JP2023060388A - Electronic device and cooling module - Google Patents

Abstract

To provide an electronic device equipped with a cooling module capable of obtaining high cooling efficiency even when a plurality of heat pipes are used in parallel, and the cooling module.SOLUTION: An electronic device includes a housing, a heating element provided in the housing, and a cooling module that is installed in the housing and absorbs the heat generated by the heating element, and the cooling module includes a plurality of first heat pipes arranged in parallel and configured to be wider than the heating element as a whole arranged in parallel, at least one of which is arranged to overlap with the heating element, and a second heat pipe that is laminated between the first heat pipe and the heating element in a posture perpendicular to the first heat pipe, the first surface is connected to the heating element, and the second surface is connected to the first heat pipe.SELECTED DRAWING: Figure 4

Description

The present invention relates to an electronic device provided with a cooling module and the cooling module.

2. Description of the Related Art Electronic devices such as notebook PCs are equipped with heat generating elements such as CPUs and GPUs, and cooling modules for cooling these heat generating elements. A cooling module generally has a configuration including a heat pipe (see, for example, Patent Document 1). The heat pipe can efficiently absorb the heat generated by the heating element and efficiently transport the heat to the cooling fins and the blower fan.

JP 2020-088273 A

By using a plurality of heat pipes in parallel as in the configuration of Patent Literature 1, the amount of heat transport can be increased. However, in such a configuration, depending on the width of the heat pipes and the number of parallel heat pipes, the parallel heat pipes may be wider than the heating element such as the CPU. In this case, the heat pipes located farther from the heat generating element receive less heat than the heat pipes located closer to the heat generating element, which is a factor in lowering the thermal efficiency of the parallel heat pipes as a whole.

The present invention has been made in consideration of the above-mentioned problems of the prior art, and an electronic device equipped with a cooling module capable of obtaining high cooling efficiency even when a plurality of heat pipes are used in parallel; The object is to provide a cooling module.

An electronic device according to a first aspect of the present invention includes a housing, a heating element provided in the housing, and a cooling module provided in the housing for absorbing heat generated by the heating element. a first heat pipe in which a plurality of the cooling modules are arranged in parallel and are wider than the heat generating element as a whole, and at least one of the first heat pipes is arranged so as to overlap the heat generating element; is laminated between the first heat pipe and the heat generating element in a posture orthogonal to the first heat pipe, the first surface is connected to the heat generating element, and the second surface is the first heat pipe and a second heat pipe connected to.

A cooling module according to a second aspect of the present invention includes a plurality of first heat pipes arranged in parallel, a second heat pipe stacked in a posture perpendicular to the first heat pipes, a blower fan, and the blower fan. and cooling fins arranged facing the exhaust port of and to which the first heat pipe is connected.

According to one aspect of the present invention, high cooling efficiency can be obtained even when a plurality of heat pipes are used in parallel.

FIG. 1 is a schematic plan view looking down on an electronic device according to an embodiment. FIG. 2 is a perspective view of the cooling module viewed obliquely from above. FIG. 3 is a perspective view of the cooling module viewed obliquely from below. FIG. 4 is an explanatory diagram schematically showing heat transport operations by the first heat pipe group and the second heat pipe group. FIG. 5 is a graph showing experimental results of cooling capacity of a cooling module with a second heat pipe group and a cooling module without a second heat pipe group. FIG. 6 is a schematic plan view showing a cooling module according to a modification.

BEST MODE FOR CARRYING OUT THE INVENTION An electronic device and a cooling module according to the present invention will be described in detail below with reference to preferred embodiments and with reference to the accompanying drawings.

FIG. 1 is a schematic plan view looking down on an electronic device 10 according to an embodiment. The electronic device 10 according to this embodiment is a clamshell notebook PC in which a display housing 12 and a housing 14 are connected by a hinge 16 so as to be relatively rotatable. The electronic device may be, for example, a desktop PC, a tablet PC, or a game machine, in addition to the notebook PC.

The display housing 12 is a thin flat box. A display 18 is mounted on the display housing 12 . The display 18 is composed of, for example, an organic EL (OLED: Organic Light Emitting Diode) or a liquid crystal.

Hereinafter, regarding the housing 14 and each element mounted therein, the posture of using the keyboard 20 mounted on the upper surface of the housing 14 is used as a reference, the front side is the front, the back side is the rear, the width direction is left and right, and the height is The width direction (thickness direction of the housing 14) will be referred to as up and down for explanation. Each of these directions is for convenience of explanation, and it goes without saying that the actual direction of the product changes depending on the usage condition of the housing 14 and the like.

The housing 14 is a thin flat box. A keyboard 20 and a touch pad 21 are provided on the upper surface of the housing 14 . The rear end of housing 14 is connected to display housing 12 using hinge 16 . Mounted inside the housing 14 are a cooling module 22, a motherboard 26 (see FIG. 4) on which a CPU 24 and a GPU 25 are mounted, and a battery device. Various electronic components and mechanical components are further mounted inside the housing 14 .

A CPU (Central Processing Unit) 24 performs calculations related to main control and processing of the electronic device 10 . A GPU (Graphics Processing Unit) 25 performs calculations necessary for rendering images such as 3D graphics. Reference numeral 25a in FIG. 4 denotes a package substrate on which the GPU (die) 25 is mounted.

The CPU 24 and GPU 25 are heat generating elements that generate the largest amount of heat among the electronic components mounted in the housing 14 . Therefore, the cooling module 22 absorbs and diffuses the heat generated by the CPU 24 and the GPU 25 and discharges it to the outside of the housing 14 . The cooling module 22 is stacked on the bottom surface of the motherboard on which the CPU 24 and the like are mounted (under the mounting surface of the CPU 24 and the like).

FIG. 2 is a perspective view of the cooling module 22 viewed obliquely from above. FIG. 3 is a perspective view of the cooling module 22 viewed obliquely from below.

As shown in FIGS. 2 and 3, the cooling module 22 includes a first heat pipe group 27 consisting of a set of three, a second heat pipe group 28 consisting of a set of three, and two heat pipes. and a third heat pipe group 29 configured in pairs. Further, the cooling module 22 includes vapor chambers 30 and 31 arranged laterally, a pair of left and right cooling fins 32 and 33 , and a pair of left and right blow fans 34 and 35 .

As shown in FIGS. 2 and 3, the vapor chambers 30 and 31 are plate-like members for heat diffusion. Although the two vapor chambers 30 and 31 differ in size and shape, they have a common basic configuration. The vapor chambers 30 and 31 are plate-type heat transport devices in which a closed space is formed between two thin metal plates (eg, copper or aluminum) and a working fluid is enclosed in this closed space. Examples of working fluids include water, CFC alternatives, acetone, butane, and the like. The working fluid flows while undergoing a phase change within the closed space. A wick that transfers the condensed working fluid by capillary action is disposed in the sealed space. The vapor chambers 30, 31 may be replaced by plates of copper, aluminum or the like.

One vapor chamber 30 vertically overlaps the CPU 24 . The upper surface of this vapor chamber 30 is connected to the CPU 24 via a heat receiving plate 38 (see FIG. 2). The heat receiving plate 38 is a plate made of metal with high thermal conductivity such as copper or aluminum. The heat receiving plate 38 may be omitted, or may be replaced by a thermal interface material (TIM) such as thermally conductive grease.

The other vapor chamber 31 is arranged to surround the GPU 25 . This vapor chamber 31 has a rectangular hole 31a into which the GPU 25 is inserted. Reference numeral 36 in FIGS. 2 and 3 is a copper or aluminum metal plate that is connected to the front edge of the vapor chamber 31 and protrudes forward.

As shown in FIGS. 2 and 3, the cooling fins 32 and 33 are components that dissipate the heat transported by the heat pipe groups 27 and 29. As shown in FIGS. Although the two cooling fins 32 and 33 differ in size and shape, they have a common basic configuration. The cooling fins 32 and 33 have a structure in which a plurality of plate-shaped fins are arranged on the surface of the plate at regular intervals in the horizontal direction. Each fin stands vertically and extends in the front-rear direction. A gap through which the air sent from the blower fans 34 and 35 passes is formed between adjacent fins. The cooling fins 32, 33 are made of metal with high thermal conductivity, such as aluminum or copper.

One cooling fin 32 is arranged on the side of the vapor chamber 30 so as to face the rear surface (exhaust port 34a) of the blower fan 34 . The other cooling fin 33 is arranged on the side of the vapor chamber 31 so as to face the rear surface of the blower fan 35 (exhaust port 35a).

As shown in FIGS. 2 and 3 , the blower fans 34 and 35 are fans for blowing the cooling fins 32 and 33 . The two blower fans 34 and 35 are different in size and shape, but have the same basic configuration. The blower fans 34 and 35 are centrifugal fans that rotate impellers housed inside fan housings by means of motors. The blower fan 34 is arranged just before the cooling fins 32 . The blower fan 35 is arranged just before the cooling fins 33 . Reference numerals 34b and 35b in FIGS. 2 and 3 denote metal covers that form the lower surface of the fan housing, respectively, and also serve as mounts for the cooling fins 32 and 33 and the heat pipes 27a and 29b.

The blower fan 34 has air intake ports 34c and 34d opened on the upper and lower surfaces of the fan housing, respectively. The blower fan 35 has air intake ports 35c and 35d opened in the upper and lower surfaces of the fan housing. The blower fans 34 and 35 discharge the air inside the housing 14 sucked from the air intake ports 34c, 34d, 35c and 35d respectively from the air exhaust ports 34a and 35a. The air blown from the exhaust ports 34a, 35a passes through the cooling fins 32, 33 to promote heat dissipation.

As shown in FIGS. 2 and 3 , the first heat pipe group 27 is a pipe-shaped heat transport device mainly for transporting heat from the GPU 25 to the cooling fins 33 . The first heat pipe group 27 is formed by arranging three first heat pipes 27a to 27c in parallel. The number of first heat pipes constituting the first heat pipe group 27 may be two or more.

The first heat pipes 27a to 27c are formed by flattening thin metal pipes to have elliptical cross-sections, and working fluid is enclosed in sealed spaces formed in the metal pipes. The material of the metal pipe and the type of working fluid may be the same as or similar to those of the vapor chambers 30 and 31 described above. The working fluid flows while undergoing a phase change within the closed space. A wick that transfers the condensed working fluid by capillary action is disposed in the sealed space. The wick is formed of a porous body such as a mesh or a fine channel, which is made by knitting fine metal wires in a cotton-like fashion.

The first heat pipe group 27 partially has a parallel portion 27A in which the first heat pipes 27a to 27c are arranged in parallel. The parallel portion 27A is provided at a position overlapping at least the GPU 25 in the vertical direction. The parallel portion 27A is wider than the GPU 25 in the overall width of the parallel arrangement of the three first heat pipes 27a to 27c. That is, the parallel portion 27A protrudes outside the GPU 25 in plan view.

The first heat pipe group 27 may have at least one first heat pipe (for example, the central first heat pipe 27 b ) overlapping the GPU 25 . For example, in the configuration example shown in FIG. 4 , the two central first heat pipes 27 b and 27 c overlap the GPU 25 , and the first heat pipes 27 a and 27 d at both ends do not overlap the GPU 25 . In addition, in the configuration example shown in FIG.

Most of the first heat pipes 27a to 27c are joined to the lower surface of the vapor chamber 31 by soldering or the like. Among these, the two first heat pipes 27a and 27b are parallel to each other over the entire length and extend in a substantially L shape in plan view. The remaining first heat pipe 27c extends in a substantially J-shape in plan view.

The first heat pipes 27a and 27b have a heat receiving portion (evaporating portion) 27B in the vicinity of the front end portion. The first heat pipe 27c has a heat receiving portion 27B at its rear end and its peripheral portion. That is, in the first heat pipe group 27, the parallel portion 27A in which the first heat pipes 27a to 27c are arranged in parallel becomes the heat receiving portion 27B. The heat receiving portion 27B is laminated with the second heat pipe group 28 in the hole portion 31a of the vapor chamber 31 and joined to each other by soldering or the like.

The first heat pipes 27a and 27b have right end portions and peripheral portions thereof serving as heat radiating portions (condensing portions) 27C. The heat radiating portion 27C is joined to the lower surface of the cooling fin 32 by soldering or the like. The first heat pipe 27c has a front end portion and its peripheral portion serving as a heat radiation portion (condensation portion) 27D. The radiator 27D is joined to the lower surface of the metal plate 36 by soldering or the like. The front ends of the first heat pipes 27a and 27b are also joined to the lower surface of the metal plate 36 by soldering or the like.

As shown in FIGS. 2 and 3, the second heat pipe group 28 is a pipe-shaped heat transport device for evenly distributing the heat generated by the GPU 25 to the first heat pipes 27a-27c. The second heat pipe group 28 is formed by arranging three second heat pipes 28a to 28c in parallel. The number of second heat pipes constituting the second heat pipe group 28 may be one or more.

The second heat pipes 28a to 28c have the same basic configuration as the first heat pipes 27a to 27c described above, except that the lengths and paths are different. That is, the second heat pipes 28a to 28c are also formed by arranging a wick in a closed space inside the flattened metal pipe and enclosing the working fluid therein.

The second heat pipes 28a to 28c each extend linearly and are parallel to each other over their entire lengths. The second heat pipes 28a to 28c are oriented so that their extending direction (horizontal direction) is perpendicular to the extending direction of the parallel portion 27A of the first heat pipe group 27 (front-rear direction). In other words, the heat transport direction in the parallel portion 27A of the first heat pipes 27a-27c and the heat transport direction of the second heat pipes 28a-28c are orthogonal to each other. It should be noted that it is difficult to form a heat pipe completely straight, and it is also difficult to arrange a plurality of heat pipes completely in parallel. Therefore, in the present application, the term "both pipes are perpendicular to each other" does not have a strict meaning, but is a concept that includes not only cases where both pipes are perpendicular at 90 degrees, but also slight differences in angle and direction.

The second heat pipes 28 a - 28 c are stacked between the GPU 25 and the parallel portion 27 A of the first heat pipe group 27 . The upper surfaces (first surfaces 40a) of the second heat pipes 28a to 28c are connected to the GPU 25 via the heat receiving plate 41 (see FIG. 2). The first surfaces 40a of all the second heat pipes 28a to 28c that constitute the second heat pipe group 28 are all in contact with the heat receiving plate 41, so that the second heat pipes 28a to 28c are separated from the GPU 25 respectively. heat can be efficiently received. The heat receiving plate 41 is a plate made of metal with high thermal conductivity such as copper or aluminum. The heat receiving plate 41 may be omitted, or may be replaced by a thermal interface material such as thermally conductive grease.

The second heat pipes 28 a to 28 c are positioned so that their longitudinal central portions overlap the GPU 25 . That is, the second heat pipes 28a to 28c have a heat receiving portion (evaporating portion) 28A at the substantially central portion in the longitudinal direction connected to the GPU 25, and a heat radiating portion (condensing portion) 28B at both end portions other than the central portion in the longitudinal direction. . Both ends of the second heat pipes 28a-28c protrude outside the first heat pipes 27a-27c.

The lower surfaces (second surfaces) 40b of the second heat pipes 28a to 28c are joined to the parallel portions 27A of the first heat pipes 27a to 27c and the upper surface of the vapor chamber 31 by soldering or the like. The second heat pipes 28a-28c and the first heat pipes 27a-27c may be connected with a thermal interface material such as thermally conductive grease. The second heat pipes 28a to 28c are arranged to straddle the hole 31a. Therefore, the central heat receiving portion 28A of the second heat pipes 28a to 28c is connected to the parallel portion 27A of the first heat pipe group 27 within the hole portion 31a.

The second heat pipes 28a to 28c are connected to the vapor chamber 31 by soldering or the like at the heat radiating portions 28B on both sides across the hole portion 31a.

As shown in FIGS. 2 and 3, the third heat pipe group 29 is a pipe-shaped heat transport device mainly for transporting heat from the CPU 24 to the cooling fins 32 and 33 . The third heat pipe group 29 is formed by arranging two third heat pipes 29a and 29b in parallel. The number of third heat pipes constituting the third heat pipe group 29 may be one or more.

The third heat pipes 29a and 29b have the same basic configuration as the heat pipes 27a to 27c and 28a to 28c described above, except that the length and path are different. That is, the third heat pipes 29a and 29b are also formed by arranging a wick in a closed space inside the flattened metal pipe and enclosing the working fluid therein.

The third heat pipe 29a has a central portion that curves forward, and extends in the left-right direction as a whole. The third heat pipe 29b is curved in a substantially M shape. The third heat pipes 29a and 29b are joined to the lower surface of the vapor chamber 30 by soldering or the like at positions where the substantially central portions serving as heat receiving portions are parallel to each other and overlapped with the CPU 24 . The third heat pipe 29a has a left end (radiating portion) joined to the lower half surface of the cooling fin 32 by padding or the like, and a right end (heat receiving portion) joined to the lower surface of the cooling fin 33 by padding or the like. The third heat pipe 29b has a left end (heat radiation part) joined to the lower surface of the cooling fin 32 by padding or the like, and a front end (heat radiation part) located on the side of the first heat pipe 27a and extending between the vapor chamber 31 and the metal plate 36 . It is joined to the lower surface of the by soldering or the like.

In the cooling module 22 configured as described above, the heat generated by the CPU 24 is absorbed and diffused in the vapor chamber 30, and is efficiently transported to the cooling fins 32 and 33 via the third heat pipes 29a and 29b. After that, it is discharged to the outside of the housing 14 by blowing air from the blowing fans 34 and 35 . The third heat pipe 29b also radiates heat to the vapor chamber 31 and the metal plate 36 from its front end.

On the other hand, the heat generated by the GPU 25 is transmitted to the second heat pipe group 28 connected directly below it via the heat receiving plate 41, and then transported by the heat pipes 28a to 28c while being transferred to the first heat pipe group 27. is transmitted to As a result, the heat of the GPU 25 is efficiently transported to the cooling fins 33 via the first heat pipes 27a and 27b, and then discharged to the outside of the housing 14 by the blowing fan 35 blowing air. Further, the heat transferred to the first heat pipe 27c is radiated to the vapor chamber 31 and the metal plate 36 as well.

Here, with reference to FIGS. 4 and 5, the heat transport operation of the heat pipe groups 27 and 28 arranged so that their heat transport directions are perpendicular to each other, and the effects thereof will be described more specifically.

FIG. 4 is an explanatory diagram schematically showing the heat transport operation by the first heat pipe group 27 and the second heat pipe group 28. As shown in FIG. FIG. 4 illustrates a configuration in which four first heat pipes 27a to 27d are arranged in parallel as the first heat pipe group 27, and three second heat pipes 28a to 28d are arranged in parallel as the second heat pipe group 28. there is The arrows indicated by the dashed-dotted lines in FIG. 4 schematically show the flow of heat.

As shown in FIG. 4, in the cooling module 22 according to the present embodiment, the heat generated by the GPU 25 is first efficiently absorbed by the second heat pipes 28a to 28c through the heat receiving plate 41. As shown in FIG. The second heat pipes 28a-28c are arranged perpendicular to the first heat pipes 27a-27d stacked thereunder. Therefore, the second heat pipes 28a to 28c efficiently transport the heat received from the GPU 25 along the alignment direction (horizontal direction) of the first heat pipes 27a to 27d. At this time, the heat transported by the second heat pipes 28a to 28c is appropriately absorbed by the first heat pipes 27a to 27d laminated on the lower surfaces thereof. The first heat pipes 27a-27d efficiently transport the heat received from the second heat pipes 28a-28c to the cooling fins 33 and the like.

As described above, in the cooling module 22 of this embodiment, as shown in FIGS. 3 and 4, the first heat pipe group 27 is composed of a plurality of first heat pipes 27a to 27c (27d). This is because the first heat pipe group 27 is required to secure a sufficient amount of heat transport as a whole and to rapidly transport heat to various directions such as the cooling fins 33 and the metal plate 36 . Therefore, the first heat pipes 27a to 27c (27d) in which a plurality of heat pipes are arranged protrude from the GPU 25 in a plan view. This portion cannot receive the heat of the GPU 25 directly, and receives heat only at the contact portion with the adjacent heat pipe, resulting in low thermal efficiency.

Therefore, the cooling module 22 is provided with the second heat pipes 28a to 28c, so that the heat from the GPU 25 can be efficiently and evenly transferred to each of the first heat pipes 27a to 27c (27d). As a result, even when the cooling module 22 uses a plurality of the first heat pipes 27a to 27c (27d), each of the first heat pipes 27a to 27c (27d) can receive the heat from the GPU 25 substantially evenly. As a whole, a high heat transfer amount can be obtained, and a high cooling efficiency can be obtained.

FIG. 5 is a graph showing experimental results (simulation results) of the cooling capacity of the cooling module 22 with the second heat pipe group 28 and the cooling module without the second heat pipe group 28 . A graph (1) indicated by a solid line in FIG. 5 shows temporal changes in the temperature of the GPU 25 in the cooling module 22 of this embodiment. A graph (2) indicated by a dashed line in FIG. 5 shows temporal changes in the temperature of the GPU 25 in the configuration according to the comparative example in which the second heat pipe group 28 is removed from the cooling module 22 . In FIG. 5 , the horizontal axis is the elapsed time (minutes), and the vertical axis is the temperature of the GPU 25 (° C.).

As shown in graph (1), the cooling module 22 of the present embodiment suppresses the temperature rise rate of the GPU 25 over time, compared to the comparative example shown in graph (2) in FIG. I have found that I can keep up. This indicates that the heat distribution effect of the second heat pipe group 28 to the first heat pipe group 27 is extremely effective for cooling the GPU 25 .

That is, the cooling module 22 can quickly absorb the heat of the GPU 25 through the second heat pipes 28a to 28c and transport it to the cooling fins 33 through the first heat pipes 27a and 27b. Therefore, compared to a conventional configuration that does not have the second heat pipe group 28, the cooling module 22 of the present embodiment has less time lag when the GPU 25 absorbs heat, can suppress the speed of the temperature rise of the GPU 25, and can reduce the turbo operation time. can be extended. As a result, the cooling module 22 can maximize the performance of the GPU 25 .

In the cooling module 22 of the present embodiment according to graph (1), the temperature of the CPU 24 was 60.1 in steady operation under the experimental conditions of an environmental temperature of 25° C., a generated noise of 48 dB, a CPU output of 55 W, and a GPU output of 45 W. °C, and the temperature of the GPU 25 was 59.4 °C. On the other hand, under the same conditions, in the comparative example according to graph (2), the temperature of the CPU 24 was 59.6°C, while the temperature of the GPU 25 was 65.6°C. That is, during the steady operation, the cooling module 22 of the present embodiment was able to lower the temperature of the GPU 25, which tends to be higher than the CPU 24, by 6.2° C. compared to the configuration of the comparative example. It can be assumed that the fact that the temperature of the CPU 24 of the cooling module 22 of the present embodiment is slightly higher than that of the comparative example is within the range of experimental error.

A configuration similar to that of the second heat pipe group 28 serving as a sub heat transport means for distributing heat to the first heat pipe group 27 serving as the main heat transport means may be applied to the third heat pipe group 29. . In this case, one or a plurality of heat pipes similar to the second heat pipe group 28 may be arranged at a position overlapping the CPU 24 so as to be perpendicular to the third heat pipes 29a and 29b. Of course, the first heat pipe group 27 and the second heat pipe group 28 may be used for cooling the CPU 24 . Note that the third heat pipe group 29 is not essential. Also, the heat transfer destination of the first heat pipe group 27 may be a low-temperature region in the housing 14 other than the cooling fins. That is, the cooling fins 32 and 33, the blower fans 34 and 35, the vapor chambers 30 and 31, and the metal plate 36 are also omitted as appropriate depending on the configuration of the cooling module 22 and the inside of the housing .

By the way, conventionally, like the third heat pipe group 29, a configuration has been proposed in which the heat of the GPU 25 and the CPU 24 is spread by the vapor chamber and transported to the cooling fins by the heat pipes. However, vapor chambers are more expensive than heat pipes. In this regard, since the present embodiment has a configuration in which the heat is spread by the second heat pipe group 28, the cost can be suppressed. Furthermore, the vapor chamber has the characteristic of spreading heat concentrically from the heat source, whereas the heat pipe performs heat transport with directivity in a straight line. For this reason, the cooling module 22 can quickly spread the heat of the GPU 25 by the second heat pipes 28a to 28c in the parallel direction of the first heat pipes 27a to 27c (27d), which is more efficient than a configuration using a vapor chamber. High thermal efficiency.

In addition, for example, a configuration is conceivable in which the second heat pipe group 28 is omitted, the first heat pipe is configured as a single piece, and the pipe diameter is increased to increase the heat transport amount. However, in this case, the diameter of the raw pipe of the first heat pipe is increased, so that the width of the first heat pipe when flattened is increased. As a result, it becomes necessary to increase the depth (front-rear dimension) of the cooling fins 33, and there is a concern that the installation space for the mother board 26 and the battery device will be squeezed. In this regard, since the cooling module 22 can obtain high cooling performance without widening the first heat pipe, there is also an advantage that the influence on the system dimensions and system layout can be minimized.

By the way, both ends of a heat pipe are usually crushed for sealing, forming a dead space that hardly contributes to heat transfer or heat transport. Therefore, in the cooling module 22 of this embodiment, as shown in FIGS. 2 to 4, both ends of the second heat pipes 28a to 28c protrude outside the first heat pipes 27a to 27c (27d). As a result, the heat transfer efficiency between the second heat pipes 28a-28c and the first heat pipes 27a-27c (27d) is further improved. Portions of the second heat pipes 28a to 28c protruding from the first heat pipes 27a to 27c (27d) are connected to the vapor chamber 31. As shown in FIG. Therefore, the second heat pipes 28a to 28c can radiate to the vapor chamber 31 excess heat that has not been heat-exchanged with the first heat pipes 27a to 27c.

FIG. 6 is a schematic plan view showing a cooling module 50 according to a modification. In FIG. 6, the same reference numerals as those shown in FIGS. 1 to 4 denote the same or similar configurations, and thus the same or similar functions and effects are achieved, and detailed description thereof will be omitted.

As shown in FIG. 6, the cooling module 50 includes two symmetrical sets of first heat pipe groups 27 each including four first heat pipes 27a to 27d. In the cooling module 50, the second heat pipes 28a to 28c forming the second heat pipe group 28 are stacked so as to straddle the parallel portions 27A, 27A of the left and right first heat pipe groups 27. As shown in FIG. Again, the second heat pipe group 28 is stacked between the CPU 24 or GPU 25 and the first heat pipe groups 27,27. The CPU 24 and GPU 25 may be arranged side by side.

In the cooling module 50, the number of the first heat pipe groups 27 is large, so the first heat pipes 27b to 27d are far away from the CPU 24 or GPU 25 in particular. However, even in such a cooling module 50, due to the heat distribution effect of the second heat pipe group 28, it is possible to effectively use all of the first heat pipes 27a to 27d to transport heat.

In FIG. 6, the leftmost first heat pipe 27d extends to the side of the blower fan 35 and is joined to the cooling fin 52 facing the second exhaust port 35e provided on the side of the blower fan 35. Configurations are also illustrated. That is, in the cooling module 22 shown in FIGS. 2 and 3 as well, the second exhaust ports and cooling fins are provided on the sides of the blower fans 34 and 35, and for example, the first heat pipe 27c not connected to the cooling fins 33 is connected here. You may

It goes without saying that the present invention is not limited to the above-described embodiments, and can be freely modified without departing from the gist of the present invention.

REFERENCE SIGNS LIST 10 electronic device 14 housing 22, 50 cooling module 24 CPU
25 GPUs
27 First heat pipe group 27a-27d First heat pipe 28 Second heat pipe group 28a-28c Second heat pipe 32, 33, 52 Cooling fins 34, 35 Blower fan

Claims (8)

an electronic device,
a housing;
a heating element provided in the housing;
a cooling module provided in the housing for absorbing heat generated by the heating element;
with
The cooling module is
a first heat pipe in which a plurality of first heat pipes are arranged in parallel and configured to be wider than the heat generating element as a whole arranged in parallel, and at least one of the first heat pipes is arranged so as to overlap with the heat generating element;
It is laminated between the first heat pipe and the heat generating element in a posture orthogonal to the first heat pipe, and has a first surface connected to the heat generating element and a second surface connected to the first heat pipe. a second heat pipe with
An electronic device comprising: The electronic device according to claim 1,
The cooling module is
blower fan and
cooling fins arranged facing the exhaust port of the blower fan;
further having
The electronic device, wherein the first heat pipe is connected to the cooling fin. The electronic device according to claim 2,
The electronic device, wherein the second heat pipe is not connected to the cooling fin. The electronic device according to any one of claims 1 to 3,
A plurality of the second heat pipes are arranged in parallel,
The electronic device, wherein the first surface of each second heat pipe is connected to the heating element. The electronic device according to any one of claims 1 to 4,
The cooling module further has a plate-shaped member for heat diffusion,
The electronic device, wherein both ends of the second heat pipe are connected to the plate-shaped member in a state of protruding outside the first heat pipe. a cooling module,
a first heat pipe in which a plurality of heat pipes are arranged in parallel;
a second heat pipe stacked in a posture orthogonal to the first heat pipe;
blower fan and
a cooling fin facing the exhaust port of the blower fan and connected to the first heat pipe;
A cooling module comprising: A cooling module according to claim 6, comprising:
The cooling module, wherein the second heat pipe is not connected to the cooling fins. A cooling module according to claim 6 or 7,
further comprising a plate-shaped member for heat diffusion,
The cooling module, wherein both ends of the second heat pipe protrude outside the first heat pipe and are connected to the plate-shaped member.

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