JP2023138241A5 - - Google Patents

Download PDF

Info

Publication number
JP2023138241A5
JP2023138241A5 JP2022128898A JP2022128898A JP2023138241A5 JP 2023138241 A5 JP2023138241 A5 JP 2023138241A5 JP 2022128898 A JP2022128898 A JP 2022128898A JP 2022128898 A JP2022128898 A JP 2022128898A JP 2023138241 A5 JP2023138241 A5 JP 2023138241A5
Authority
JP
Japan
Prior art keywords
processing
tank
wall
substrates
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022128898A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023138241A (ja
Filing date
Publication date
Application filed filed Critical
Priority to TW111131338A priority Critical patent/TWI837779B/zh
Priority to US17/929,923 priority patent/US12424460B2/en
Priority to CN202211087691.4A priority patent/CN116798866A/zh
Publication of JP2023138241A publication Critical patent/JP2023138241A/ja
Publication of JP2023138241A5 publication Critical patent/JP2023138241A5/ja
Pending legal-status Critical Current

Links

JP2022128898A 2022-03-16 2022-08-12 基板処理装置 Pending JP2023138241A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW111131338A TWI837779B (zh) 2022-03-16 2022-08-19 基板處理裝置
US17/929,923 US12424460B2 (en) 2022-03-16 2022-09-06 Substrate processing apparatus
CN202211087691.4A CN116798866A (zh) 2022-03-16 2022-09-07 基板处理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022041243 2022-03-16
JP2022041243 2022-03-16

Publications (2)

Publication Number Publication Date
JP2023138241A JP2023138241A (ja) 2023-10-02
JP2023138241A5 true JP2023138241A5 (https=) 2025-03-26

Family

ID=88197497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022128898A Pending JP2023138241A (ja) 2022-03-16 2022-08-12 基板処理装置

Country Status (1)

Country Link
JP (1) JP2023138241A (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3146841B2 (ja) * 1994-03-28 2001-03-19 信越半導体株式会社 ウエーハのリンス装置
JPH10209108A (ja) * 1997-01-24 1998-08-07 Takao Nakazawa 半導体ウエハの洗浄処理装置
JP7178261B2 (ja) * 2018-12-27 2022-11-25 東京エレクトロン株式会社 基板液処理装置
JP7583546B2 (ja) * 2019-12-26 2024-11-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Similar Documents

Publication Publication Date Title
JP5829458B2 (ja) 基板処理装置
JP2016180144A (ja) 基板処理装置
CN116888711A (zh) 晶圆收纳容器的清洗装置及晶圆收纳容器的清洗方法
JP2023138241A5 (https=)
JP5781015B2 (ja) ウェハ洗浄装置及び洗浄槽の洗浄方法
CN108282962B (zh) 一种集成线路板加工的蚀刻退锡机
US3824137A (en) Solution agitation process
JP2005334839A (ja) 油水分離装置
JPH0437131A (ja) 半導体ウエハの純水水洗槽及び水洗方法
CN210182344U (zh) 一种循环槽体潜排系统
CN213421051U (zh) 一种蒸汽发生器
CN108321104B (zh) 一种具有管路结构的蚀刻装置
US10981803B2 (en) Regulating tank of wastewater treatment system
CN220619169U (zh) 电镀设备
CN102534739B (zh) 过滤装置及过滤方法
JPH11319737A (ja) 板状体の洗浄装置
JP5419427B2 (ja) 処理液装置の処理液制御方法
US20200308819A1 (en) Cooling Apparatus of Regulating Tank
CN208493344U (zh) 一种酪氨酸加工用快速沉放冷却装置
CN217757720U (zh) 晶圆电镀设备高压喷淋槽
CN216473547U (zh) 一种避免溢液的电镀处理装置
CN218309872U (zh) 一种电镀用封闭式清洗池
CN214991986U (zh) 带冷却系统的航空钣金件电镀v型座
CN223571485U (zh) 进样针清洗装置和点样设备
JP2014005516A5 (https=)