JP2023163896A - ポリエステルイミド及びポリエステルアミド酸 - Google Patents

ポリエステルイミド及びポリエステルアミド酸 Download PDF

Info

Publication number
JP2023163896A
JP2023163896A JP2022075108A JP2022075108A JP2023163896A JP 2023163896 A JP2023163896 A JP 2023163896A JP 2022075108 A JP2022075108 A JP 2022075108A JP 2022075108 A JP2022075108 A JP 2022075108A JP 2023163896 A JP2023163896 A JP 2023163896A
Authority
JP
Japan
Prior art keywords
formula
polyesterimide
represented
group
general formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022075108A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023163896A5 (https=
Inventor
唯我 浅井
Yuiga Asai
直貴 木村
Naoki Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP2022075108A priority Critical patent/JP2023163896A/ja
Publication of JP2023163896A publication Critical patent/JP2023163896A/ja
Publication of JP2023163896A5 publication Critical patent/JP2023163896A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2022075108A 2022-04-28 2022-04-28 ポリエステルイミド及びポリエステルアミド酸 Pending JP2023163896A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022075108A JP2023163896A (ja) 2022-04-28 2022-04-28 ポリエステルイミド及びポリエステルアミド酸

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022075108A JP2023163896A (ja) 2022-04-28 2022-04-28 ポリエステルイミド及びポリエステルアミド酸

Publications (2)

Publication Number Publication Date
JP2023163896A true JP2023163896A (ja) 2023-11-10
JP2023163896A5 JP2023163896A5 (https=) 2025-02-19

Family

ID=88652129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022075108A Pending JP2023163896A (ja) 2022-04-28 2022-04-28 ポリエステルイミド及びポリエステルアミド酸

Country Status (1)

Country Link
JP (1) JP2023163896A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119144156A (zh) * 2024-11-21 2024-12-17 安徽方胜电子科技有限公司 一种聚酰亚胺膜及其制备方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5083499A (https=) * 1973-11-16 1975-07-05
JPH1036506A (ja) * 1996-07-18 1998-02-10 Kanegafuchi Chem Ind Co Ltd 新規なポリイミド組成物及びポリイミドフィルム
WO2009139086A1 (ja) * 2008-05-16 2009-11-19 旭化成イーマテリアルズ株式会社 ポリエステルイミド前駆体及びポリエステルイミド
JP2009280660A (ja) * 2008-05-20 2009-12-03 Asahi Kasei E-Materials Corp ポリイミド樹脂
JP2013028695A (ja) * 2011-07-28 2013-02-07 Sumitomo Electric Wintec Inc ポリイミド樹脂ワニス及びそれを用いた絶縁電線、電機コイル、モータ
JP2014049377A (ja) * 2012-09-03 2014-03-17 Hitachi Metals Ltd 絶縁電線及びそれを用いたコイル
JP2015155483A (ja) * 2012-05-29 2015-08-27 日産化学工業株式会社 樹脂組成物
US20210017336A1 (en) * 2019-07-16 2021-01-21 Zhen Ding Technology Co., Ltd. Polyamic acid composition, polyimide film, and copper clad laminate
WO2021230199A1 (ja) * 2020-05-13 2021-11-18 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5083499A (https=) * 1973-11-16 1975-07-05
JPH1036506A (ja) * 1996-07-18 1998-02-10 Kanegafuchi Chem Ind Co Ltd 新規なポリイミド組成物及びポリイミドフィルム
WO2009139086A1 (ja) * 2008-05-16 2009-11-19 旭化成イーマテリアルズ株式会社 ポリエステルイミド前駆体及びポリエステルイミド
JP2009280660A (ja) * 2008-05-20 2009-12-03 Asahi Kasei E-Materials Corp ポリイミド樹脂
JP2013028695A (ja) * 2011-07-28 2013-02-07 Sumitomo Electric Wintec Inc ポリイミド樹脂ワニス及びそれを用いた絶縁電線、電機コイル、モータ
JP2015155483A (ja) * 2012-05-29 2015-08-27 日産化学工業株式会社 樹脂組成物
JP2014049377A (ja) * 2012-09-03 2014-03-17 Hitachi Metals Ltd 絶縁電線及びそれを用いたコイル
US20210017336A1 (en) * 2019-07-16 2021-01-21 Zhen Ding Technology Co., Ltd. Polyamic acid composition, polyimide film, and copper clad laminate
WO2021230199A1 (ja) * 2020-05-13 2021-11-18 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119144156A (zh) * 2024-11-21 2024-12-17 安徽方胜电子科技有限公司 一种聚酰亚胺膜及其制备方法

Similar Documents

Publication Publication Date Title
JP2024040228A (ja) 金属張積層板の製造方法
CN105315665B (zh) 聚酰亚胺前体组合物、制备聚酰亚胺前体的方法、聚酰亚胺成形体及其制备方法
JP4998040B2 (ja) ポリアミック酸のイミド化重合体絶縁膜および膜形成組成物とその製造方法
JP7780277B2 (ja) 熱可塑性ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板
CN121758749A (zh) 聚酰亚胺的制造方法
KR20120083361A (ko) Ｐｍｄａ, ｄａｄｅ, ｂｐｄａ 및 ｂｃｄ 를 함유하는 유기 용매에 가용인 폴리이미드
JP7803948B2 (ja) ポリアミック酸組成物およびこれを含むポリイミド
Cao et al. Polymerization of poly-(amic acid) ammonium salt in aqueous solution and its use in flexible printed circuit boards
TW202126128A (zh) 覆金屬層疊板及電路基板
JP2023163896A (ja) ポリエステルイミド及びポリエステルアミド酸
JP5144427B2 (ja) ポリイミド系樹脂水系分散体の製造方法
JP7720343B2 (ja) ポリアミック酸、ポリアミック酸組成物、ポリイミド、ポリイミドフィルム及びプリント配線板
JP7806517B2 (ja) ポリエステルイミド及びポリエステルアミド酸
JP7830961B2 (ja) 絶縁電線
CN118063770A (zh) 双马来酰亚胺化合物、树脂清漆和双马来酰亚胺化合物的制造方法
JP3855327B2 (ja) ポリイミド系コーティング材料
KR20230157950A (ko) 폴리이미드 전구체 조성물
KR20130002838A (ko) 고온에서의 열적 치수안정성이 우수한 폴리이미드 필름 및 그를 이용한 디스플레이 소자용 기판
JP2021191859A (ja) オリゴアミノマレイミド
JP2021105146A (ja) 樹脂組成物及び樹脂フィルム
JP2023550438A (ja) ポリアミック酸組成物およびこれを含むポリイミド
JP7691576B2 (ja) ポリイミド被覆物
JP2021105147A (ja) 樹脂組成物及び樹脂フィルム
JPH08120040A (ja) 耐熱性電気絶縁材料およびそれを用いた耐熱性電気絶縁膜の製造方法
KR102260048B1 (ko) 폴리아믹산 조성물, 폴리아믹산 조성물의 제조방법 및 이를 포함하는 폴리이미드

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250210

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250310

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20251226

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20260120

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20260313