JP2023155995A - Print circuit board and manufacturing method thereof - Google Patents

Abstract

To provide a printed circuit board and a manufacturing method thereof that can reduce the amount of resin used when an electronic component is housed in an opening, eliminate voids in the resin, and prevent the electronic component from moving.SOLUTION: A print circuit board includes a core board 1 with an opening 2 formed therein, and an electronic component 3 accommodated in an opening of the core board, and when the thickness of the core board is T1 and the thickness of the electronic component is T2, the relationship between T1 and T2 satisfies T2/T1=0.75 to 0.95. A manufacturing method of a print circuit board includes forming an opening in the core board, and using resin in the opening to house the electronic component, and when the thickness of the core board is T1 and the thickness of the electronic component is T2, the relationship between T1 and T2 satisfies T2/T1=0.75 to 0.95.SELECTED DRAWING: Figure 1

Description

The present invention relates to a printed wiring board in which electronic components are mounted on a core board, and a method for manufacturing the same.

Conventionally, in printed wiring boards in which electronic components are mounted on a core board, in order to improve the strength of the printed wiring board, the ratio of the thickness of the electronic components to the thickness of the core board is set to 0.3 or more to 0.7. The following technology is known from Patent Document 1.

FIG. 3 is a diagram for explaining a conventional printed wiring board disclosed in Patent Document 1. In FIG. 3, 51 is a core substrate, 52 is an opening formed in the core substrate 51, 53 is an electronic component mounted in the opening 52, and 54-1 to 54-3 are the upper and lower surfaces of the core substrate 51, respectively. and an insulating layer made of resin formed in a portion of the opening 52 other than the electronic component 53. In Patent Document 1, when the thickness of the core substrate 51 is T1 and the thickness of the electronic component 53 is T2, the relationship between T1 and T2 is T2/T1 (R) = 0.3 to 0.7. .

JP2014-38890A

In the printed wiring board described in Patent Document 1 mentioned above, since R indicating the relationship between the thickness T1 of the core substrate 51 and the thickness T2 of the electronic component 53 is small at 0.3 to 0.7, the electronic component It is necessary to press a large amount of resin into the opening 52 for accommodating the insulating layer 54-3. Therefore, there was a problem that voids were formed in the resin filled in the openings 52. Further, there was also the problem that when the resin was pushed into the opening 52, the electronic component 53 moved.

The printed wiring board of the present invention includes a core substrate in which an opening is formed, and an electronic component accommodated in the opening of the core substrate, wherein the thickness of the core substrate is T1, and the thickness of the electronic component is T1. When is T2, the configuration is such that the relationship between T1 and T2 satisfies T2/T1=0.75 to 0.95.

Further, the method for manufacturing a printed wiring board of the present invention includes forming an opening in a core substrate, and accommodating an electronic component in the opening using resin, wherein the thickness of the core substrate is set as T1. , when the thickness of the electronic component is T2, the relationship between T1 and T2 is configured to satisfy T2/T1=0.75 to 0.95.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram for explaining one embodiment of a printed wiring board of the present invention. (a) to (d) are diagrams each for explaining one step in an embodiment of the printed wiring board manufacturing method of the present invention. FIG. 2 is a diagram for explaining an embodiment of a conventional printed wiring board.

FIG. 1 is a diagram for explaining one embodiment of a printed wiring board of the present invention. In FIG. 1, 1 is a core substrate, 2 is an opening formed in the core substrate 1, 3 is an electronic component mounted in the opening 2, and 4-1 to 4-3 are the upper and lower surfaces of the core substrate 1, respectively. and an insulating layer formed in a portion other than the electronic component 3 within the opening 2. In the embodiment shown in FIG. 1, only the core substrate 1, opening 2, electronic component 3, and insulating layers 4-1 to 4-3 are shown to make it easier to understand the features of the present invention. As in the past, there are built-up layers on the top and bottom surfaces of the core substrate 1 that are made up of multiple layers of conductive patterns and insulating layers, and through holes for electrically connecting the top and bottom surfaces of the core substrate 1. etc. are provided.

A feature of the printed wiring board of the present invention is that, when the thickness of the core substrate 1 is T1 and the thickness of the electronic component 3 is T2, the relationship between T1 and T2 is T2/T1 (R) = 0.75 ~ 0.95, preferably T2/T1(R)=0.80 to 0.95. Here, the reason for setting T2/T1(R) = 0.75 to 0.95 is that if R is less than 0.75, voids may occur when pushing the resin to be filled into the opening 2. It's for a reason. Further, when the opening 2 is filled with resin, the electronic component 3 receives force through the resin. At this time, if R exceeds 0.95, the amount of resin on the electronic component 3 is small, so the force transmitted to the electronic component 3 becomes large, and the electronic component 3 becomes easily broken.

According to the printed wiring board of the present invention, by making R larger than that of a conventional printed wiring board, the amount of resin used can be reduced when housing the electronic component 3 in the opening 2. As a result, no voids are created in the resin filling the opening 2. Further, when the resin is pushed into the opening 2, the electronic component 3 does not move.

FIGS. 2(a) to 2(d) are diagrams for explaining one step in an embodiment of the printed wiring board manufacturing method of the present invention, respectively. The method for manufacturing a printed wiring board of the present invention will be described below with reference to FIGS. 2(a) to 2(d).

First, as shown in FIG. 2(a), a core substrate 1 such as a copper-clad laminate is prepared. Next, as shown in FIG. 2(b), an opening 2 is formed in the core substrate 1 using, for example, a router. Next, as shown in FIG. 2(c), an insulating layer 4-2 is provided on one surface of the core substrate 1, and the electronic component 3 is mounted on the insulating layer 4-2 within the opening 2. Next, as shown in FIG. 2(d), the other surface of the core substrate 1 and the portion other than the electronic component 3 in the opening 2 are filled with resin, and insulating layers 4-1 and 4-3 are formed. The electronic component 3 is housed within the opening 2.

A feature of the method for manufacturing a printed wiring board of the present invention according to the above steps is that, like the printed wiring board of the present invention, the thickness of the electronic component 3 accommodated in the opening 2 is defined. Specifically, when the thickness of the core substrate 1 is T1 and the thickness of the electronic component 3 is T2, the relationship between T1 and T2 is T2/T1(R)=0.75 to 0.95, preferably was configured so that T2/T1(R)=0.80 to 0.95.

According to the method of manufacturing a printed wiring board of the present invention, by making R larger than that of a conventional printed wiring board, the amount of resin used when pushing the resin and filling the electronic component 3 into the opening 2 can be reduced. It can be reduced. As a result, no voids are created in the resin filling the opening 2. Further, when the resin is pushed into the opening 2, the electronic component 3 does not move.

1 Core board 2 Opening 3 Electronic components 4-1 to 4-3 Insulating layer

Claims (4)

a core substrate with an opening formed therein;
an electronic component accommodated in the opening of the core substrate;
has
A printed wiring board configured such that, where the thickness of the core substrate is T1 and the thickness of the electronic component is T2, the relationship between T1 and T2 satisfies T2/T1=0.75 to 0.95. The printed wiring board according to claim 1, wherein the relationship between T1 and T2 is T2/T1=0.80 to 0.95. forming an opening in the core substrate;
accommodating electronic components in the opening using resin;
including;
When the thickness of the core substrate is T1 and the thickness of the electronic component is T2, the printed wiring board is configured such that the relationship between T1 and T2 satisfies T2/T1=0.75 to 0.95. Production method. 4. The method of manufacturing a printed wiring board according to claim 3, wherein the relationship between T1 and T2 is T2/T1=0.80 to 0.95.

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