JP2023507221A - 光子集積技術に基づく真空のゆらぎ量子乱数発生器チップ - Google Patents
光子集積技術に基づく真空のゆらぎ量子乱数発生器チップ Download PDFInfo
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- G02B6/4201—Packages, e.g. shape, construction, internal or external details
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- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
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- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
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- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
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- G—PHYSICS
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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- G02B6/42—Coupling light guides with opto-electronic elements
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- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
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- G—PHYSICS
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- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
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- H—ELECTRICITY
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0262—Photo-diodes, e.g. transceiver devices, bidirectional devices
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Abstract
Description
Claims (5)
- 光子集積技術に基づく真空のゆらぎ量子乱数発生器チップであって、ヒートシンク基板(1)と、レーザ(2)と、ビームスプリッタ(3)と、少なくとも2つの光電検出器(4)とを備え、前記レーザ(2)は、前記ヒートシンク基板(1)の第1の端に固定され、前記少なくとも2つの光電検出器(4)は、前記ヒートシンク基板(1)の第2の端に固定され、前記ビームスプリッタ(3)は、レーザと検出器との間で前記ヒートシンク基板(1)に固定され、前記レーザ(2)の光は、ビームスプリッタ(3)を通って伝搬し、前記少なくとも2つの光電検出器(4)は、それぞれ、前記ビームスプリッタ(3)の光路出口に配置されることを特徴とする、真空のゆらぎ量子乱数発生器チップ。
- 前記真空のゆらぎ量子乱数発生器チップは、前記ヒートシンク基板(1)の第1の端に固定された半導体冷却器(5)をさらに備え、前記レーザ(2)は前記半導体冷却器(5)に固定されていることを特徴とする、請求項1に記載の真空のゆらぎ量子乱数発生器チップ。
- 前記真空のゆらぎ量子乱数発生器チップは、前記レーザ(2)の光出口と前記ビームスプリッタ(3)の光路入口との間に配置されたレンズ(6)をさらに有することを特徴とする、請求項1に記載の真空のゆらぎ量子乱数発生器チップ。
- 前記ビームスプリッタ(3)は、Y導波路ビームスプリッタであることを特徴とする、請求項1に記載の真空のゆらぎ量子乱数発生器チップ。
- 前記ビームスプリッタ(3)の出射端は、角度が90°より小さい斜面構造であることを特徴とする、請求項1に記載の真空のゆらぎ量子乱数発生器チップ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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CN202010783534.1 | 2020-08-06 | ||
CN202010783534.1A CN111708514A (zh) | 2020-08-06 | 2020-08-06 | 基于光子集成技术的真空涨落量子随机数发生器芯片 |
PCT/CN2021/097778 WO2022028078A1 (zh) | 2020-08-06 | 2021-06-01 | 基于光子集成技术的真空涨落量子随机数发生器芯片 |
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JP2023507221A true JP2023507221A (ja) | 2023-02-21 |
JP7418725B2 JP7418725B2 (ja) | 2024-01-22 |
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US (1) | US11853720B2 (ja) |
EP (1) | EP4195028A4 (ja) |
JP (1) | JP7418725B2 (ja) |
KR (1) | KR20220098253A (ja) |
CN (1) | CN111708514A (ja) |
WO (1) | WO2022028078A1 (ja) |
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CN111708514A (zh) | 2020-08-06 | 2020-09-25 | 世融能量科技有限公司 | 基于光子集成技术的真空涨落量子随机数发生器芯片 |
Citations (6)
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JP2000268396A (ja) * | 1999-03-15 | 2000-09-29 | Toyo Commun Equip Co Ltd | 光ピックアップ装置 |
JP2009070009A (ja) * | 2007-09-12 | 2009-04-02 | Sony Corp | 乱数生成装置および乱数生成方法 |
JP2017021074A (ja) * | 2015-07-07 | 2017-01-26 | ウシオ電機株式会社 | 光導波路実装ボード製造方法及び光導波路実装ボード |
JP2018194648A (ja) * | 2017-05-16 | 2018-12-06 | 富士通オプティカルコンポーネンツ株式会社 | 光送信器及び光受信器 |
US20190220250A1 (en) * | 2016-03-01 | 2019-07-18 | National University Of Singapore | Method and system for random number generation |
JP2022550789A (ja) * | 2020-06-03 | 2022-12-05 | シュロン エナジー テクノロジー カンパニー リミテッド | 真空のゆらぎ技術に基づく高速量子乱数発生器 |
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EP1221186A1 (en) * | 1999-10-15 | 2002-07-10 | Tsunami Photonics Limited | Optoelectronic device incorporating a tunable laser and method of characterisation thereof |
JP4347280B2 (ja) | 2005-08-26 | 2009-10-21 | シャープ株式会社 | 光集積ユニットおよびその調整方法、ならびに光ピックアップ装置 |
ATE549597T1 (de) * | 2007-10-04 | 2012-03-15 | Attocube Systems Ag | Vorrichtung zur positionserfassung |
WO2013082672A1 (en) * | 2011-12-07 | 2013-06-13 | Quintessencelabs Pty Ltd | Integrated quantum-random noise generator using quantum vacuum states of light |
EP3170043A4 (en) * | 2014-07-14 | 2018-06-20 | Biond Photonics Inc. | 3d photonic integration with light coupling elements |
US9696133B2 (en) * | 2014-08-14 | 2017-07-04 | Kabushiki Kaisha Toshiba | Interference system and an interference method |
CN108054217A (zh) * | 2017-12-18 | 2018-05-18 | 中国电子科技集团公司第四十四研究所 | 集成制冷的单光子雪崩光电二极管器件 |
CN108536424B (zh) | 2018-05-18 | 2024-01-26 | 清华大学 | 一种基于真空涨落的量子随机数发生器 |
CN108777430A (zh) * | 2018-08-22 | 2018-11-09 | 苏州易锐光电科技有限公司 | 同轴封装光组件及同轴封装激光器 |
KR20200082469A (ko) * | 2018-12-28 | 2020-07-08 | 삼성전자주식회사 | 난수 생성기 |
CN209297284U (zh) | 2019-02-18 | 2019-08-23 | 弦海(上海)量子科技有限公司 | 量子真随机数生成器封装芯片 |
CN111708514A (zh) | 2020-08-06 | 2020-09-25 | 世融能量科技有限公司 | 基于光子集成技术的真空涨落量子随机数发生器芯片 |
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2020
- 2020-08-06 CN CN202010783534.1A patent/CN111708514A/zh active Pending
-
2021
- 2021-06-01 KR KR1020227021063A patent/KR20220098253A/ko not_active Application Discontinuation
- 2021-06-01 EP EP21852188.8A patent/EP4195028A4/en active Pending
- 2021-06-01 JP JP2022538455A patent/JP7418725B2/ja active Active
- 2021-06-01 US US17/781,582 patent/US11853720B2/en active Active
- 2021-06-01 WO PCT/CN2021/097778 patent/WO2022028078A1/zh active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000268396A (ja) * | 1999-03-15 | 2000-09-29 | Toyo Commun Equip Co Ltd | 光ピックアップ装置 |
JP2009070009A (ja) * | 2007-09-12 | 2009-04-02 | Sony Corp | 乱数生成装置および乱数生成方法 |
JP2017021074A (ja) * | 2015-07-07 | 2017-01-26 | ウシオ電機株式会社 | 光導波路実装ボード製造方法及び光導波路実装ボード |
US20190220250A1 (en) * | 2016-03-01 | 2019-07-18 | National University Of Singapore | Method and system for random number generation |
JP2018194648A (ja) * | 2017-05-16 | 2018-12-06 | 富士通オプティカルコンポーネンツ株式会社 | 光送信器及び光受信器 |
JP2022550789A (ja) * | 2020-06-03 | 2022-12-05 | シュロン エナジー テクノロジー カンパニー リミテッド | 真空のゆらぎ技術に基づく高速量子乱数発生器 |
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US11853720B2 (en) | 2023-12-26 |
US20230004355A1 (en) | 2023-01-05 |
CN111708514A (zh) | 2020-09-25 |
JP7418725B2 (ja) | 2024-01-22 |
WO2022028078A1 (zh) | 2022-02-10 |
EP4195028A4 (en) | 2024-01-24 |
KR20220098253A (ko) | 2022-07-11 |
EP4195028A1 (en) | 2023-06-14 |
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