JP2023535291A5 - - Google Patents

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Publication number
JP2023535291A5
JP2023535291A5 JP2022581338A JP2022581338A JP2023535291A5 JP 2023535291 A5 JP2023535291 A5 JP 2023535291A5 JP 2022581338 A JP2022581338 A JP 2022581338A JP 2022581338 A JP2022581338 A JP 2022581338A JP 2023535291 A5 JP2023535291 A5 JP 2023535291A5
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JP
Japan
Prior art keywords
movable
configuration
valve seat
processing chamber
semiconductor processing
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Application number
JP2022581338A
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English (en)
Japanese (ja)
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JP7803890B2 (ja
JP2023535291A (ja
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Priority claimed from PCT/US2021/042951 external-priority patent/WO2022020707A1/en
Publication of JP2023535291A publication Critical patent/JP2023535291A/ja
Publication of JP2023535291A5 publication Critical patent/JP2023535291A5/ja
Application granted granted Critical
Publication of JP7803890B2 publication Critical patent/JP7803890B2/ja
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JP2022581338A 2020-07-24 2021-07-23 ウェハ処理システム用の高コンダクタンス真空バルブ Active JP7803890B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202062706004P 2020-07-24 2020-07-24
US62/706,004 2020-07-24
PCT/US2021/042951 WO2022020707A1 (en) 2020-07-24 2021-07-23 High-conductance vacuum valves for wafer processing systems

Publications (3)

Publication Number Publication Date
JP2023535291A JP2023535291A (ja) 2023-08-17
JP2023535291A5 true JP2023535291A5 (cg-RX-API-DMAC10.html) 2024-07-22
JP7803890B2 JP7803890B2 (ja) 2026-01-21

Family

ID=79728981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022581338A Active JP7803890B2 (ja) 2020-07-24 2021-07-23 ウェハ処理システム用の高コンダクタンス真空バルブ

Country Status (4)

Country Link
US (1) US20230360894A1 (cg-RX-API-DMAC10.html)
JP (1) JP7803890B2 (cg-RX-API-DMAC10.html)
KR (2) KR20260033638A (cg-RX-API-DMAC10.html)
WO (1) WO2022020707A1 (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025080417A1 (en) * 2023-10-11 2025-04-17 Applied Materials, Inc. Smart faceplate using shape memory alloy poppet actuators

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3646292B2 (ja) * 2001-07-17 2005-05-11 学校法人金沢工業大学 物体の加工処理方法と、その装置
CN102084468B (zh) * 2008-02-08 2014-10-29 朗姆研究公司 包括横向波纹管和非接触颗粒密封的可调节间隙电容耦合rf等离子反应器
JP2009212177A (ja) * 2008-03-03 2009-09-17 Hitachi High-Technologies Corp 真空処理装置
JP5337185B2 (ja) * 2011-03-11 2013-11-06 株式会社東芝 圧力制御装置
TWI661746B (zh) * 2011-10-05 2019-06-01 應用材料股份有限公司 電漿處理設備及其蓋組件(一)
JP5778001B2 (ja) * 2011-11-04 2015-09-16 小林製薬株式会社 板状部材
US9879684B2 (en) * 2012-09-13 2018-01-30 Kla-Tencor Corporation Apparatus and method for shielding a controlled pressure environment
US10049862B2 (en) * 2015-04-17 2018-08-14 Lam Research Corporation Chamber with vertical support stem for symmetric conductance and RF delivery
KR101852833B1 (ko) * 2015-12-02 2018-06-20 한국항공우주연구원 다단 포핏 밸브
CN105445973B (zh) 2015-12-31 2019-04-30 京东方科技集团股份有限公司 一种抽真空装置及采用该抽真空装置的操作方法
JP6960737B2 (ja) * 2017-01-23 2021-11-05 株式会社日立ハイテク 真空処理装置
KR102225955B1 (ko) * 2018-04-19 2021-03-11 세메스 주식회사 기판 처리 장치 및 배기 어셈블리
JP6833784B2 (ja) * 2018-09-28 2021-02-24 芝浦メカトロニクス株式会社 プラズマ処理装置

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