JP2023030550A - Vacuum apparatus and manufacturing apparatus for electronic device - Google Patents

Abstract

To provide a vacuum apparatus that comprises a plurality of chambers configured to be reduced in pressure inside, and that reduces trouble in assembling by enabling the plurality of chambers to be transported integrally in a small space.SOLUTION: A vacuum apparatus comprises a first chamber 21, a second chamber 22 connected to the first chamber 21, and a support unit 25 supporting the first chamber 21 and second chamber 22. The support unit 25 comprises: a first pedestal 251 which has a first fixation surface 251a where a bottom surface of the first chamber 21 is fixed; a second pedestal 252 which has a second fixation surface 252a where a bottom surface of the second chamber 22 is fixed; and a connection part 253 which connects the first pedestal 251 and second pedestal 252. The support unit 25 bends by the connection part 253 to vary in an angle of a corner formed between a surface along the first fixation surface 251a and a surface along the second fixation surface 252a.SELECTED DRAWING: Figure 4

Description

The present invention relates to a vacuum apparatus and an electronic device manufacturing apparatus.

Among vacuum devices, there is known a device having a plurality of chambers whose interiors can be evacuated. For example, in a manufacturing apparatus for electronic devices such as an organic EL display device, a plurality of cluster devices and relay devices are generally arranged alternately. The cluster apparatus has chambers such as a transfer chamber and a film formation chamber, and performs film formation processing on substrates. The relay device has chambers such as a swirl chamber and a pass chamber, is arranged between the cluster devices, and carries out substrate transfer and the like. The chambers of these apparatuses are provided on independent racks, respectively, and are transported to a factory or the like in a state in which the respective chambers are separated. Therefore, when assembling the manufacturing apparatus, it is necessary to adjust the height and horizontal positions of the chambers in order to connect the chambers.

On the other hand, Patent Literature 1 discloses a configuration in which a single frame supports a plurality of chambers. Another chamber is connected to both ends of the chamber supported by the pedestal, and by supporting the plurality of chambers in a so-called cantilever state, one pedestal supports the plurality of chambers.

JP-A-10-247675

As described above, the configuration in which a single frame supports a plurality of chambers saves time and effort for position adjustment when assembling the device after transportation. However, if the device is large, the cantilever state may cause problems such as tilting of the chamber and breakage of the connecting portion, and restrictions due to size restrictions for transportation, so a similar configuration cannot be adopted.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a vacuum apparatus having a plurality of chambers whose interiors can be evacuated so that the plurality of chambers can be integrally transported in a small space, thereby reducing labor during assembly.

The vacuum device of the present invention is
a first chamber;
a second chamber connected to the first chamber;
a support unit that supports the first chamber and the second chamber;
A vacuum apparatus comprising
The support unit includes a first pedestal having a first fixing surface to which the bottom surface of the first chamber is fixed, a second pedestal having a second fixing surface to which the bottom surface of the second chamber is fixed, and the first a connecting portion that connects the pedestal and the second pedestal,
The support unit is bent by the connecting portion such that an angle between a surface along the first fixing surface and a surface along the second fixing surface changes.

Advantageous Effects of Invention According to the present invention, in a vacuum apparatus having a plurality of chambers that can be internally evacuated, the plurality of chambers can be integrally transported in a small space, thereby reducing labor during assembly.

It is a schematic diagram which shows a part of manufacturing apparatus of an electronic device. FIG. 3 is a schematic diagram of the relay device in an installed state; FIG. 4 is a schematic perspective view of the relay device in an installed state; FIG. 4 is a schematic diagram of the relay device in a transport state; FIG. 4 is a schematic perspective view of the relay device in a transportation state; FIG. 4 is a schematic diagram of the joint in the transport state; FIG. 4 is a schematic front view of the connecting portion in an installed state; It is a schematic bottom view of the connection part in an installed state. FIG. 4 is a schematic perspective view of a connecting portion; It is a schematic diagram which shows the drive of a leg member. FIG. 11 is a schematic front view of a connecting portion in a transport state according to a modified example; 1 is an explanatory diagram of an organic EL display device according to an embodiment of the present invention; FIG.

BEST MODE FOR CARRYING OUT THE INVENTION A mode for carrying out the present invention will be exemplarily described in detail below based on an embodiment with reference to the drawings. However, the dimensions, materials, shapes and relative arrangement of the components described in this embodiment should be appropriately changed according to the configuration of the device to which the invention is applied and various conditions. That is, it is not intended to limit the scope of the present invention to the following embodiments.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum apparatus having a plurality of chambers whose interiors can be evacuated. INDUSTRIAL APPLICABILITY The present invention can be applied, for example, to an apparatus for forming a film by depositing various materials on the surface of a substrate, and can be preferably applied to an apparatus for forming a thin film (material film) with a desired pattern by vacuum deposition. can. As the material of the substrate, any material such as glass, polymer material film, silicon wafer, metal, etc. can be selected, and the substrate may be, for example, a glass substrate on which a film such as polyimide is deposited. . Also, any material such as an organic material or a metallic material (metal, metal oxide, etc.) may be selected as the vapor deposition material. It should be noted that the present invention can also be applied to a film forming apparatus including a sputtering apparatus and a CVD (Chemical Vapor Deposition) apparatus in addition to the vacuum deposition apparatus described below. The technology of the present invention is specifically applicable to manufacturing apparatuses for organic electronic devices (eg, organic light-emitting elements, thin-film solar cells), optical members, and the like. Among them, an apparatus for manufacturing an organic light-emitting device that forms an organic light-emitting device by evaporating a deposition material and depositing it on a substrate through a mask is one of the preferred application examples of the present invention. A case where the present invention is applied to an electronic device manufacturing apparatus will be described below as an example, but the vacuum apparatus of the present invention is not limited to this, and can be applied to various vacuum apparatuses having a plurality of chambers.

<Electronic Device Manufacturing Equipment>
FIG. 1 is a plan view schematically showing a configuration of part of an electronic device manufacturing apparatus. The manufacturing apparatus of FIG. 1 is used, for example, to manufacture a display panel for an organic EL display device for smartphones or an organic EL display device for VRHMD. In the case of display panels for smartphones, for example, a 4.5th generation substrate (about 700 mm x about 900 mm) or a 6th generation full size (about 1500 mm x about 1850 mm) or half cut size (about 1500 mm x about 925 mm) substrate is used. Used. After forming a film for forming an organic EL element on the substrate, the substrate is cut out to manufacture a plurality of small-sized panels. In the case of a display panel for VRHMD, for example, a silicon wafer with a predetermined size (eg, 300 mm) is used. After forming a film for forming an organic EL element on the silicon wafer, the silicon wafer is cut along regions (scribe regions) between the device forming regions to fabricate a plurality of small-sized panels.

An electronic device manufacturing apparatus generally includes a plurality of cluster devices 1 and a relay device 2 that connects the cluster devices. The cluster device 1 includes a plurality of film forming devices 11 that perform processing (for example, film formation) on substrates, a plurality of mask stock devices 12 that store masks before and after use, a transfer chamber 13 arranged in the center, Equipped with The transfer chamber 13 is connected to each of a plurality of film forming apparatuses 11 and mask stock apparatuses 12, as shown in FIG.

A transfer robot 14 for transferring substrates and masks is arranged in the transfer chamber 13 . The transport robot 14 transports the substrate from the pass chamber 22 of the relay device 2 arranged on the upstream side to the film forming device 11 . Further, the transport robot 14 transports the mask between the film forming device 11 and the mask stock device 12 . The transport robot 14 is, for example, a robot having a structure in which a robot hand holding a substrate or a mask is attached to an articulated arm.

In the film forming apparatus 11 (also referred to as a film forming chamber or vapor deposition apparatus), a vapor deposition material stored in an evaporation source is heated by a heater to evaporate, and is vapor deposited onto a substrate through a mask. A series of film formation processes such as transfer of the substrate to and from the transport robot 14, adjustment of the relative positions of the substrate and the mask (alignment), fixing of the substrate onto the mask, and film formation (vapor deposition) are performed by the film formation apparatus 11. .

In the mask stock device 12, new masks to be used in the film forming process in the film forming device 11 and used masks are stored separately in two cassettes. The transport robot 14 transports the used mask from the film forming apparatus 11 to the cassette of the mask stocking apparatus 12 , and transports the new mask stored in another cassette of the mask stocking apparatus 12 to the film forming apparatus 11 .

The cluster apparatus 1 includes a pass chamber 22 for supplying substrates from the upstream side in the flow direction of the substrates to the cluster apparatus 1, and supplying substrates on which film formation processing has been completed in the cluster apparatus 1 to other downstream cluster apparatuses. A pass chamber 22 is connected. The transfer robot 14 in the transfer chamber 13 receives the substrate from the pass chamber 22 on the upstream side and transfers it to one of the film forming apparatuses 11 in the cluster apparatus 1 . Further, the transport robot 14 receives a substrate on which film formation processing in the cluster device 1 has been completed from one of the plurality of film formation devices 11, and transports it to the pass chamber 22 of the relay device 2 connected downstream. .

The relay device 2 includes a swirl chamber 21 for changing the orientation of the substrate, and pass chambers 22 installed on the upstream and downstream sides of the swirl chamber 21, respectively. Transfer to device 1 . The swirling chamber 21 is provided with a transfer robot 24 for receiving a substrate from the pass chamber 22 on the upstream side, rotating the substrate by 180°, and transferring the substrate to the pass chamber 22 on the downstream side. As a result, the orientation of the substrates carried in by the cluster device 1 on the upstream side and the cluster device 1 on the downstream side become the same, which facilitates substrate processing.

The pass chamber 22 in this embodiment includes a stage for mounting a substrate. A pass chamber 22 installed on the upstream side of the swirl chamber 21 in the relay device 2 has a fixed stage that does not move or rotate. On the other hand, the pass chamber 22 installed on the downstream side of the turning chamber 21 has an alignment mechanism. Movement in a direction and driving to rotate about a third direction perpendicular to the first direction and the second direction are possible. By aligning the substrate in advance with the relay device 2 before the substrate is transferred into the transfer chamber 13 of the cluster device 1, the alignment process can be made more efficient.

A buffer chamber 23 may be provided on the downstream side of the cluster device 1 instead of the pass chamber 22 . The relay device 2 installed upstream and/or downstream of the cluster device 1 includes a swirl chamber 21 and at least one of a pass chamber 22 and a buffer chamber 23 .

The cluster device 1 and the relay device 2 are vacuum devices configured such that the interiors of a plurality of chambers constituting each of them can be decompressed. The film forming device 11, the mask stock device 12, the transfer chamber 13, the buffer chamber 23, the swirl chamber 21, and the like are maintained in a high vacuum state during the manufacturing process of the organic light emitting device. Pass chamber 22 is normally maintained in a low vacuum state, but may be maintained in a high vacuum state if desired.

In this embodiment, the configuration of the electronic device manufacturing apparatus has been described with reference to FIG. or the arrangement of the chambers may be changed. For example, the electronic device manufacturing apparatus according to the embodiment of the present invention may be of an in-line type instead of the cluster type shown in FIG. In other words, the substrate and the mask may be mounted on a carrier, and film formation may be performed while being transported in a plurality of film formation apparatuses arranged in a row. Also, it may have a structure of a combination of a cluster type and an in-line type. For example, a cluster-type manufacturing apparatus may be used to form a substrate-containing layer, and an in-line type manufacturing apparatus may be used to perform the electrode layer (cathode layer) film-forming process, the sealing process, the cutting process, and the like.

<Relay device>
A relay apparatus 2 according to an embodiment of the present invention will be described with reference to FIGS. 2 to 5. FIG. In this embodiment, the longitudinal direction in which the substrate is transported from the upstream chamber to the downstream chamber in the substrate transport direction is the X direction, the width direction perpendicular to the longitudinal direction is the Y direction, and the longitudinal direction and the width direction are perpendicular. The height direction is the Z direction. The longitudinal direction (X direction) is also the moving direction in which the substrate moves between the chambers.

The relay device 2 of this embodiment has a characteristic configuration in which it can be switched between two states: an installation state for transporting substrates between cluster devices, and a transportation state for transporting the device to a factory or the like. FIG. 2A is a schematic plan view showing the configuration of the relay device 2 in an installed state in which the swirl chamber 21 and the pass chamber 22 are connected and substrates can be transported between the swirl chamber 21 and the pass chamber 22. FIG. , and FIG. 2(b) is a schematic front view thereof. FIG. 3 is a schematic perspective view showing the relay device 2 in an installed state. In the relay device 2 of the present embodiment, pass chambers 22 (second chamber, third chamber) are provided adjacently on upstream and downstream sides of a swirl chamber 21 (first chamber). A supporting unit 25 is provided for supporting. Further, the relay device 2 has a gate valve 26 between the swirling chamber 21 and the pass chamber 22 , and the gate valve 26 and the pass chamber 22 are connected via an adapter plate 27 .

The support unit 25 includes a pedestal 251 (first pedestal) that supports the swirl chamber 21, a movable pedestal 252 (second pedestal, third pedestal) that supports the pass chamber 22, and a connection that connects the pedestal 251 and the movable pedestal 252. a portion 253; The bottom surface of the swirl chamber 21 is fixed to the fixed surface 251 a (first fixed surface) of the pedestal 251 . Similarly, the bottom surface of the pass chamber 22 is fixed to a fixed surface 252a (second fixed surface, third fixed surface) of the movable base 252. As shown in FIG. Further, the support unit 25 includes a support structure 254 that supports the pedestal 251 from below, leg members 255 that support the movable pedestal 252 from below, and shaft clamp members as leg connecting members that connect the leg members 255 and the movable pedestal 252. 256;

The swirl chamber 21 of this embodiment has a hexagonal shape when viewed from above, and the support structure 254 supporting the swirl chamber 21 from below via the pedestal 251 is a plurality of struts including struts supporting each vertex of the hexagon. Configured. In addition, the strut structure 254 includes a level adjuster 2541 that allows height adjustment during assembly of the device.

The pass chamber 22 of this embodiment has a rectangular shape when viewed from above, and is fixed to a movable base 252 . In the installed relay device 2, the fixed surface 251a of the pedestal 251 to which the swirl chamber 21 is fixed and the fixed surface 252a of the movable pedestal 252 to which the pass chamber 22 is fixed are provided so as to be parallel. The movable pedestal 252 is supported by leg members 255 via axial clamp members 256 . Further, the movable pedestal 252 is connected to the pedestal 251 via a connecting portion 253 composed of a plurality of members. That is, in the installed state, the movable pedestal 252 is supported by the leg member 255 and the connecting portion 253 . In addition, the leg member 255 is provided with a level adjuster 2551 so that the position in the height direction can be adjusted similarly to the support structure 254 .

Further, the movable pedestal 252 of this embodiment is rotatably supported by the connecting portion 253 with the width direction (Y direction) as the rotation axis. When the connection between the pass chamber 22 and the turning chamber 21 is released and the movable base 252 is rotated, the pass chamber 22 rotates together with the movable base 252 . The leg member 255 is also rotatably supported by the shaft clamp member 256 with the width direction as the rotation axis. By rotating the movable pedestal 252 and the leg member 255, the relay device 2 in the installation state can be switched to the transport state described later. The details of the configuration that enables the movable pedestal 252 and the leg member 255 to rotate will be described later.

FIG. 4(a) is a schematic plan view showing the configuration of the relay device 2 in a transportation state, and FIG. 4(b) is a schematic front view thereof. FIG. 5 is a schematic perspective view showing the relay device 2 in a transportation state. In the relay device 2 in the transportation state, the support unit 25 is bent so that the fixed surface 251a of the pedestal 251 and the fixed surface 252a of the movable pedestal 252 form an approximately right angle. Further, leg member 255 is folded with respect to movable base 252 so as to extend in a direction parallel to fixed surface 252 a of movable base 252 . In the relay device 2 of this embodiment, the distance M1 from the rotating shaft portion 252b, which is the center of rotation of the movable base 252, to the lower end portion of the support structure 254 is It is configured to be greater than the distance M2 to the far end. With such a configuration, when the movable base 252 rotates with respect to the base 251, the support unit 25 is bent at a substantially right angle without the movable base 252 interfering with the ground. size can be reduced.

Furthermore, in order to prevent the leg member 255 from interfering with the support structure 254 and the like, the leg member 255 is rotatably supported by a shaft clamp member 256 connected to the movable base 252 and can be folded with respect to the movable base 252. be. In other words, the movable pedestal 252 is supported only by the connecting portion 253 in the transportation state. If the movable pedestal 252 including the pass chamber 22 is too heavy to be supported by the connection part 253 alone, the movable pedestal 252 and the support structure 254 are connected by separate members so that they can be supported more firmly during transportation. A configuration is also conceivable as a modified example.

As described above, the support unit 25 is configured to be bendable so that the angle of the fixing surface 252a with respect to the fixing surface 251a can be changed. The total length L2 of the relay device 2 in the longitudinal direction can be reduced. By deforming the device so that the total length, which is the maximum side of the device, becomes smaller, it is possible to obtain great advantages during transportation, such as reducing the transportation space and avoiding conflicts with size restrictions during transportation. That is, since the relay device 2 of the present invention can integrally transport a plurality of chambers, it is possible to easily perform position adjustment and the like when installing the device. Furthermore, compared to the case where each chamber and frame are simply connected, the device can be transported in a smaller size, which contributes to space saving and avoids conflicts with size restrictions during transportation.

The gate valve 26 has a disk 261 (valve body) and a body 262 (valve barrel), and by movement of the disk 261, opens and closes a passage through which the substrate passes from the inside of the swirl chamber 21 to the inside of the pass chamber 22. . On the surface of the gate valve 26 opposite to the surface connected to the swirl chamber 21,
An adapter plate 27 is provided for connecting with the pass chamber 22 . The adapter plate 27 and the pass chamber 22 are connected by screw parts (not shown), and by removing the cover provided on the upper surface of the pass chamber 22, fastening work by the screw parts is possible. The adapter plate 27 also has seal grooves 27 a in which seal rings 28 are provided on both the connection surface with the gate valve 26 and the connection surface with the pass chamber 22 . By connecting the gate valve 26 and the pass chamber 22 via the adapter plate 27 provided with the seal groove 27a, air leakage from the connecting portion between the gate valve 26 and the pass chamber 22 is prevented. The disc 261 is lifted so as to block the passage of the substrate, the gate valve 26 is closed, and each chamber is sealed and then evacuated by a pump to bring each chamber into a low-vacuum state or a high-vacuum state. can keep.

Each chamber of the relay device 2 in the transportation state may be sealed so that moisture or the like does not enter the chamber during sea transportation. Therefore, in the transport state, the swirl chamber 21 is sealed by closing the gate valves 26 provided at both ends of the swirl chamber 21 . Further, the pass chamber 22 is sealed by attaching blanks 41 to both ends. A SUS metal plate or the like having a thickness of about 5 to 20 mm is used as the blank material 41 . After sealing, the insides of the swirling chamber 21 and the pass chamber 22 are decompressed to be transported in a vacuum state.

<Connecting portion 253>
The connecting portion 253 that connects the pedestal 251 and the movable pedestal 252 will be described with reference to FIGS. 6 to 9. FIG. The movable pedestal 252 (second pedestal) connected to the pass chamber 22 provided on the downstream side of the swirl chamber 21 and the connecting portion 253 will be described below with reference to the drawings. Note that the movable pedestal 252 (third pedestal) and connecting portion 253 (third pedestal connecting portion) connected to the pass chamber 22 provided on the upstream side with respect to the swirling chamber 21 have the same configurations as those on the downstream side. Description is omitted.

FIG. 6(a) is a schematic plan view showing the configuration of the connecting portion 253 in the transportation state, and FIG. 6(b) is a schematic front view thereof. The connecting portion 253 of this embodiment includes a pedestal connecting member 2531 connected to the pedestal 251, an intermediate member 2532 engaged with the pin component 38 connected to the lower surface of the pass chamber 22, and a rotating shaft portion 252b of the movable pedestal 252. The shaft clamp member 2533 is composed of three types of members. The pedestal connection member 2531 is a member that is connected to the pedestal 251 by screws 35 and extends in the longitudinal direction (X direction) so as to pass by the side of the space in which the disc 261 of the gate valve 26 moves. , respectively. The intermediate member 2532 is a member elongated in the width direction (Y direction) of the relay device 2, and is connected to the pedestal connection member 2531 by screws 33 and 34 at both ends in the width direction. That is, the connecting portion 253 is provided so that the base 251, the base connecting member 2531 and the intermediate member 2532 surround the body 262 of the gate valve 26 and the space in which the disk 261 moves. Further, the intermediate member 2532 is provided with a pin hole 2532a with which the pin component 38 connected to the pass chamber 22 is engaged. A pair of axial clamp members 2533 are connected to both ends of the intermediate member 2532 in the width direction by screws 32 . Further, the shaft clamping member 2533 supports the movable pedestal 252 by engaging with the rotary shaft portion 252b of the movable pedestal 252 through the rotary shaft support hole 2533a.

FIG. 7(a) is a schematic front view showing the detailed configuration of the connecting portion 253 in an installed state, and FIG. 7(b) is a schematic front view with the screw parts and the like shown in FIG. 7(a) hidden. . The shaft clamping member 2533 has a rotating shaft support hole 2533a, a notch 2533b, a clamp screw hole 2533c, a through hole 2533d (non-screw hole), and an elongated through hole 2533e. The rotating shaft portion 252b of the movable base 252 is inserted through the rotating shaft support hole 2533a. The notch 2533b extends from the rotary shaft support hole 2533a to the end of the shaft clamp member 2533. As shown in FIG. The clamp screw hole 2533c and the through hole 2533d extend perpendicularly to the surface of the notch 2533b on the same central axis, and the clamp screw 31 is inserted therethrough. By attaching and tightening the clamp screw 31 to the clamp screw hole 2533c, the shaft clamp member 2533 is elastically deformed to clamp the rotary shaft portion 252b of the movable base 252 in the rotary shaft support hole 2533a. That is, by loosening the clamp screw 31, the movable base 252 can be rotated with respect to the base 251, and by tightening the clamp screw 31, the movable base 252 can be fixed at a predetermined rotational position with respect to the base 251.

The long through-holes 2533e are holes through which the screws 32 for connection with the intermediate member 2532 are inserted, and are provided in each shaft clamp member 2533 two by two. The elongated through hole 2533 e is elongated in the longitudinal direction (X direction) to adjust the longitudinal position of the pass chamber 22 with respect to the swirl chamber 21 when connecting the movable base 252 to the adapter plate 27 . By providing two long through-holes 2533e, the movable base 252 is firmly supported, and the shaft clamp member 2533 is prevented from rotating with respect to the intermediate member 2532 when the screw 32 is loosened, thereby facilitating installation work of the device. Workability is improved. The details of the work of connecting the movable base 252 to the adapter plate 27 and placing the relay device 2 in the installed state while adjusting the position of the movable base 252 will be described later.

The pedestal connection member 2531 and the intermediate member 2532 are connected by screws 33 attached to the side surface and screws 34 attached to the bottom surface. The base connecting member 2531 has a vertical wall portion 2531a, and the screw 33 is inserted through a through hole 2531b provided in the vertical wall portion 2531a. A screw 34 attached to the lower surface side of the base connecting member 2531 is inserted through a screw hole provided in the lower portion of the intermediate member 2532 . Also, the pin component 38 connected to the pass chamber 22 engages the pin hole 2532 a of the intermediate member 2532 .

FIG. 8(a) is a schematic bottom view showing the detailed configuration of the connecting portion 253, and FIG. 8(b) is a schematic bottom view with the screw parts and the like of FIG. 8(a) hidden. Further, FIG. 9 is a detailed diagram showing the detailed configuration of the connecting portion 253. As shown in FIG. The base connecting member 2531 is connected to the intermediate member 2532 by a screw 33 inserted through a through hole 2531b provided in the vertical wall portion 2531a on the side surface side and a screw 34 inserted through an elongated through hole 2531c provided on the lower surface side. be. The elongated through hole 2531c is elongated in the width direction (Y direction) in order to adjust the width direction position of the pass chamber 22 with respect to the swirl chamber 21 when connecting the movable base 252 to the adapter plate 27 . That is, the long through-hole 2533e of the shaft clamping member 2533 and the long through-hole 2531c of the base connecting member 2531 are long in directions perpendicular to each other. Between the vertical wall portion 2531a of the pedestal connection member 2531 and the end portion of the intermediate member 2532 facing the vertical wall portion 2531a, the intermediate member 2532 and the pass chamber 22 extend in the width direction with respect to the pedestal connection member 2531. A gap of about 5 to 20 mm is provided for moving to

Although the connecting portion 253 in this embodiment is composed of three types of members, the connecting portion 253 may be composed of a greater number of members. In addition, although the connection portion 253 is provided with a space in which the disk 261 of the gate valve 26 moves, the disk 261 moves to the connection portion 253 using the gate valve 26 in which the disk 261 moves upward. A modification in which no space is provided is also envisioned.

Also, the elongated holes provided in the connecting portion are not limited to the configuration described above.

<Leg member>
FIG. 10(a) is a schematic diagram showing a state in which the leg member 255 is folded with respect to the movable base 252, and FIG. 10(b) is a schematic diagram showing a state in which the leg member 255 supports the movable base 252. . A leg member 255 that supports the movable base 252 is connected to the movable base 252 via a shaft clamp member 256 when the relay device 2 is in the installed state. In order to prevent the leg member 255 from interfering with the ground and being unable to rotate when the movable base 252 rotates with respect to the base 251, the leg member 255 is also rotatably attached to the shaft clamp member 256 with respect to the movable base 252. Supported.

The shaft clamping member 256 has a rotating shaft support hole, a notch, a clamping screw hole, and a through hole (non-threaded hole), and is connected to the movable base 252 with screws 36 . The rotary shaft support hole engages with the rotary shaft portion 255 a of the leg member 255 . The notch extends from the shaft support hole to the end of shaft clamp member 256 . The clamp screw hole and the through hole extend perpendicularly to the notch plane on the same central axis, and the clamp screw is inserted therethrough. By attaching and tightening the clamp screw 37 to the clamp screw hole, the shaft clamp member 256 is elastically deformed to clamp the rotary shaft portion 255a of the leg member 255 in the rotary shaft support hole. That is, by loosening the clamp screw 37 , the leg member 255 can be rotated with respect to the movable base 252 , and by tightening the clamp screw 37 , the position of the leg member 255 is fixed with respect to the movable base 252 . With the configuration as described above, the leg member 255 is fixed to the movable base 252 in a folded state during transportation, and the leg member 255 does not interfere with the support structure 254 .

Although the relay device 2 of the present embodiment is configured such that the leg member 255 is connected to the movable base 252 even in the transportation state, it does not have a rotation function assuming that the leg member 255 is detached for transportation. It may be configured. Further, in order to prevent the leg members 255 from interfering with the support structure 254 when the relay device 2 is bent, the length of the leg members 255 may be made extendable. Furthermore, it is naturally possible to assume a configuration in which the number of leg members is increased to provide stronger support, or the like, as a modified example.

<Installation Work of Relay Device 2>
A method for assembling the relay device 2 brought into a factory or the like in a transported state into an installed state will be described. First, in order to connect the relay device 2 with the same pass line height as the cluster device 1, position adjustment in the height direction is performed by the level adjuster 2541 provided on the support structure 254 . Subsequently, the fastening of the shaft clamp member 2533 is loosened and the movable pedestal 252 is rotated so that the fixed surface 252a of the movable pedestal 252 is substantially parallel to the fixed surface 251a of the pedestal 251 . At this time, the fastening of the shaft clamp member 256 is also loosened, and the leg member 255 is rotated so that the movable base 252 and the pass chamber 22 can be supported. Then, the level adjuster 2551 of the leg member 255 is used to adjust the position of the movable base 252 so that the pass chamber 22 can be supported from below. Thus, the pass chamber 22 is supported by the connecting portion 253 and the leg member 255 via the movable base 252 .

Next, in order to connect the pass chamber 22 and the swirl chamber 21, the position of the pass chamber 22 with respect to the swirl chamber 21 is finely adjusted. Since the pass chamber 22 is connected to the adapter plate 27 by screw parts, it is necessary to adjust the positions in various directions so that the positions of the holes for screwing are aligned between the parts. The pass chamber 22 is fixed to the movable pedestal 252 by screw parts inserted from the bottom of the movable pedestal 252 . Fine adjustment is possible by inserting shim tape in between. Furthermore, the horizontal position of the pass chamber 22 with respect to the swirl chamber 21 can be finely adjusted by the long through hole 2533e that is long in the longitudinal direction (X direction) and the long through hole 2531c that is long in the width direction (Y direction). With the above configuration, it is possible to transport an apparatus including a plurality of chambers integrally in a small space, and after transportation, the position of the pass chamber 22 with respect to the swirl chamber 21 can be finely adjusted and easily connected. It is possible to assemble the device.

The configuration of the present invention is not limited to the configuration described above, and various modifications are possible. For example, the relay device 2 is provided with a buffer chamber 23 instead of the pass chamber 22, or the transfer chamber 13 of the cluster device 1 is provided with the pass chambers 22 instead of the swirl chamber 21 using the connecting portions 253 at both ends. configuration, etc. can be considered.

As another modified example, a configuration in which a screw or the like is used instead of the pin component 38 to connect the pass chamber 22 and the connection portion 253 is also conceivable. FIG. 11 is a schematic front view showing a detailed configuration of the connecting portion 253 in a modified installation state using the screws 39. As shown in FIG. In this modified example, the screws 39 are inserted through the through holes provided in the pedestal connection member 2531 and the intermediate member 2532 and then through the screw holes provided on the lower surface of the pass chamber 22 to connect with the pass chamber 22 . 253 is connected. With such a configuration, a fastening force acts in a direction in which the path chamber 22 and the connecting portion 253 approach each other, so that they can be connected more firmly than when the pin is simply engaged with the hole. In the transportation state, the screws 39 are attached to the lower surface of the pass chamber 22, and the pedestal connection member 2531 and the intermediate member 2532 are connected by separate members such as bolts and nuts, thereby making it possible to connect the screw holes and through holes. Prevents contamination by foreign matter. It is naturally assumed that the pass chamber 22 and the intermediate member 2532 and the intermediate member 2532 and the pedestal connection member 2531 are connected by separately providing screws and holes.

<Method for manufacturing electronic device>
Next, an example of a method for manufacturing an electronic device using the vacuum apparatus according to this embodiment will be described. Hereinafter, the configuration of an organic EL display device will be shown as an example of an electronic device, and a method for manufacturing the organic EL display device will be exemplified.

First, the organic EL display device to be manufactured will be described. FIG. 12(a) shows an overall view of the organic EL display device 50, and FIG. 12(b) shows a cross-sectional structure of one pixel.

As shown in FIG. 12A, in a display region 501 of an organic EL display device 50, a plurality of pixels 502 each having a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. It should be noted that the pixel here refers to a minimum unit capable of displaying a desired color in the display area 501 . In the case of the organic EL display device according to this embodiment, a pixel 502 is configured by a combination of a first light emitting element 502R, a second light emitting element 502G, and a third light emitting element 502B that emit light different from each other. The pixel 502 is often composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element. It is not limited.

FIG. 12(b) is a schematic partial cross-sectional view taken along line SS of FIG. 12(a). The pixel 502 is composed of a plurality of light-emitting elements, and each light-emitting element includes a first electrode (anode) 504, a hole-transporting layer 505, a light-emitting layer 506R, 506G, or 506B, and an electron-transporting layer on a substrate 503. It has a layer 507 and a second electrode (cathode) 508 . Among these layers, the hole transport layer 505, the light emitting layers 506R, 506G and 506B, and the electron transport layer 507 correspond to organic layers. In this embodiment, the light-emitting layer 506R is an organic EL layer that emits red, the light-emitting layer 506G is an organic EL layer that emits green, and the light-emitting layer 506B is an organic EL layer that emits blue. The light-emitting layers 506R, 506G, and 506B are formed in patterns corresponding to light-emitting elements (also referred to as organic EL elements) that emit red, green, and blue, respectively.

Also, the first electrode 504 is formed separately for each light emitting element. The hole transport layer 505, the electron transport layer 507, and the second electrode 508 may be formed in common for the plurality of light emitting elements 502R, 502G, and 502B, or may be formed for each light emitting element. An insulating layer 509 is provided between the first electrodes 504 to prevent short-circuiting between the first electrode 504 and the second electrode 508 due to foreign matter. Furthermore, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 510 is provided to protect the organic EL element from moisture and oxygen.

Although the hole transport layer 505 and the electron transport layer 507 are shown as one layer in FIG.
Depending on the structure of the organic EL display element, it may be formed of a plurality of layers including a hole blocking layer and an electron blocking layer. In addition, a positive electrode having an energy band structure capable of smoothly injecting holes from the first electrode 504 to the hole transport layer 505 is provided between the first electrode 504 and the hole transport layer 505 . A hole injection layer can also be formed. Similarly, an electron injection layer can also be formed between the second electrode 508 and the electron transport layer 507 .

Next, an example of a method for manufacturing an organic EL display device will be specifically described.

First, a substrate (mother glass) 503 on which a circuit (not shown) for driving an organic EL display device and a first electrode 504 are formed is prepared.

An acrylic resin is formed by spin coating on the substrate 503 on which the first electrode 504 is formed, and the acrylic resin is patterned by lithography so that an opening is formed in the portion where the first electrode 504 is formed. 509 is formed. This opening corresponds to a light emitting region where the light emitting element actually emits light.

A substrate 503 having an insulating layer 509 patterned thereon is placed on a substrate carrier on which an adhesive member is arranged. The substrate 503 is held by the adhesive member. It is carried into a first organic material deposition apparatus, and after reversal, a hole transport layer 505 is deposited as a common layer on the first electrodes 504 in the display area. The hole transport layer 505 is deposited by vacuum deposition. Since the hole transport layer 505 is actually formed to have a size larger than that of the display region 501, a high-definition mask is not required.

Next, the substrate 503 formed with up to the hole transport layer 505 is carried into a second organic material deposition apparatus. The substrate and the mask are aligned, the substrate is placed on the mask, and a light-emitting layer 506R emitting red is formed on the portion of the substrate 503 where the element emitting red is to be arranged.

In the same manner as the formation of the light-emitting layer 506R, a light-emitting layer 506G emitting green light is formed using the third organic material film-forming apparatus, and a light-emitting layer 506B emitting blue light is formed using the fourth organic material film-forming apparatus. . After the formation of the light-emitting layers 506R, 506G, and 506B is completed, the electron transport layer 507 is formed over the entire display area 501 by the fifth film forming apparatus. The electron transport layer 507 is formed as a layer common to the three color light-emitting layers 506R, 506G, and 506B.

The substrate formed up to the electron transport layer 507 is moved by a metallic vapor deposition material film forming apparatus to form the second electrode 508 .

After that, the substrate 503 is moved to a plasma CVD apparatus to form a protective layer 510, thus completing the film forming process on the substrate 503. FIG. After reversing, the substrate 503 is separated from the substrate carrier by peeling off the adhesive member from the substrate 503 as described in the above embodiments or examples. After that, the organic EL display device 50 is completed through cutting.

If the substrate 503 on which the insulating layer 509 is patterned is carried into the deposition apparatus and is exposed to an atmosphere containing moisture and oxygen until the deposition of the protective layer 510 is completed, the light-emitting layer made of the organic EL material is damaged. It may deteriorate due to moisture and oxygen. Therefore, in this embodiment, the substrate is carried in and out between the film forming apparatuses under a vacuum atmosphere or an inert gas atmosphere.

Turning chamber (first chamber) 21, pass chamber (second chamber) 22, support unit 25, pedestal (first pedestal) 251, fixed surface (first fixed surface) 251a, movable pedestal (second pedestal)...252, fixed surface (second fixed surface)...251b, connection part...253

Claims (15)

a first chamber;
a second chamber connected to the first chamber;
a support unit that supports the first chamber and the second chamber;
A vacuum apparatus comprising
The support unit includes a first pedestal having a first fixing surface to which the bottom surface of the first chamber is fixed, a second pedestal having a second fixing surface to which the bottom surface of the second chamber is fixed, and the first a connecting portion that connects the pedestal and the second pedestal,
The vacuum device, wherein the support unit is bent by the connecting portion such that an angle formed by a surface along the first fixing surface and a surface along the second fixing surface is changed. 3. The apparatus further comprises a gate valve provided between the first chamber and the second chamber for opening and closing a passage through which the substrate passes from the inside of the first chamber to the inside of the second chamber. 1. The vacuum device according to 1. 3. The vacuum apparatus according to claim 2, wherein the connecting portion of the support unit is provided with a space for movement of the valve body of the gate valve. The connecting portion is composed of a plurality of members that are connected to each other by fastening screw parts,
The first pedestal is connected to the connecting portion by fastening a screw part,
a through hole through which the shaft portion of the screw component for connecting the plurality of members is inserted; and a through hole through which the shaft portion of the screw component for connecting the connecting portion and the first pedestal is inserted. 4. The vacuum apparatus according to any one of claims 1 to 3, wherein at least one of the holes is an elongated hole elongated in the direction in which the substrate moves between the first chamber and the second chamber. . a through hole through which the shaft portion of the screw component for connecting the plurality of members is inserted; and a through hole through which the shaft portion of the screw component for connecting the connecting portion and the first pedestal is inserted. 5. The vacuum apparatus according to claim 4, wherein at least one of the holes is an elongated hole extending in a direction perpendicular to the moving direction. The vacuum apparatus according to any one of claims 1 to 5, wherein the support unit further comprises a column connected to the first pedestal and supporting the first pedestal from below. The second pedestal has a rotating shaft portion extending in a direction parallel to the first fixing surface, and is rotatably supported by the connecting portion,
7. The vacuum according to claim 6, wherein the connecting portion includes a shaft clamping member capable of clamping the rotating shaft portion at a predetermined rotational position to fix the position of the second pedestal with respect to the first pedestal. Device. The support unit is bendable such that the angle of the second fixing surface with respect to the first fixing surface is substantially a right angle,
The distance in the direction orthogonal to the first fixing surface from the rotating shaft portion to the lower end of the support column is the distance from the rotating shaft portion to the end of the second pedestal farther from the connecting portion. 8. Vacuum device according to claim 7, characterized in that it is larger. The support unit further includes a leg member that supports the second pedestal from below, and a leg connection member that connects the second pedestal and the leg member,
The vacuum apparatus according to any one of claims 1 to 8, wherein the leg member is rotatably supported by the leg connection member. when the first fixing surface and the second fixing surface are parallel, the leg member is perpendicular to a plane along the second fixing surface;
10. The vacuum device according to claim 9, wherein the leg member is positioned along the second fixing surface when the first fixing surface and the second fixing surface are not parallel. The vacuum apparatus according to any one of claims 1 to 10, wherein the first chamber is a swirl chamber equipped with a robot hand for transporting the substrate. The second chamber is a pass chamber located downstream of the first chamber in the direction in which the substrate is conveyed and provided with a stage on which the substrate is placed,
The stage moves in a first direction parallel to the mounting surface of the substrate, moves in a second direction parallel to the mounting surface of the substrate orthogonal to the first direction, and moves in the first direction and the first direction. 12. The vacuum apparatus according to claim 11, wherein at least one drive of rotation about a rotation axis in a third direction orthogonal to the two directions is possible. further comprising a third chamber connected to the upstream side in the direction of transport of the substrate with respect to the first chamber;
The support unit includes a third pedestal having a third fixing surface to which the third chamber is fixed, and a third pedestal connecting portion that connects the first pedestal and the third pedestal,
The support unit is bent by the connecting portion for the third pedestal such that an angle between a surface along the first fixing surface and a surface along the third fixing surface changes. 13. Vacuum apparatus according to claim 12. 14. The vacuum apparatus according to claim 13, wherein the third chamber is a pass chamber having a fixed stage on which the substrate is placed. a plurality of cluster apparatuses each having a film forming chamber for forming a film on a substrate;
a relay device provided between the adjacent cluster devices for transporting the substrate from the upstream side in the substrate transport direction to the downstream cluster device;
An electronic device manufacturing apparatus having
An electronic device manufacturing apparatus, wherein the relay device includes the vacuum device according to any one of claims 1 to 14.

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