JP2024023057A - 弾性波デバイス - Google Patents

弾性波デバイス Download PDF

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Publication number
JP2024023057A
JP2024023057A JP2022126611A JP2022126611A JP2024023057A JP 2024023057 A JP2024023057 A JP 2024023057A JP 2022126611 A JP2022126611 A JP 2022126611A JP 2022126611 A JP2022126611 A JP 2022126611A JP 2024023057 A JP2024023057 A JP 2024023057A
Authority
JP
Japan
Prior art keywords
resonator
cavity
cover layer
acoustic wave
wave device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022126611A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024023057A5 (https=
Inventor
裕 門川
Yutaka Kadokawa
博文 中村
Hirobumi Nakamura
浩一 熊谷
Koichi Kumagai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanan Japan Technology Corp
Original Assignee
Sanan Japan Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanan Japan Technology Corp filed Critical Sanan Japan Technology Corp
Priority to JP2022126611A priority Critical patent/JP2024023057A/ja
Priority to CN202310940352.4A priority patent/CN117544123A/zh
Priority to US18/366,226 priority patent/US20240048119A1/en
Publication of JP2024023057A publication Critical patent/JP2024023057A/ja
Publication of JP2024023057A5 publication Critical patent/JP2024023057A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02062—Details relating to the vibration mode
    • H03H9/0207—Details relating to the vibration mode the vibration mode being harmonic
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02047—Treatment of substrates
    • H03H9/02055—Treatment of substrates of the surface including the back surface
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
    • H03H9/02622—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves of the surface, including back surface
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2022126611A 2022-08-08 2022-08-08 弾性波デバイス Pending JP2024023057A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022126611A JP2024023057A (ja) 2022-08-08 2022-08-08 弾性波デバイス
CN202310940352.4A CN117544123A (zh) 2022-08-08 2023-07-28 弹性波器件
US18/366,226 US20240048119A1 (en) 2022-08-08 2023-08-07 Acoustic wave device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022126611A JP2024023057A (ja) 2022-08-08 2022-08-08 弾性波デバイス

Publications (2)

Publication Number Publication Date
JP2024023057A true JP2024023057A (ja) 2024-02-21
JP2024023057A5 JP2024023057A5 (https=) 2025-08-13

Family

ID=89768711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022126611A Pending JP2024023057A (ja) 2022-08-08 2022-08-08 弾性波デバイス

Country Status (3)

Country Link
US (1) US20240048119A1 (https=)
JP (1) JP2024023057A (https=)
CN (1) CN117544123A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118337173B (zh) * 2024-04-30 2025-12-02 泉州市三安集成电路有限公司 一种弹性波装置、芯片封装方法及射频模块

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007259410A (ja) * 2006-02-27 2007-10-04 Matsushita Electric Ind Co Ltd 電子部品パッケージ
JP2008182292A (ja) * 2007-01-23 2008-08-07 Fujitsu Media Device Kk 弾性波デバイス
JPWO2016158744A1 (ja) * 2015-03-27 2017-06-01 株式会社村田製作所 電子部品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007259410A (ja) * 2006-02-27 2007-10-04 Matsushita Electric Ind Co Ltd 電子部品パッケージ
JP2008182292A (ja) * 2007-01-23 2008-08-07 Fujitsu Media Device Kk 弾性波デバイス
JPWO2016158744A1 (ja) * 2015-03-27 2017-06-01 株式会社村田製作所 電子部品

Also Published As

Publication number Publication date
US20240048119A1 (en) 2024-02-08
CN117544123A (zh) 2024-02-09

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