JP2024017814A - 接合装置、接合方法、および物品の製造方法 - Google Patents

接合装置、接合方法、および物品の製造方法 Download PDF

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Publication number
JP2024017814A
JP2024017814A JP2022120714A JP2022120714A JP2024017814A JP 2024017814 A JP2024017814 A JP 2024017814A JP 2022120714 A JP2022120714 A JP 2022120714A JP 2022120714 A JP2022120714 A JP 2022120714A JP 2024017814 A JP2024017814 A JP 2024017814A
Authority
JP
Japan
Prior art keywords
die
bonding
pattern
wafer
joining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022120714A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024017814A5 (https=
Inventor
一成 舩吉
Issei Funayoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2022120714A priority Critical patent/JP2024017814A/ja
Priority to KR1020230090185A priority patent/KR102952198B1/ko
Priority to US18/352,494 priority patent/US20240038598A1/en
Priority to TW112126505A priority patent/TW202407829A/zh
Publication of JP2024017814A publication Critical patent/JP2024017814A/ja
Publication of JP2024017814A5 publication Critical patent/JP2024017814A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B80/00—Assemblies of multiple devices comprising at least one memory device covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP2022120714A 2022-07-28 2022-07-28 接合装置、接合方法、および物品の製造方法 Pending JP2024017814A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022120714A JP2024017814A (ja) 2022-07-28 2022-07-28 接合装置、接合方法、および物品の製造方法
KR1020230090185A KR102952198B1 (ko) 2022-07-28 2023-07-12 접합장치, 접합방법, 추정방법, 및 물품의 제조방법
US18/352,494 US20240038598A1 (en) 2022-07-28 2023-07-14 Bonding apparatus, bonding method, estimation method, and article manufacturing method
TW112126505A TW202407829A (zh) 2022-07-28 2023-07-17 接合設備、接合方法、預估方法及物品製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022120714A JP2024017814A (ja) 2022-07-28 2022-07-28 接合装置、接合方法、および物品の製造方法

Publications (2)

Publication Number Publication Date
JP2024017814A true JP2024017814A (ja) 2024-02-08
JP2024017814A5 JP2024017814A5 (https=) 2025-06-11

Family

ID=89664823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022120714A Pending JP2024017814A (ja) 2022-07-28 2022-07-28 接合装置、接合方法、および物品の製造方法

Country Status (4)

Country Link
US (1) US20240038598A1 (https=)
JP (1) JP2024017814A (https=)
KR (1) KR102952198B1 (https=)
TW (1) TW202407829A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025242350A1 (en) * 2024-05-22 2025-11-27 Asml Netherlands B.V. Apparatus and method for continuous die bonding

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004071600A (ja) * 2002-08-01 2004-03-04 Asuriito Fa Kk ボンディング不良チップ取り外し方法およびボンディング装置
WO2006118018A1 (ja) * 2005-04-28 2006-11-09 Toray Engineering Co., Ltd. フリップチップ実装ずれ検査方法および実装装置
JP2007180232A (ja) * 2005-12-27 2007-07-12 Toshiba Corp ボンディング装置及び半導体装置の製造方法
JP2014017471A (ja) * 2012-06-11 2014-01-30 Shinkawa Ltd ボンディング装置およびボンディング方法
JP2015149314A (ja) * 2014-02-04 2015-08-20 富士通株式会社 半導体装置及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5019946A (en) * 1988-09-27 1991-05-28 General Electric Company High density interconnect with high volumetric efficiency

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004071600A (ja) * 2002-08-01 2004-03-04 Asuriito Fa Kk ボンディング不良チップ取り外し方法およびボンディング装置
WO2006118018A1 (ja) * 2005-04-28 2006-11-09 Toray Engineering Co., Ltd. フリップチップ実装ずれ検査方法および実装装置
JP2007180232A (ja) * 2005-12-27 2007-07-12 Toshiba Corp ボンディング装置及び半導体装置の製造方法
JP2014017471A (ja) * 2012-06-11 2014-01-30 Shinkawa Ltd ボンディング装置およびボンディング方法
JP2015149314A (ja) * 2014-02-04 2015-08-20 富士通株式会社 半導体装置及びその製造方法

Also Published As

Publication number Publication date
KR20240016197A (ko) 2024-02-06
TW202407829A (zh) 2024-02-16
KR102952198B1 (ko) 2026-04-14
US20240038598A1 (en) 2024-02-01

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