JP2023070990A5 - - Google Patents
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- JP2023070990A5 JP2023070990A5 JP2021183532A JP2021183532A JP2023070990A5 JP 2023070990 A5 JP2023070990 A5 JP 2023070990A5 JP 2021183532 A JP2021183532 A JP 2021183532A JP 2021183532 A JP2021183532 A JP 2021183532A JP 2023070990 A5 JP2023070990 A5 JP 2023070990A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- light emitting
- bonding
- contact electrode
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims description 35
- 239000013078 crystal Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 230000007704 transition Effects 0.000 claims 2
- 238000002360 preparation method Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 21
- 238000010586 diagram Methods 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021183532A JP2023070990A (ja) | 2021-11-10 | 2021-11-10 | 半導体発光素子、発光モジュール、及び発光モジュールの製造方法 |
| CN202280074625.5A CN118216052A (zh) | 2021-11-10 | 2022-10-31 | 半导体发光元件、发光模块及发光模块的制造方法 |
| PCT/JP2022/040764 WO2023085161A1 (ja) | 2021-11-10 | 2022-10-31 | 半導体発光素子、発光モジュール、及び発光モジュールの製造方法 |
| US18/653,508 US20240282901A1 (en) | 2021-11-10 | 2024-05-02 | Semiconductor light-emitting element, light-emitting module, and method for manufacturing light-emitting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021183532A JP2023070990A (ja) | 2021-11-10 | 2021-11-10 | 半導体発光素子、発光モジュール、及び発光モジュールの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023070990A JP2023070990A (ja) | 2023-05-22 |
| JP2023070990A5 true JP2023070990A5 (enExample) | 2024-10-07 |
Family
ID=86335930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021183532A Pending JP2023070990A (ja) | 2021-11-10 | 2021-11-10 | 半導体発光素子、発光モジュール、及び発光モジュールの製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240282901A1 (enExample) |
| JP (1) | JP2023070990A (enExample) |
| CN (1) | CN118216052A (enExample) |
| WO (1) | WO2023085161A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116683286A (zh) * | 2023-06-15 | 2023-09-01 | 厦门市三安光电科技有限公司 | 一种半导体激光器 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006278463A (ja) * | 2005-03-28 | 2006-10-12 | Dowa Mining Co Ltd | サブマウント |
| JP2012227383A (ja) * | 2011-04-20 | 2012-11-15 | Showa Denko Kk | 半導体発光素子、電極構造および発光装置 |
| EP2756524A4 (en) * | 2011-09-13 | 2015-06-03 | Adesto Technologies Corp | RESISTANCE CONTROL DEVICES WITH ALLOYED ELECTRODES AND METHOD OF MANUFACTURE THEREOF |
| JP6001956B2 (ja) * | 2012-08-10 | 2016-10-05 | 株式会社東芝 | 半導体装置 |
| JP6698231B2 (ja) * | 2018-02-01 | 2020-05-27 | パナソニック株式会社 | 半導体装置および半導体装置の製造方法 |
| US10923451B2 (en) * | 2019-07-16 | 2021-02-16 | Nxp Usa, Inc. | Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods |
-
2021
- 2021-11-10 JP JP2021183532A patent/JP2023070990A/ja active Pending
-
2022
- 2022-10-31 WO PCT/JP2022/040764 patent/WO2023085161A1/ja not_active Ceased
- 2022-10-31 CN CN202280074625.5A patent/CN118216052A/zh active Pending
-
2024
- 2024-05-02 US US18/653,508 patent/US20240282901A1/en active Pending
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