JP2023138241A - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP2023138241A
JP2023138241A JP2022128898A JP2022128898A JP2023138241A JP 2023138241 A JP2023138241 A JP 2023138241A JP 2022128898 A JP2022128898 A JP 2022128898A JP 2022128898 A JP2022128898 A JP 2022128898A JP 2023138241 A JP2023138241 A JP 2023138241A
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Japan
Prior art keywords
processing
substrate
processing liquid
wall
tank
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Pending
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JP2022128898A
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English (en)
Japanese (ja)
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JP2023138241A5 (https=
Inventor
州作 松本
Shusaku Matsumoto
浩一郎 川野
Koichiro Kawano
視紅磨 加藤
Shiguma Kato
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Kioxia Corp
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Kioxia Corp
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Publication date
Application filed by Kioxia Corp filed Critical Kioxia Corp
Priority to TW111131338A priority Critical patent/TWI837779B/zh
Priority to US17/929,923 priority patent/US12424460B2/en
Priority to CN202211087691.4A priority patent/CN116798866A/zh
Publication of JP2023138241A publication Critical patent/JP2023138241A/ja
Publication of JP2023138241A5 publication Critical patent/JP2023138241A5/ja
Pending legal-status Critical Current

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  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2022128898A 2022-03-16 2022-08-12 基板処理装置 Pending JP2023138241A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW111131338A TWI837779B (zh) 2022-03-16 2022-08-19 基板處理裝置
US17/929,923 US12424460B2 (en) 2022-03-16 2022-09-06 Substrate processing apparatus
CN202211087691.4A CN116798866A (zh) 2022-03-16 2022-09-07 基板处理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022041243 2022-03-16
JP2022041243 2022-03-16

Publications (2)

Publication Number Publication Date
JP2023138241A true JP2023138241A (ja) 2023-10-02
JP2023138241A5 JP2023138241A5 (https=) 2025-03-26

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ID=88197497

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JP2022128898A Pending JP2023138241A (ja) 2022-03-16 2022-08-12 基板処理装置

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JP (1) JP2023138241A (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07273077A (ja) * 1994-03-28 1995-10-20 Shin Etsu Handotai Co Ltd ウエーハのリンス方法及びリンス装置
JPH10209108A (ja) * 1997-01-24 1998-08-07 Takao Nakazawa 半導体ウエハの洗浄処理装置
JP2020107744A (ja) * 2018-12-27 2020-07-09 東京エレクトロン株式会社 基板液処理装置
JP2021106253A (ja) * 2019-12-26 2021-07-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07273077A (ja) * 1994-03-28 1995-10-20 Shin Etsu Handotai Co Ltd ウエーハのリンス方法及びリンス装置
JPH10209108A (ja) * 1997-01-24 1998-08-07 Takao Nakazawa 半導体ウエハの洗浄処理装置
JP2020107744A (ja) * 2018-12-27 2020-07-09 東京エレクトロン株式会社 基板液処理装置
JP2021106253A (ja) * 2019-12-26 2021-07-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

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