JP2023537272A5 - - Google Patents

Info

Publication number
JP2023537272A5
JP2023537272A5 JP2023504728A JP2023504728A JP2023537272A5 JP 2023537272 A5 JP2023537272 A5 JP 2023537272A5 JP 2023504728 A JP2023504728 A JP 2023504728A JP 2023504728 A JP2023504728 A JP 2023504728A JP 2023537272 A5 JP2023537272 A5 JP 2023537272A5
Authority
JP
Japan
Prior art keywords
die
level
winding
package substrate
terminal coupled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023504728A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023537272A (ja
Filing date
Publication date
Priority claimed from US17/383,878 external-priority patent/US12148556B2/en
Application filed filed Critical
Publication of JP2023537272A publication Critical patent/JP2023537272A/ja
Publication of JP2023537272A5 publication Critical patent/JP2023537272A5/ja
Pending legal-status Critical Current

Links

JP2023504728A 2020-07-24 2021-07-26 集積された磁気アセンブリ Pending JP2023537272A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202063056344P 2020-07-24 2020-07-24
US63/056,344 2020-07-24
US17/383,878 2021-07-23
US17/383,878 US12148556B2 (en) 2020-07-24 2021-07-23 Integrated magnetic assembly
PCT/US2021/043157 WO2022020801A1 (en) 2020-07-24 2021-07-26 Integrated magnetic assembly

Publications (2)

Publication Number Publication Date
JP2023537272A JP2023537272A (ja) 2023-08-31
JP2023537272A5 true JP2023537272A5 (https=) 2024-07-22

Family

ID=79688606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023504728A Pending JP2023537272A (ja) 2020-07-24 2021-07-26 集積された磁気アセンブリ

Country Status (5)

Country Link
US (1) US12148556B2 (https=)
EP (1) EP4186081A4 (https=)
JP (1) JP2023537272A (https=)
CN (1) CN116134563A (https=)
WO (1) WO2022020801A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11791249B2 (en) * 2021-10-29 2023-10-17 Texas Instruments Incorporated Thermally enhanced isolated power converter package
IT202200016011A1 (it) * 2022-07-28 2024-01-28 St Microelectronics Srl Procedimento per fabbricare dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente
US12505951B2 (en) * 2022-08-10 2025-12-23 Murata Manufacturing Co., Ltd. Block coil
US12489211B2 (en) * 2023-03-15 2025-12-02 Texas Instruments Incorporated Electronic device with patch antenna in packaging substrate
EP4432317A1 (en) * 2023-03-16 2024-09-18 Infineon Technologies Austria AG Transformer arrangement
US20240347473A1 (en) * 2023-04-14 2024-10-17 Allegro Microsystems, Llc Voltage-isolated integrated circuit packages with back-side transformers

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7791900B2 (en) 2006-08-28 2010-09-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Galvanic isolator
US20080278275A1 (en) 2007-05-10 2008-11-13 Fouquet Julie E Miniature Transformers Adapted for use in Galvanic Isolators and the Like
JP5154262B2 (ja) * 2008-02-26 2013-02-27 太陽誘電株式会社 電子部品
JP2010263671A (ja) * 2009-04-30 2010-11-18 Hitachi Automotive Systems Ltd 電力変換装置
WO2010137090A1 (ja) 2009-05-28 2010-12-02 パナソニック株式会社 半導体装置
JP5110178B2 (ja) * 2010-04-13 2012-12-26 株式会社デンソー 半導体装置およびその製造方法
US9035422B2 (en) * 2013-09-12 2015-05-19 Texas Instruments Incorporated Multilayer high voltage isolation barrier in an integrated circuit
JP6395304B2 (ja) * 2013-11-13 2018-09-26 ローム株式会社 半導体装置および半導体モジュール
US9870929B2 (en) * 2015-10-14 2018-01-16 Taiwan Semiconductor Manufacturing Company Ltd. Package structure, fan-out package structure and method of the same
CN209882281U (zh) 2016-08-05 2019-12-31 株式会社村田制作所 多层基板及电子设备
US10475786B1 (en) 2018-05-23 2019-11-12 Texas Instruments Incorporated Packaged semiconductor device
JP2020013827A (ja) * 2018-07-13 2020-01-23 イビデン株式会社 コイル基板
US11804456B2 (en) * 2018-08-21 2023-10-31 Intel Corporation Wirebond and leadframe magnetic inductors
CN209056362U (zh) 2018-09-20 2019-07-02 东翔电子（东莞）有限公司 一种内置多层立体线圈的变压器
US12176285B2 (en) 2018-12-31 2024-12-24 Texas Instruments Incorporated Transformer guard trace
US12243911B2 (en) 2019-12-09 2025-03-04 Texas Instruments Incorporated Integrated circuit package for isolation dies

Similar Documents

Publication Publication Date Title
JP2023537272A5 (https=)
US9209081B2 (en) Semiconductor grid array package
US8618641B2 (en) Leadframe-based semiconductor package
US8133764B2 (en) Embedded inductor and method of producing thereof
CN101416305B (zh) 具有集成通孔散热器引脚的模制半导体封装
CN100444371C (zh) 功率半导体封装
US12148556B2 (en) Integrated magnetic assembly
TW201703210A (zh) 半導體封裝及其製造方法
US20110159643A1 (en) Fabrication method of semiconductor package structure
CN101350318B (zh) 电子封装及电子装置
JP2019530182A5 (https=)
US20170004914A1 (en) Module and method for manufacturing the module
US20120097430A1 (en) Packaging substrate and method of fabricating the same
KR100645755B1 (ko) 반도체 패키지 및 그 제조방법
US20160225642A1 (en) Electronic package structure and fabrication method thereof
US9474162B2 (en) Circuit substrate and method of manufacturing same
CN103151328B (zh) 半导体封装件及其制造方法
TWI620300B (zh) 晶片封裝結構及其製造方法
EP3012862A1 (en) Molding compound supported rdl for ic package
WO2017117561A1 (en) Integrated circuit chip with a vertical connector
JP2705408B2 (ja) 混成集積回路装置
CN108565251A (zh) 系统级封装模块及其封装方法、终端设备
CN101378023B (zh) 半导体封装件及其制法
JP2003100813A5 (https=)
KR100318317B1 (ko) 베어 칩 실장 인쇄회로기판