JP2023153825A5 - - Google Patents
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- Publication number
- JP2023153825A5 JP2023153825A5 JP2023116015A JP2023116015A JP2023153825A5 JP 2023153825 A5 JP2023153825 A5 JP 2023153825A5 JP 2023116015 A JP2023116015 A JP 2023116015A JP 2023116015 A JP2023116015 A JP 2023116015A JP 2023153825 A5 JP2023153825 A5 JP 2023153825A5
- Authority
- JP
- Japan
- Prior art keywords
- cluster tool
- substrate
- sputter target
- magnetic field
- vapor deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 21
- 239000007789 gas Substances 0.000 claims 7
- 238000005240 physical vapour deposition Methods 0.000 claims 6
- 230000007717 exclusion Effects 0.000 claims 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 1
- 238000000576 coating method Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000168 high power impulse magnetron sputter deposition Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962843201P | 2019-05-03 | 2019-05-03 | |
| US62/843,201 | 2019-05-03 | ||
| JP2021564871A JP7316379B2 (ja) | 2019-05-03 | 2020-04-13 | 裏側物理的気相堆積の方法及び装置 |
| PCT/US2020/027994 WO2020226855A1 (en) | 2019-05-03 | 2020-04-13 | Method and apparatus for backside physical vapor deposition |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021564871A Division JP7316379B2 (ja) | 2019-05-03 | 2020-04-13 | 裏側物理的気相堆積の方法及び装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023153825A JP2023153825A (ja) | 2023-10-18 |
| JP2023153825A5 true JP2023153825A5 (https=) | 2024-10-21 |
| JP7635306B2 JP7635306B2 (ja) | 2025-02-25 |
Family
ID=73016738
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021564871A Active JP7316379B2 (ja) | 2019-05-03 | 2020-04-13 | 裏側物理的気相堆積の方法及び装置 |
| JP2023116015A Active JP7635306B2 (ja) | 2019-05-03 | 2023-07-14 | 裏側物理的気相堆積の方法及び装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021564871A Active JP7316379B2 (ja) | 2019-05-03 | 2020-04-13 | 裏側物理的気相堆積の方法及び装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US11469096B2 (https=) |
| JP (2) | JP7316379B2 (https=) |
| KR (2) | KR20250010145A (https=) |
| WO (1) | WO2020226855A1 (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102769624B1 (ko) * | 2018-12-26 | 2025-02-20 | 삼성전자주식회사 | 반도체 소자 제조 방법 및 반도체 공정 설비 |
| KR20250010145A (ko) * | 2019-05-03 | 2025-01-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 후면 물리 기상 증착을 위한 방법 및 장치 |
| WO2020251696A1 (en) * | 2019-06-10 | 2020-12-17 | Applied Materials, Inc. | Processing system for forming layers |
| US11860528B2 (en) * | 2020-12-21 | 2024-01-02 | Applied Materials, Inc. | Multi-chamber substrate processing platform |
| CN117223088A (zh) * | 2021-04-27 | 2023-12-12 | 应用材料公司 | 用于半导体处理的应力与重叠管理 |
| WO2023102376A1 (en) * | 2021-12-01 | 2023-06-08 | Lam Research Corporation | Deposition of high compressive stress thermally stable nitride film |
| TW202348822A (zh) * | 2022-02-14 | 2023-12-16 | 美商應用材料股份有限公司 | 用於製造pvd鈣鈦礦膜的設備及方法 |
| TWI826001B (zh) * | 2022-09-19 | 2023-12-11 | 汎銓科技股份有限公司 | 一種減少缺陷的鍍膜方法 |
| KR102833899B1 (ko) * | 2023-03-09 | 2025-07-15 | 에스케이실트론 주식회사 | 웨이퍼 리프트 핀 |
| CN116254513A (zh) * | 2023-04-12 | 2023-06-13 | 北京航空航天大学合肥创新研究院(北京航空航天大学合肥研究生院) | 一种用于超薄膜制备的团簇束流沉积系统 |
| CN118109804B (zh) * | 2024-04-19 | 2024-07-16 | 上海陛通半导体能源科技股份有限公司 | 背面镀膜工艺腔室及化学气相沉积设备 |
| CN119710592B (zh) * | 2024-12-24 | 2025-07-18 | 江苏乐萌精密科技有限公司 | 一种基于磁场分布设计的双面同步成膜的高效镀膜机 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6218881A (ja) * | 1985-07-18 | 1987-01-27 | Fuji Photo Film Co Ltd | フイ−ルド／フレ−ム変換方式 |
| JP3343620B2 (ja) * | 1992-04-09 | 2002-11-11 | アネルバ株式会社 | マグネトロンスパッタリングによる薄膜形成方法および装置 |
| US6620298B1 (en) * | 1999-04-23 | 2003-09-16 | Matsushita Electric Industrial Co., Ltd. | Magnetron sputtering method and apparatus |
| EP1089328A1 (en) | 1999-09-29 | 2001-04-04 | Infineon Technologies AG | Method for manufacturing of a semiconductor device |
| KR20020034492A (ko) | 2000-11-02 | 2002-05-09 | 박종섭 | 반도체 소자의 제조방법 |
| US7169685B2 (en) * | 2002-02-25 | 2007-01-30 | Micron Technology, Inc. | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive |
| US7314808B2 (en) | 2004-12-23 | 2008-01-01 | Applied Materials, Inc. | Method for sequencing substrates |
| US8845866B2 (en) * | 2005-12-22 | 2014-09-30 | General Electric Company | Optoelectronic devices having electrode films and methods and system for manufacturing the same |
| US7862927B2 (en) * | 2007-03-02 | 2011-01-04 | Front Edge Technology | Thin film battery and manufacturing method |
| JP2010037656A (ja) | 2008-08-01 | 2010-02-18 | Fuji Electric Holdings Co Ltd | スパッタリング装置 |
| US9685186B2 (en) * | 2009-02-27 | 2017-06-20 | Applied Materials, Inc. | HDD pattern implant system |
| US9881788B2 (en) * | 2014-05-22 | 2018-01-30 | Lam Research Corporation | Back side deposition apparatus and applications |
| JP6596634B2 (ja) | 2014-10-23 | 2019-10-30 | アドバンストマテリアルテクノロジーズ株式会社 | 強誘電体セラミックス、電子部品及び強誘電体セラミックスの製造方法 |
| KR20190088493A (ko) * | 2016-11-18 | 2019-07-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 헤테로접합 태양 전지 형성을 위한 교환 및 플립 챔버 설계 |
| US20180174873A1 (en) * | 2016-12-15 | 2018-06-21 | Applied Materials, Inc. | Apparatus And Method For Processing Thin Substrates |
| KR20250010145A (ko) * | 2019-05-03 | 2025-01-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 후면 물리 기상 증착을 위한 방법 및 장치 |
| US11572618B2 (en) * | 2019-08-27 | 2023-02-07 | Applied Materials, Inc. | Method and chamber for backside physical vapor deposition |
-
2020
- 2020-04-13 KR KR1020257000746A patent/KR20250010145A/ko active Pending
- 2020-04-13 KR KR1020217039451A patent/KR102755462B1/ko active Active
- 2020-04-13 JP JP2021564871A patent/JP7316379B2/ja active Active
- 2020-04-13 US US16/847,455 patent/US11469096B2/en active Active
- 2020-04-13 WO PCT/US2020/027994 patent/WO2020226855A1/en not_active Ceased
-
2022
- 2022-09-02 US US17/902,357 patent/US12142478B2/en active Active
-
2023
- 2023-06-19 US US18/337,319 patent/US12176205B2/en active Active
- 2023-07-14 JP JP2023116015A patent/JP7635306B2/ja active Active
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