KR102952198B1 - 접합장치, 접합방법, 추정방법, 및 물품의 제조방법 - Google Patents

접합장치, 접합방법, 추정방법, 및 물품의 제조방법

Info

Publication number
KR102952198B1
KR102952198B1 KR1020230090185A KR20230090185A KR102952198B1 KR 102952198 B1 KR102952198 B1 KR 102952198B1 KR 1020230090185 A KR1020230090185 A KR 1020230090185A KR 20230090185 A KR20230090185 A KR 20230090185A KR 102952198 B1 KR102952198 B1 KR 102952198B1
Authority
KR
South Korea
Prior art keywords
bonding
die
pattern
wafer
joining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020230090185A
Other languages
English (en)
Korean (ko)
Other versions
KR20240016197A (ko
Inventor
잇세이 후나요시
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20240016197A publication Critical patent/KR20240016197A/ko
Application granted granted Critical
Publication of KR102952198B1 publication Critical patent/KR102952198B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B80/00—Assemblies of multiple devices comprising at least one memory device covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
KR1020230090185A 2022-07-28 2023-07-12 접합장치, 접합방법, 추정방법, 및 물품의 제조방법 Active KR102952198B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022120714A JP2024017814A (ja) 2022-07-28 2022-07-28 接合装置、接合方法、および物品の製造方法
JPJP-P-2022-120714 2022-07-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020260064126A Division KR20260052904A (ko) 2022-07-28 2026-04-09 접합장치, 접합방법 및 물품의 제조방법

Publications (2)

Publication Number Publication Date
KR20240016197A KR20240016197A (ko) 2024-02-06
KR102952198B1 true KR102952198B1 (ko) 2026-04-14

Family

ID=89664823

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020230090185A Active KR102952198B1 (ko) 2022-07-28 2023-07-12 접합장치, 접합방법, 추정방법, 및 물품의 제조방법

Country Status (4)

Country Link
US (1) US20240038598A1 (https=)
JP (1) JP2024017814A (https=)
KR (1) KR102952198B1 (https=)
TW (1) TW202407829A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025242350A1 (en) * 2024-05-22 2025-11-27 Asml Netherlands B.V. Apparatus and method for continuous die bonding

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5019946A (en) * 1988-09-27 1991-05-28 General Electric Company High density interconnect with high volumetric efficiency
JP4064752B2 (ja) * 2002-08-01 2008-03-19 アスリートＦａ株式会社 ボンディング装置
JP4768731B2 (ja) * 2005-04-28 2011-09-07 東レエンジニアリング株式会社 フリップチップ実装ずれ検査方法および実装装置
JP5022598B2 (ja) * 2005-12-27 2012-09-12 株式会社東芝 ボンディング装置及び半導体装置の製造方法
JP5876000B2 (ja) * 2012-06-11 2016-03-02 株式会社新川 ボンディング装置およびボンディング方法
JP2015149314A (ja) * 2014-02-04 2015-08-20 富士通株式会社 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JP2024017814A (ja) 2024-02-08
KR20240016197A (ko) 2024-02-06
TW202407829A (zh) 2024-02-16
US20240038598A1 (en) 2024-02-01

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