TW202407829A - 接合設備、接合方法、預估方法及物品製造方法 - Google Patents

接合設備、接合方法、預估方法及物品製造方法 Download PDF

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Publication number
TW202407829A
TW202407829A TW112126505A TW112126505A TW202407829A TW 202407829 A TW202407829 A TW 202407829A TW 112126505 A TW112126505 A TW 112126505A TW 112126505 A TW112126505 A TW 112126505A TW 202407829 A TW202407829 A TW 202407829A
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TW
Taiwan
Prior art keywords
bonding
die
wafer
pattern
image
Prior art date
Application number
TW112126505A
Other languages
English (en)
Chinese (zh)
Inventor
舩吉一成
Original Assignee
日商佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商佳能股份有限公司 filed Critical 日商佳能股份有限公司
Publication of TW202407829A publication Critical patent/TW202407829A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B80/00—Assemblies of multiple devices comprising at least one memory device covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
TW112126505A 2022-07-28 2023-07-17 接合設備、接合方法、預估方法及物品製造方法 TW202407829A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022120714A JP2024017814A (ja) 2022-07-28 2022-07-28 接合装置、接合方法、および物品の製造方法
JP2022-120714 2022-07-28

Publications (1)

Publication Number Publication Date
TW202407829A true TW202407829A (zh) 2024-02-16

Family

ID=89664823

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112126505A TW202407829A (zh) 2022-07-28 2023-07-17 接合設備、接合方法、預估方法及物品製造方法

Country Status (4)

Country Link
US (1) US20240038598A1 (https=)
JP (1) JP2024017814A (https=)
KR (1) KR102952198B1 (https=)
TW (1) TW202407829A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI915865B (zh) 2024-07-02 2026-02-21 梭特科技股份有限公司 提升晶粒預先排列的精準度的對位方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025242350A1 (en) * 2024-05-22 2025-11-27 Asml Netherlands B.V. Apparatus and method for continuous die bonding

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5019946A (en) * 1988-09-27 1991-05-28 General Electric Company High density interconnect with high volumetric efficiency
JP4064752B2 (ja) * 2002-08-01 2008-03-19 アスリートＦａ株式会社 ボンディング装置
JP4768731B2 (ja) * 2005-04-28 2011-09-07 東レエンジニアリング株式会社 フリップチップ実装ずれ検査方法および実装装置
JP5022598B2 (ja) * 2005-12-27 2012-09-12 株式会社東芝 ボンディング装置及び半導体装置の製造方法
JP5876000B2 (ja) * 2012-06-11 2016-03-02 株式会社新川 ボンディング装置およびボンディング方法
JP2015149314A (ja) * 2014-02-04 2015-08-20 富士通株式会社 半導体装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI915865B (zh) 2024-07-02 2026-02-21 梭特科技股份有限公司 提升晶粒預先排列的精準度的對位方法

Also Published As

Publication number Publication date
JP2024017814A (ja) 2024-02-08
KR20240016197A (ko) 2024-02-06
KR102952198B1 (ko) 2026-04-14
US20240038598A1 (en) 2024-02-01

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