JP2023513442A5 - - Google Patents

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Publication number
JP2023513442A5
JP2023513442A5 JP2022545069A JP2022545069A JP2023513442A5 JP 2023513442 A5 JP2023513442 A5 JP 2023513442A5 JP 2022545069 A JP2022545069 A JP 2022545069A JP 2022545069 A JP2022545069 A JP 2022545069A JP 2023513442 A5 JP2023513442 A5 JP 2023513442A5
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JP
Japan
Prior art keywords
positioning system
controller
scanner
galvano
predicted path
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JP2022545069A
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English (en)
Japanese (ja)
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JP7520129B2 (ja
JP2023513442A (ja
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Priority claimed from PCT/US2021/014632 external-priority patent/WO2021150904A1/en
Publication of JP2023513442A publication Critical patent/JP2023513442A/ja
Publication of JP2023513442A5 publication Critical patent/JP2023513442A5/ja
Application granted granted Critical
Publication of JP7520129B2 publication Critical patent/JP7520129B2/ja
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JP2022545069A 2020-01-24 2021-01-22 大面積レーザ加工の正確度を、位置フィードフォワード補償を使用して改善するためのシステムと方法 Active JP7520129B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202062965491P 2020-01-24 2020-01-24
US62/965,491 2020-01-24
PCT/US2021/014632 WO2021150904A1 (en) 2020-01-24 2021-01-22 Systems and methods for improving accuracy in large area laser processing using position feedforward compensation

Publications (3)

Publication Number Publication Date
JP2023513442A JP2023513442A (ja) 2023-03-31
JP2023513442A5 true JP2023513442A5 (https=) 2024-04-03
JP7520129B2 JP7520129B2 (ja) 2024-07-22

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ID=74595455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022545069A Active JP7520129B2 (ja) 2020-01-24 2021-01-22 大面積レーザ加工の正確度を、位置フィードフォワード補償を使用して改善するためのシステムと方法

Country Status (7)

Country Link
US (1) US20210229216A1 (https=)
EP (1) EP4093574A1 (https=)
JP (1) JP7520129B2 (https=)
KR (1) KR102707504B1 (https=)
CN (1) CN115243823A (https=)
IL (1) IL294976A (https=)
WO (1) WO2021150904A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102384586B1 (ko) * 2016-08-28 2022-04-11 에이씨에스 모션 컨트롤 리미티드 비교적 큰 가공물을 가공하는 레이저를 위한 방법 및 시스템
CN113787265A (zh) * 2021-09-18 2021-12-14 苏州德龙激光股份有限公司 基于振镜与平台轨迹的联动切割系统及其控制方法
AT526120B1 (de) * 2022-04-08 2024-07-15 Trotec Laser Gmbh Verfahren zum Betreiben eines Laserplotters zum Schneiden, Gravieren, Markieren und/oder Beschriften eines Werkstückes, sowie einen Laserplotter zum Gravieren, Markieren und/oder Beschriften eines Werkstückes
CN121355685B (zh) * 2025-12-19 2026-03-17 罗根激光科技(武汉)有限公司 一种激光振荡器的智能控制方法及系统

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5751585A (en) * 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
EP1374139B1 (en) * 2001-03-29 2011-05-04 LASX Industries, Inc. Controller for a laser using predictive models ofa laser beam motion system
US8392002B2 (en) * 2010-10-14 2013-03-05 Delta Tau Data Systems, Inc. Hybrid machine control incorporating fast-tool servos
KR101653084B1 (ko) * 2012-03-23 2016-08-31 미쓰비시덴키 가부시키가이샤 레이저 가공 장치
WO2015046926A1 (ko) * 2013-09-30 2015-04-02 주식회사 이오테크닉스 다중 위치 제어를 이용한 연속적 레이저 가공 방법 및 이를 적용하는 시스템
KR102384586B1 (ko) * 2016-08-28 2022-04-11 에이씨에스 모션 컨트롤 리미티드 비교적 큰 가공물을 가공하는 레이저를 위한 방법 및 시스템
CN114967111A (zh) * 2017-03-03 2022-08-30 雅普顿生物系统公司 具有加速跟踪的高速扫描系统
US20180339364A1 (en) 2017-05-29 2018-11-29 ACS Motion Control Ltd. System and method for machining of relatively large work pieces
JP6795565B2 (ja) * 2018-10-11 2020-12-02 ファナック株式会社 レーザ加工システム

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