JP2024014744A5 - - Google Patents

Info

Publication number
JP2024014744A5
JP2024014744A5 JP2023102510A JP2023102510A JP2024014744A5 JP 2024014744 A5 JP2024014744 A5 JP 2024014744A5 JP 2023102510 A JP2023102510 A JP 2023102510A JP 2023102510 A JP2023102510 A JP 2023102510A JP 2024014744 A5 JP2024014744 A5 JP 2024014744A5
Authority
JP
Japan
Prior art keywords
plasma
chamber
control
thermal resistance
ring assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023102510A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024014744A (ja
Filing date
Publication date
Application filed filed Critical
Priority to TW112127092A priority Critical patent/TW202420390A/zh
Priority to CN202310892186.5A priority patent/CN117438273A/zh
Priority to KR1020230095295A priority patent/KR20240013700A/ko
Priority to US18/225,077 priority patent/US20240030014A1/en
Publication of JP2024014744A publication Critical patent/JP2024014744A/ja
Publication of JP2024014744A5 publication Critical patent/JP2024014744A5/ja
Pending legal-status Critical Current

Links

JP2023102510A 2022-07-22 2023-06-22 シーズニング方法及びプラズマ処理装置 Pending JP2024014744A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW112127092A TW202420390A (zh) 2022-07-22 2023-07-20 陳化方法及電漿處理裝置
CN202310892186.5A CN117438273A (zh) 2022-07-22 2023-07-20 陈化方法以及等离子体处理装置
KR1020230095295A KR20240013700A (ko) 2022-07-22 2023-07-21 시즈닝 방법 및 플라즈마 처리 장치
US18/225,077 US20240030014A1 (en) 2022-07-22 2023-07-21 Seasoning method and plasma processing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022117515 2022-07-22
JP2022117515 2022-07-22

Publications (2)

Publication Number Publication Date
JP2024014744A JP2024014744A (ja) 2024-02-01
JP2024014744A5 true JP2024014744A5 (https=) 2026-04-13

Family

ID=89719007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023102510A Pending JP2024014744A (ja) 2022-07-22 2023-06-22 シーズニング方法及びプラズマ処理装置

Country Status (1)

Country Link
JP (1) JP2024014744A (https=)

Similar Documents

Publication Publication Date Title
US12063717B2 (en) Plasma processing apparatus, and temperature control method
US12087559B2 (en) Plasma processing apparatus, temperature control method, and temperature control program
US8874254B2 (en) Temperature setting method of heat processing plate, temperature setting apparatus of heat processing plate, program, and computer-readable recording medium recording program thereon
JP6080842B2 (ja) プロセスチャンバ内の複数区域ヒータの温度を制御するための方法および装置
JP4699283B2 (ja) 熱処理板の温度制御方法、プログラム及び熱処理板の温度制御装置
JP7326344B2 (ja) 空間分解ウエハ温度制御のための仮想センサ
TW201933472A (zh) 電漿處理裝置、溫度控制方法及溫度控制程式
JP3836696B2 (ja) 半導体製造システムおよび半導体装置の製造方法
JP2018107175A5 (https=)
KR102287443B1 (ko) 정전척 히터의 온도 제어 시스템
TWI381453B (zh) Heat treatment apparatus, heat treatment method and memory medium
CN111009454A (zh) 等离子体处理装置、监视方法以及记录介质
WO2005043609A1 (ja) 熱処理装置及び熱処理方法
CN112056009A (zh) 等离子体处理机
JP6964176B2 (ja) 基板処理装置、基板処理方法、及び記憶媒体
US20040144488A1 (en) Semiconductor wafer processing apparatus
CN111933509B (zh) 等离子体处理装置、计算方法以及记录介质
TW201535524A (zh) 適應性烘烤系統與其使用方法
JP2024014744A5 (https=)
JP7280113B2 (ja) プラズマ処理装置、監視方法および監視プログラム
JPH03145121A (ja) 半導体熱処理用温度制御装置
JP5041009B2 (ja) 熱処理装置、熱処理方法及び記憶媒体
TWI819012B (zh) 電漿處理裝置、電漿狀態檢測方法及電漿狀態檢測程式
JP2001085339A (ja) 温度制御方法
JPH09198148A (ja) 熱処理装置の制御パラメータの決定装置及びその方法