JP2023507091A5 - - Google Patents

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Publication number
JP2023507091A5
JP2023507091A5 JP2022535808A JP2022535808A JP2023507091A5 JP 2023507091 A5 JP2023507091 A5 JP 2023507091A5 JP 2022535808 A JP2022535808 A JP 2022535808A JP 2022535808 A JP2022535808 A JP 2022535808A JP 2023507091 A5 JP2023507091 A5 JP 2023507091A5
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JP
Japan
Prior art keywords
vacuum
groove
top plate
gas
substrate support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022535808A
Other languages
English (en)
Japanese (ja)
Other versions
JP7791817B2 (ja
JP2023507091A (ja
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Priority claimed from PCT/US2020/065746 external-priority patent/WO2021127272A1/en
Publication of JP2023507091A publication Critical patent/JP2023507091A/ja
Publication of JP2023507091A5 publication Critical patent/JP2023507091A5/ja
Application granted granted Critical
Publication of JP7791817B2 publication Critical patent/JP7791817B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022535808A 2019-12-20 2020-12-17 端部／中央部の不均一性を軽減するためにウエハの外周近傍に凹部を備えた半導体処理チャック Active JP7791817B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962951849P 2019-12-20 2019-12-20
US62/951,849 2019-12-20
PCT/US2020/065746 WO2021127272A1 (en) 2019-12-20 2020-12-17 Semiconductor processing chucks featuring recessed regions near outer perimeter of wafer for mitigation of edge/center nonuniformity

Publications (3)

Publication Number Publication Date
JP2023507091A JP2023507091A (ja) 2023-02-21
JP2023507091A5 true JP2023507091A5 (https=) 2023-12-25
JP7791817B2 JP7791817B2 (ja) 2025-12-24

Family

ID=76478170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022535808A Active JP7791817B2 (ja) 2019-12-20 2020-12-17 端部／中央部の不均一性を軽減するためにウエハの外周近傍に凹部を備えた半導体処理チャック

Country Status (5)

Country Link
US (1) US20230010049A1 (https=)
JP (1) JP7791817B2 (https=)
KR (3) KR20260049844A (https=)
CN (1) CN114846596A (https=)
WO (1) WO2021127272A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022544221A (ja) * 2019-08-16 2022-10-17 ラム リサーチ コーポレーション ウエハ内の様々な反りを補償するために空間を調整する堆積
EP3958297B1 (de) * 2020-08-18 2023-10-04 Siltronic AG Verfahren zum herstellen eines vakuumgreifers für halbleiterwerkstücke und vakuumgreifer
US12400993B2 (en) * 2020-08-19 2025-08-26 Shinkawa Ltd. Substrate holder and bonding system
US20220367236A1 (en) * 2021-05-16 2022-11-17 Applied Materials, Inc. Heater pedestal with improved uniformity
KR102806214B1 (ko) * 2022-03-29 2025-05-13 토토 가부시키가이샤 정전 척
CN118127490B (zh) * 2024-02-28 2025-03-21 江苏首芯半导体科技有限公司 通气面板及薄膜沉积腔体
CN120824246A (zh) * 2024-05-21 2025-10-21 北京北方华创微电子装备有限公司 承载装置及半导体加工设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5620525A (en) * 1990-07-16 1997-04-15 Novellus Systems, Inc. Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate
US5843233A (en) * 1990-07-16 1998-12-01 Novellus Systems, Inc. Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus
US6040011A (en) * 1998-06-24 2000-03-21 Applied Materials, Inc. Substrate support member with a purge gas channel and pumping system
US6632325B2 (en) * 2002-02-07 2003-10-14 Applied Materials, Inc. Article for use in a semiconductor processing chamber and method of fabricating same
JP2007067394A (ja) * 2005-08-05 2007-03-15 Tokyo Electron Ltd 基板処理装置およびそれに用いる基板載置台
KR100804169B1 (ko) * 2005-12-31 2008-02-18 주식회사 아이피에스 박막증착챔버용 서셉터
US8540819B2 (en) * 2008-03-21 2013-09-24 Ngk Insulators, Ltd. Ceramic heater
US9460915B2 (en) * 2014-09-12 2016-10-04 Lam Research Corporation Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edges
JP6424700B2 (ja) * 2015-03-26 2018-11-21 住友大阪セメント株式会社 静電チャック装置
TWI734770B (zh) * 2016-04-24 2021-08-01 美商應用材料股份有限公司 用於防止空間ald處理腔室中之背側沉積的設備
US10910195B2 (en) * 2017-01-05 2021-02-02 Lam Research Corporation Substrate support with improved process uniformity
US10553404B2 (en) * 2017-02-01 2020-02-04 Applied Materials, Inc. Adjustable extended electrode for edge uniformity control
CN111448647B (zh) * 2018-03-26 2023-08-01 日本碍子株式会社 静电卡盘加热器

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