The thickness of the transparent resin layer is 1 μm or more, 5 μm or more, 10 μm or more, 20 μm or more, 30 μm or more, 40 μm or more, 50 μm or more, 80 μm or more, from the viewpoint of easily reducing transmission loss and improving antenna characteristics. , or 100 μm or more. From these viewpoints, the thickness of the transparent resin layer may be 1 to 1000 μm, 10 to 500 μm, 20 to 200 μm, or 50 to 200 μm.

The first aspect of the laminate according to this embodiment may include a protective film disposed on the transparent resin layer. The second aspect of the laminate according to this embodiment may include a conductive member disposed on the transparent resin layer.

As the constituent material of the protective film, the constituent materials mentioned above as constituent materials of the base film can be used. The protective film may be the same film as the base film, or may be a different film from the base film. The thickness of the protective film may be 1 to 200 μm, 10 to 100 μm, or 20 to 50 μm.

The conductive member may be solid or may have a patterned portion (may be patterned). In a conductive member having a patterned portion (hereinafter referred to as a "patterned conductive member"), part or all of the conductive member may be patterned. Examples of the shape of the patterned portion include a mesh shape, a spiral shape, and the like. When using a transparent antenna with a solid conductive member, the conductive member may not be patterned (eg, meshed). The patterned (eg, mesh-shaped) electrically conductive member may be composed of a wire (eg, a metal wire). Examples of the constituent material of the conductive member include metal materials, carbon materials (for example, graphene), conductive polymers, and the like. Examples of the metal material include copper, silver, and gold. The conductive member may contain copper from the viewpoint of easily obtaining excellent conductivity and from the viewpoint of easily reducing manufacturing costs.

The conductive member may have a single layer or multiple layers. The multi-layer conductive member includes, for example, a first conductive member (for example, a metal member) disposed on a transparent resin layer, and a second conductive member (for example, a metal member) disposed on the first conductive member. , may have. At least one member selected from the group consisting of the first conductive member and the second conductive member may be solid or patterned (for example, mesh-like). The second electrically conductive member can be used as a protective layer that suppresses staining, damage, etc. of the first electrically conductive member, and thereby, it is also possible to improve the handleability of the laminate. At least one member selected from the group consisting of the first conductive member and the second conductive member may contain copper.

The thickness of the conductive member (total thickness when the conductive member has multiple layers), the thickness of the first conductive member, or the thickness of the second conductive member may be within the following ranges. The thickness is 50 μm or less, 45 μm or less, 40 μm or less, 35 μm or less, 30 μm or less, from the viewpoint that the conductive member is hard to chip, and from the viewpoint of easy patterning when a solid conductive member is patterned (for example, mesh processing). , 25 μm or less, 20 μm or less, 18 μm or less, 15 μm or less, 10 μm or less, 8 μm or less, 5 μm or less, 3 μm or less, or 2 μm or less. The thickness is 0.1 μm or more, 0.3 μm or more, 0.5 μm or more, 0.8 μm or more, 1 μm or more, 1.2 μm or more, 1.5 μm or more, or 2 μm or more, from the viewpoint of easily obtaining excellent elongation. It may be. From these points of view, the thickness may be 0.1-50 μm, 0.1-30 μm, 0.1-20 μm, 0.1-10 μm, 0.5-5 μm, or 1-3 μm.

The thickness of the first electrically conductive member may be less than the thickness of the second electrically conductive member. When the conductive member has multiple layers, the thickness of the conductive member (total thickness) or the thickness of the second conductive member is 3 μm or more, 5 μm or more, 8 μm or more, 10 μm or more, 15 μm or more, 18 μm or more, or , 20 μm or more.

The laminate according to the second aspect may include a protective film disposed on the conductive member. As the protective film, the protective film described above as the protective film in the laminate according to the first aspect can be used. A release treatment may be performed on at least a portion of the surface of the protective film on the conductive member side, and a release layer may be disposed on at least a portion of the surface of the protective film on the conductive member side. For example, the laminate according to the second aspect includes a base film, a transparent resin layer, a conductive member, and a protective film, the conductive member being a single layer, and at least one of the surfaces of the protective film on the conductive member side. It may be an embodiment in which part of the mold release treatment is performed.

The laminate according to the second aspect may include a layer L disposed on the conductive member as a layer containing at least one selected from the group consisting of a photosensitive composition and a cured product thereof. The photosensitive composition has photosensitivity to actinic rays (ultraviolet rays, etc.), and may have positive photosensitivity or negative photosensitivity. The photosensitive composition may have photocurability that is cured by light irradiation. The layer L may have at least one type selected from the group consisting of an uncured part and a hardened part. The constituent materials of the photosensitive composition are not particularly limited.

1 and 2 are schematic cross-sectional views showing examples of laminates. The laminate 10 in FIG. 1A includes a base film 10a, a transparent resin layer 10b disposed on the base film 10a, and a protective film 10c disposed on the transparent resin layer 10b. The transparent resin layer 10b is made of the resin composition according to the present embodiment or the cured product according to the present embodiment. The laminate 20 in FIG. 1(b) includes a base film 20a, a transparent resin layer 20b disposed on the base film 20a, and a conductive member 20c disposed on the transparent resin layer 20b. The transparent resin layer 20b is made of the resin composition according to this embodiment or the cured product according to this embodiment. The laminate 30 in FIG. 2 includes a base film 30a, a transparent resin layer 30b disposed on the base film 30a, a conductive member 30c disposed on the transparent resin layer 30b, and a conductive member 30c disposed on the conductive member 30c. and a conductive member 30d. The transparent resin layer 30b is made of the resin composition according to this embodiment or the cured product according to this embodiment.

The transparent antenna according to the present embodiment includes a transparent base material and a conductive member disposed on the transparent base material, and the transparent base material contains a cured product of the resin composition according to the present embodiment. The conductive member may be a single layer. As the configuration of the conductive member, the configuration described above regarding the conductive member in the laminate according to the second aspect can be used. For example, the conductive member may contain copper. Further, the conductive member may be solid or patterned (for example, meshed). As the thickness of the transparent base material, the thickness mentioned above regarding the transparent resin layer of the laminate according to this embodiment can be used.

The transparent antenna according to this embodiment may include a support member that supports a transparent base material, that is, a support member, a transparent base material disposed on the support member, and a conductive member disposed on the transparent base material. You may have the following.

The shape of the support member is not particularly limited, and may be film-like, substrate-like, irregularly shaped, or the like. Examples of the constituent material of the support member include resin materials, inorganic materials, and the like. Examples of resin materials include polyester (polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate, etc.), polyolefin (polyethylene, polypropylene, cycloolefin polymer, etc.), polycarbonate, polyamide, polyimide, polyamideimide, polyetherimide, polyether. Examples include sulfide, polyether sulfone, polyether ketone, polyphenylene ether, and polyphenylene sulfide. Examples of the inorganic material include glass. The support member is not limited to being transparent, and may be a transparent member or a non-transparent member. The support member may be formed of a material having a total light transmittance of 90% or more. The support member may contain polyolefin from the viewpoint of low dielectricity. The support member may contain a material having a polar group (such as a hydroxyl group or a carboxyl group), and may contain glass, from the viewpoint of excellent adhesion between the transparent base material and the support member.

A first aspect of the method for manufacturing a transparent antenna according to the present embodiment is to provide at least a portion of a conductive member (solid conductive member) disposed on a transparent substrate containing a cured product of the resin composition according to the present embodiment. It includes a processing step of patterning (for example, processing into a mesh shape). In the processing step, a patterned resist layer is placed on the conductive member of a laminate including a transparent base material and a conductive member placed on the transparent base material, and the conductive member is etched to form a pattern. (For example, a mesh-like conductive member) may be obtained. The resist layer may be removed after etching the conductive member. A patterned resist layer is formed by irradiating (exposure) a photosensitive layer (a layer containing a photosensitive composition) disposed on a conductive member with actinic light (for example, ultraviolet rays), and then exposing the unexposed areas of the photosensitive layer (where the photosensitive layer is (when the photosensitive layer has negative photosensitivity) or by removing (developing) the exposed area (when the photosensitive layer has positive photosensitivity).

A laminate including a conductive member disposed on a transparent base material may be obtained by forming a conductive member on a transparent base material containing a cured product of the resin composition according to the present embodiment, for example, according to the first aspect. The conductive member may be obtained by forming a conductive member on the transparent resin layer after removing the protective film of the laminate. The laminate including the conductive member disposed on the transparent base material may be the laminate according to the second aspect.

In a second aspect of the method for manufacturing a transparent antenna according to the present embodiment, a patterned resist layer (for example, mesh The method includes a forming step of forming a metal member of the form (type). In the forming step, a patterned (for example, mesh-shaped) metal member may be formed by plating or sputtering using the resist layer as a mask. The resist layer may be removed after the formation process.

A third aspect of the method for manufacturing a transparent antenna according to the present embodiment is a method for removing a base film in the laminate in the case where the conductive member in the laminate according to the second aspect has a pattern shape (for example, a mesh shape). Equipped with a process. If the transparent resin layer of the laminate in the removal process contains a cured product, the removal process removes the laminate of a transparent base material (transparent resin layer) and a patterned (for example, mesh-shaped) conductive member as a transparent antenna. Obtainable. If the transparent resin layer of the laminate is uncured during the removal process, by curing the transparent resin layer (resin composition of the transparent resin layer) after the removal process, the transparent base material (transparent resin composition) can be used as a transparent antenna. (resin layer) and a patterned (for example, mesh-shaped) conductive member stack can be obtained.

A fourth aspect of the method for manufacturing a transparent antenna according to the present embodiment includes a lamination step of laminating the transparent resin layer in the laminate according to the present embodiment on a support member. As the support member, the support member described above regarding the transparent antenna can be used. In the lamination step, the transparent resin layer may be laminated on the support member with the base film of the laminate according to the present embodiment removed, and the transparent resin layer may be laminated with the protective film of the laminate according to the first aspect removed. A transparent resin layer may be laminated onto the support member. The method for manufacturing a transparent antenna according to the fourth aspect may include a removing step A of removing the base film in the laminate according to the present embodiment, and a removing step B of removing the protective film in the laminate according to the first aspect. may be provided.

When using the laminate according to the second aspect, in the lamination step, the transparent resin layer and the conductive member may be laminated on the support member in a state where the transparent resin layer is located closer to the support member than the conductive member, and the transparent resin layer The transparent resin layer and the conductive member may be laminated on the support member with the transparent resin layer and the conductive member in contact with the support member. In the lamination step, the transparent resin layer and the conductive member can be laminated on the support member in a state where the base film in the laminate according to the second aspect is removed. When the laminate according to the second aspect includes a protective film disposed on the conductive member, in the lamination step, the transparent resin layer is located closer to the supporting member than the conductive member (the conductive member is closer to the protective film). The transparent resin layer, the conductive member, and the protective film may be laminated on the support member in a state in which the transparent resin layer is located on the transparent resin layer side. When the laminate according to the second aspect includes a base film, a transparent resin layer, a conductive member, and a protective film, the fourth aspect of the method for manufacturing a transparent antenna according to the present embodiment includes the removal step A After the lamination step, a removal step B of removing the protective film may be included. When the laminate according to the second aspect includes the layer L described above, in the lamination step, the transparent resin layer, the conductive member, and the layer L are attached to the support member in a state where the transparent resin layer is located closer to the support member than the conductive member. It may be layered on top.

By the way, when laminating the supporting member and the conductive member with good adhesion in a laminate having a supporting member and a conductive member disposed on the supporting member, the supporting member may be subjected to surface treatment (plasma treatment, corona treatment, etc.). This may complicate the manufacturing process of the laminate. For example, when polyolefin is used as a constituent material of the support member, the adhesion between the polyolefin and the conductive member (e.g., metal material such as copper) is low, so surface treatment is required to obtain sufficient adhesion. There may be cases where On the other hand, according to the method for manufacturing a transparent antenna according to the fourth aspect, sufficient adhesion between the support member and the conductive member can be obtained without requiring surface treatment of the support member, and the support member and the conductive member can be used as a transparent antenna. It is possible to obtain a laminate (a laminate having a support member, a transparent resin layer, and a conductive member), and for example, it is possible to obtain sufficient adhesion between a support member containing polyolefin and a conductive member containing copper. However, a transparent antenna can be obtained. Further, according to the method for manufacturing a transparent antenna according to the fourth aspect, the transparent resin layer and the conductive member can be supplied on the support member at once by laminating the laminate according to the second aspect on the support member. It is possible to obtain a transparent antenna using a simple method. When the laminate according to the second aspect includes the layer L described above, according to the method for manufacturing a transparent antenna according to the fourth aspect, the laminate according to the second aspect is laminated on the support member, so that the transparent resin is It is possible to supply the layer, the conductive member, and the layer L on the support member all at once, and it is not necessary to form each member on the support member each time a transparent antenna is manufactured, and the transparent antenna can be provided by a simple method. You can get an antenna. Furthermore, according to the method for manufacturing a transparent antenna according to the fourth aspect, excellent antenna properties are obtained by using a material having excellent dielectric properties (low relative dielectric constant, dielectric loss tangent, etc.) as a constituent material of the transparent resin layer. A transparent antenna can be obtained.

In the method for manufacturing a transparent antenna according to the fourth aspect, the transparent resin layer in the removal step A, the removal step B, and the lamination step may be uncured or may be a cured product. When the transparent resin layer is uncured, the method for manufacturing a transparent antenna according to the fourth aspect may include a curing step of curing the transparent resin layer (resin composition of the transparent resin layer) after the lamination step.

In the method for manufacturing a transparent antenna according to the fourth aspect, the conductive member in the removal step A, the removal step B, and the lamination step may be solid or patterned (for example, mesh-like). When the conductive member is solid, the method for manufacturing a transparent antenna according to the fourth aspect may include a processing step A in which at least a portion of the conductive member is patterned (for example, processed into a mesh shape) after the lamination step. . In the processing step A, at least a portion of the conductive member may be patterned by etching at least a portion of the conductive member using a patterned resist layer as a mask.

When the laminate according to the second aspect includes the layer L described above, the method for manufacturing a transparent antenna according to the fourth aspect includes at least a portion of the layer L after the lamination step and before the processing step A. A processing step B may be included in which a patterned layer L (resist layer) is obtained by patterning. In processing step B, at least one part of the layer L is removed (developed) by removing (developing) the unexposed area (when the layer L has negative photosensitivity) or the exposed area (when the layer L has positive photosensitivity). At least a portion of the layer L may be patterned by exposing the layer L and then removing (developing) the unexposed or exposed portions. The method for manufacturing a transparent antenna according to the fourth aspect may include a step of exposing at least a portion of the layer L before the laminating step.

In the method for manufacturing a transparent antenna according to the fourth aspect, the conductive member in the removal step A, the removal step B, and the lamination step may have multiple layers, and the first conductive member disposed on the transparent resin layer and the first conductive member disposed on the transparent resin layer. and a second conductive member disposed on the first conductive member. At least one member selected from the group consisting of the first conductive member and the second conductive member may be solid or patterned (for example, mesh-like). At least one member selected from the group consisting of the first conductive member and the second conductive member may contain copper. When the conductive member has a first conductive member and a second conductive member, in the lamination step, the transparent resin layer and the conductive member are placed in a state where the first conductive member is located closer to the support member than the second conductive member. It may be laminated onto a support member. The method for manufacturing a transparent antenna according to the fourth aspect may include a removal step C of removing the second conductive member after the lamination step. In the removal step C, the second electrically conductive member can be peeled off from the first electrically conductive member. The method for manufacturing a transparent antenna according to the fourth aspect may include, after the removal step C, a processing step of patterning at least a portion of the first conductive member (for example, processing it into a mesh shape). In the processing step, for example, the first conductive member may be etched with a patterned resist layer disposed on the first conductive member. When the transparent resin layer is uncured, the method for manufacturing a transparent antenna according to the fourth aspect may be performed before the removal step C, after the removal step C, or before and after the removal step C. The resin composition may include a curing step of curing the resin composition.

A fifth aspect of the method for manufacturing a transparent antenna according to the present embodiment includes the above-mentioned base film, the above-mentioned transparent resin layer, and the above-mentioned conductive member having the first conductive member and the second conductive member. A method for manufacturing a transparent antenna using a laminate comprising: a transparent antenna in which the transparent resin layer in the laminate is located closer to the support member than the conductive member; and the transparent resin layer and the conductive member are laminated on the support member; A removing step C is provided for removing the second conductive member.

In the method for manufacturing a transparent antenna according to the fifth aspect, before removing the second conductive member, after removing the second conductive member, or before and after removing the second conductive member, the transparent resin layer and the conductive The method may include a curing step of curing the transparent resin layer (resin composition of the transparent resin layer) while the member is laminated on the support member. In the curing step, the transparent resin layer may be cured in a state where the transparent resin layer and the conductive member are laminated on the support member, with the transparent resin layer being located closer to the support member than the conductive member. In the method for manufacturing a transparent antenna according to the fifth aspect, after removing the second conductive member (after the removal step C), at least a portion of the first conductive member is patterned (for example, processed into a mesh shape). It may include a processing step. An example of the method for manufacturing a transparent antenna according to the fifth aspect includes the above-mentioned base film, the above-mentioned transparent resin layer (uncured transparent resin layer), the first conductive member, and the second conductive member. A manufacturing method using a laminate including a conductive member, which includes the above-described removal step A (first removal step), a lamination step, a curing step, and a removal step C (second removal step). In the method for manufacturing a transparent antenna according to the fifth aspect, at least one member selected from the group consisting of the first conductive member and the second conductive member may contain copper. Further, the first conductive member in the laminate may be solid or patterned (for example, meshed).

The sixth aspect of the method for manufacturing a transparent antenna according to the present embodiment includes a removing step B of removing the protective film in a state where the transparent resin layer, the conductive member, and the protective film are laminated in this order on the support member. In this case, the laminate may have, for example, a single layer of the electrically conductive member, and a mold release treatment may be applied to at least a portion of the surface of the protective film on the electrically conductive member side. A sixth aspect of the method for manufacturing a transparent antenna according to the present embodiment includes, before the removal step B, a removal step A of removing the base film in the laminate according to the second aspect, a transparent resin layer, a conductive member, and a protective layer. The method may include a laminating step of laminating the film on the support member.

In the transparent antenna manufacturing method according to the first to sixth aspects described above, the steps, configurations, etc. described above for each aspect may be combined with each other. For example, in the method for manufacturing a transparent antenna according to the fifth aspect, the steps, configurations, etc. described above regarding the method for manufacturing a transparent antenna according to the fourth aspect can be used.

The transparent antenna according to this embodiment can be used in an image display device, a component of an automobile (a windshield, a rear glass, a sunroof, a window, etc.), a building, and the like. The image display device, automobile, or building according to this embodiment includes the transparent antenna according to this embodiment. The image display device may include an image display section that displays an image, and a bezel section (frame section) located around the image display section, and a transparent antenna may be disposed on the image display section. The image display device may be used in various electronic devices such as personal computers, navigation systems, mobile phones, watches, and electronic dictionaries.

3 and 4 are schematic cross-sectional views showing an example of an image display device, and show a part of the image display section of the image display device. The image display device 100 in FIG. 3 includes a transparent antenna 110, a protective layer 120 disposed on the transparent antenna 110, and a transparent covering member 130 disposed on the protective layer 120. The transparent antenna 110 includes a transparent base material 110a and a mesh-like conductive member 110b disposed on the transparent base material 110a. The image display device 200 in FIG. 4 includes a transparent antenna 210, a protective layer 220 disposed on the transparent antenna 210, and a transparent covering member 230 disposed on the protective layer 220. The transparent antenna 210 includes a transparent member 210a, a transparent base material 210b disposed on the transparent member 210a, and a mesh-like conductive member 210c disposed on the transparent base material 210b. The transparent base materials 110a and 210b are made of a cured product of the resin composition according to this embodiment. The conductive members 110b and 210c are made of copper. The transparent member 210a may be made of polyolefin or glass. The protective layers 120, 220 cover the transparent base materials 110a, 210b and the conductive members 110b, 210c. The protective layers 120 and 220 may be formed of at least one member selected from the group consisting of the resin composition and its cured product according to the present embodiment, and may be formed of a material having a total light transmittance of 90% or more. The covering members 130, 230 may be glass plates.

The present disclosure will be further described below using Examples and Comparative Examples, but the present disclosure is not limited to the following Examples.

<Preparation of resin varnish>
(Examples 1 to 14)
While stirring, 80 parts by mass of an elastomer (maleic anhydride-modified styrene-butadiene-styrene block copolymer, manufactured by Asahi Kasei Corporation, trade name: Tuffrene 912, styrene content: 40% by mass), a polymerizable compound (1,9 -20 parts by mass of nonanediol diacrylate, manufactured by Showa Denko Materials Co., Ltd., trade name: FA-129AS), polymerization initiator (2,5-dimethyl-2,5-bis(2-ethylhexanoylperoxy)hexane) , manufactured by NOF Corporation, trade name: Perhexa 25O), 1.0 parts by mass of a phosphorus-containing compound of the type and usage amount (unit: parts by mass) shown in Table 1, and 150 parts by mass of a solvent (toluene) are mixed. A resin varnish was thus obtained. As the phosphorus-containing compound 1, 2-methacryloyloxyethyl acid phosphate (manufactured by Kyoeisha Chemical Co., Ltd., trade name: Light Ester P-1M) was used. As the phosphorus-containing compound 2, a reaction product of a 6-hexanolide addition polymer of 2-hydroxyethyl methacrylate and phosphoric anhydride (manufactured by Nippon Kayaku Co., Ltd., trade name: KAYAMER PM-21) was used.

(Comparative example 1)
Resin varnishes were prepared in the same manner as Examples 1 to 14 except that the phosphorus-containing compound was not used.

<Evaluation of adhesion>
A surface-release-treated PET film (manufactured by Fujimori Industries Co., Ltd., trade name: HTA, thickness: 75 μm) was prepared as a base film. Using a knife coater (manufactured by Yasui Seiki Co., Ltd., trade name: SNC-300), the above resin varnish was applied onto the release-treated surface of this PET film. Next, a resin film was formed by drying at 100° C. for 10 minutes in a dryer (manufactured by Futaba Kagaku Co., Ltd., trade name: MSO-80TPS). By adjusting the gap of the coating machine, the thickness of the resin film after drying was adjusted to 100 μm. After preparing a surface release-treated PET film (manufactured by Fujimori Industries Co., Ltd., product name: BD, thickness: 75 μm) as a protective film, the release-treated surface of the protective film is attached to the resin film to form the laminated film A. Obtained.

Copper foil (manufactured by Furukawa Electric Co., Ltd., trade name: electrolytic copper foil, thickness: 18 μm) was prepared. After removing the protective film of the above laminated film A, use a pressure vacuum laminator (manufactured by Nikko Materials Co., Ltd., product name: V130) to combine the exposed resin film (the resin film of the laminated film A) with the above It was bonded to copper foil under the conditions of a pressure of 0.5 MPa, vacuuming for 10 seconds, and pressure bonding for 30 seconds. After removing the base film (base film of laminated film A), use a pressure vacuum laminator (manufactured by Nikko Materials Co., Ltd., product name: V130) to remove the exposed resin film and glass plate (Matsunami Glass Industries Co., Ltd.). MICLO SLIDE GLASS S9112) manufactured by Co., Ltd. under the conditions of a pressure of 0.5 MPa, evacuation for 10 seconds, and pressure bonding for 30 seconds to obtain a laminate B.

Copper foil, cured film and An evaluation laminate including a glass plate was obtained.

Linear incisions were formed in the copper foil and cured film in the above-mentioned evaluation laminate, and a laminate section (width: 5 mm) consisting of the copper foil and cured film was produced as a test part for measuring tensile stress. In an environment of 25°C, using an autograph (manufactured by Shimadzu Corporation, trade name: EZ-S), the above-mentioned laminate consisting of copper foil and cured film was oriented at a 90° angle to the glass plate. It was peeled off from the glass plate at a speed of 50 mm/min. At this time, the tensile stress per unit width (unit: kN/m) was obtained. The results are shown in Table 1. A case where a measured value of the tensile stress could not be obtained because the tensile stress was high (the tensile stress was 0.85 kN/m or more) was indicated as "N/A".

10,20,30... Laminate, 10a, 20a, 30a... Base film, 10b, 20b, 30b... Transparent resin layer, 10c... Protective film, 20c, 30c, 30d, 110b, 210c... Conductive member, 100,200 ...Image display device, 110,210...Transparent antenna, 110a, 210b...Transparent base material, 120,220...Protective layer, 130,230...Coating member, 210a...Transparent member.

Claims (21)

A resin composition containing an elastomer, a polymerizable compound, and a polymerization initiator,
A resin composition containing a phosphorus-containing compound. The resin composition according to claim 1, wherein the phosphorus-containing compound contains a phosphoric acid ester having a (meth)acryloyl group. The resin composition according to claim 1, wherein the content of the phosphorus-containing compound is 0.1 to 30 parts by mass based on 100 parts by mass of the polymerizable compound. The resin composition according to claim 1, wherein the elastomer includes a styrenic block copolymer. The resin composition according to claim 1, wherein the elastomer comprises a styrene-butadiene-styrene block copolymer. The resin composition according to claim 1, wherein the content of the elastomer is 50% by mass or more based on the total mass of the resin composition. The resin composition according to claim 1, wherein the polymerizable compound contains a (meth)acrylic compound. The resin composition according to claim 1, wherein the polymerizable compound contains an alkanediol di(meth)acrylate. The resin composition according to claim 1, wherein the polymerizable compound includes a compound represented by the following general formula (I).

[In the formula, R ¹ represents a group containing 9 or less carbon atoms and 2 or more oxygen atoms, and R ^2a and R ^2b each independently represent a hydrogen atom or a methyl group. ] The resin composition according to claim 1, wherein the polymerization initiator contains a peroxide. The resin composition according to claim 1, wherein the polymerization initiator contains a peroxyester. A cured product of the resin composition according to any one of claims 1 to 11. comprising a base film and a transparent resin layer disposed on the base film,
A laminate, wherein the transparent resin layer contains at least one selected from the group consisting of the resin composition according to any one of claims 1 to 11 and a cured product thereof. The laminate according to claim 13, further comprising a conductive member disposed on the transparent resin layer. The laminate according to claim 14, wherein the conductive member contains copper. The laminate according to claim 14, wherein the conductive member has a thickness of 5 μm or less. comprising a transparent base material and a conductive member disposed on the transparent base material,
A transparent antenna, wherein the transparent base material contains a cured product of the resin composition according to any one of claims 1 to 11. Further comprising a support member that supports the transparent base material,
18. The transparent antenna of claim 17, wherein the support member comprises glass. The transparent antenna according to claim 17, wherein the conductive member has a mesh shape. The transparent antenna according to claim 17, wherein the conductive member contains copper. An image display device comprising the transparent antenna according to claim 17.

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