CN115714096A

CN115714096A - Vacuum apparatus and apparatus for manufacturing electronic device

Info

Publication number: CN115714096A
Application number: CN202211004397.2A
Authority: CN
Inventors: 斋藤顺平
Original assignee: Canon Tokki Corp
Current assignee: Canon Tokki Corp
Priority date: 2021-08-23
Filing date: 2022-08-22
Publication date: 2023-02-24
Also published as: JP2023030550A; KR20230029523A

Abstract

The invention provides a vacuum apparatus and an apparatus for manufacturing an electronic device. In a vacuum device having a plurality of chambers configured to be capable of depressurizing the inside, the plurality of chambers can be integrally conveyed in a small space, and labor and time for assembly can be reduced. The vacuum device is provided with: a first chamber (21); a second chamber (22) connected to the first chamber (21); and a support unit (25) that supports the first chamber (21) and the second chamber (22), wherein the support unit (25) is provided with: a first pedestal (251) having a first fixing surface (251 a) for fixing the bottom surface of the first chamber (21); a second pedestal (252) having a second fixing surface (252 a) for fixing the bottom surface of the second chamber (22); and a connecting portion (253) that connects the first pedestal (251) and the second pedestal (252), wherein the support unit (25) is bent by the connecting portion (253) such that the angle formed by a surface along the first fixing surface (251 a) and a surface along the second fixing surface (252 a) changes.

Description

Vacuum apparatus and apparatus for manufacturing electronic device

Technical Field

The present invention relates to a vacuum apparatus and an apparatus for manufacturing an electronic device.

Background

As a vacuum apparatus, an apparatus having a plurality of chambers configured to be internally depressurizeable is known. For example, in an apparatus for manufacturing electronic devices such as an organic EL display device, a plurality of cluster devices and relay devices are usually alternately arranged. The cluster apparatus has chambers such as a transfer chamber and a film forming chamber, and performs a film forming process on a substrate. The relay device has chambers such as a whirling chamber and a path chamber, and is disposed between the cluster devices to carry the substrate. The chambers of these apparatuses are provided on separate stands, and are transported to a factory or the like in a state where the chambers are separated from each other. Therefore, when assembling the manufacturing apparatus, in order to connect the chambers to each other, it is necessary to adjust the positions of the chambers in the height direction and the horizontal direction.

On the other hand, patent document 1 discloses a structure in which a plurality of chambers are supported by one mount. The chamber supported by the gantry is connected to another chamber at both ends, and the plurality of chambers are supported in a so-called cantilever state, whereby the plurality of chambers are supported by one gantry.

Prior art documents

Patent literature

Patent document 1: japanese laid-open patent publication No. 10-247675

As described above, the structure in which the plurality of chambers are supported by one rack saves labor and time for adjusting the position of the apparatus after transportation at the time of assembly. However, when the apparatus is large, problems such as inclination of the chamber and breakage of the connection portion, and restrictions due to size restrictions in transportation can be expected in the cantilever state, and therefore, the same configuration cannot be adopted.

Disclosure of Invention

The purpose of the present invention is to reduce labor and time for assembly by enabling a plurality of chambers to be integrally conveyed in a small space in a vacuum device having the plurality of chambers configured so that the interior of the chamber can be depressurized.

Means for solving the problems

The vacuum apparatus of the present invention includes:

a first chamber;

a second chamber coupled to the first chamber; and

a support unit supporting the first chamber and the second chamber,

it is characterized in that the preparation method is characterized in that,

the support unit includes: a first pedestal having a first fixing surface for fixing a bottom surface of the first chamber; a second pedestal having a second fixing surface for fixing a bottom surface of the second chamber; and a connecting portion connecting the first pedestal and the second pedestal,

the support unit is bent by the connecting portion so as to change an angle formed by a surface along the first fixing surface and a surface along the second fixing surface.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, in a vacuum apparatus including a plurality of chambers configured to be depressurizeable inside, the plurality of chambers can be integrally conveyed in a small space, and labor and time for assembly can be reduced.

Drawings

Fig. 1 is a schematic view showing a part of an apparatus for manufacturing an electronic device.

Fig. 2 is a schematic diagram of a relay apparatus in a set state.

Fig. 3 is a schematic perspective view of the relay device in the set state.

Fig. 4 is a schematic diagram of the relay device in the conveyance state.

Fig. 5 is a schematic perspective view of the relay device in the conveyance state.

Fig. 6 is a schematic view of the connection portion in the conveyance state.

Fig. 7 is a schematic front view of the connecting portion in the set state.

Fig. 8 is a schematic bottom view of the connecting portion in the set state.

Fig. 9 is a schematic perspective view of the connection portion.

Fig. 10 is a schematic view showing the driving of the leg member.

Fig. 11 is a schematic front view of a connection portion in a conveying state of a modification.

Fig. 12 is an explanatory view of the organic EL display device of the embodiment of the present invention.

Description of the reference numerals

The multi-stage support structure comprises a rotary chamber (first chamber) \8230 '; 21, a path chamber (second chamber) \8230'; 22, a support unit \8230 '; 25, a pedestal (first pedestal) \8230'; 251, a fixed surface (first fixed surface) \8230 '; 251a, a movable pedestal (second pedestal) \8230'; 252, a fixed surface (second fixed surface) \8230 '; 251b, and a connecting portion \8230'; 253.

Detailed Description

Hereinafter, a mode for carrying out the present invention will be described in detail by way of example based on embodiments with reference to the accompanying drawings. However, it should be noted that the sizes, materials, shapes, relative arrangements thereof, and the like of the constituent members described in the present embodiment are appropriately changed depending on the configuration of the apparatus to which the present invention is applied and various conditions. That is, the scope of the present invention is not limited to the following embodiments.

The present invention relates to a vacuum apparatus including a plurality of chambers configured to be internally depressurizeable. The present invention can be applied to, for example, an apparatus for depositing various materials on a surface of a substrate to form a film, and preferably, an apparatus for forming a thin film (material film) having a desired pattern by vacuum deposition. As a material of the substrate, any material such as glass, a film of a polymer material, a silicon wafer, and a metal can be selected, and the substrate may be, for example, a substrate in which a thin film such as polyimide is deposited on a glass substrate. As the vapor deposition material, any material such as an organic material or a metallic material (metal, metal oxide, or the like) can be selected. The present invention is applicable to a film Deposition apparatus including a sputtering apparatus and a CVD (Chemical Vapor Deposition) apparatus, in addition to the vacuum Deposition apparatus described in the following description. Specifically, the technique of the present invention can be applied to a manufacturing apparatus for an organic electronic device (for example, an organic light-emitting element, a thin-film solar cell), an optical member, or the like. Among these, a manufacturing apparatus that forms an organic light-emitting element by evaporating an evaporation material and evaporating the evaporation material onto a substrate through a mask is one of preferable application examples of the present invention. In the following, a case where the present invention is applied to an apparatus for manufacturing an electronic device will be described as an example, but the vacuum apparatus of the present invention is not limited thereto, and can be applied to various vacuum apparatuses including a plurality of chambers.

[ manufacturing apparatus for electronic device ]

Fig. 1 is a plan view schematically showing a structure of a part of an apparatus for manufacturing an electronic device. The manufacturing apparatus of fig. 1 is used for manufacturing, for example, a display panel of an organic EL display device for a smart phone or an organic EL display device for a VRHMD. In the case of a display panel for a smartphone, for example, a 4.5-generation substrate (about 700mm × about 900 mm), a 6-generation substrate having a full size (about 1500mm × about 1850 mm), or a half-cut size (about 1500mm × about 925 mm) is used. After the film formation for forming the organic EL element is performed on the substrate, the substrate is cut to produce a plurality of small-sized panels. In the case of a display panel for a VRHMD, for example, a silicon wafer having a predetermined size (for example, 300 mm) is used. After film formation for forming organic EL elements is performed on the silicon wafer, the silicon wafer is diced along regions (scribe regions) between the element formation regions, and a plurality of small-sized panels are manufactured.

An electronic device manufacturing apparatus generally includes a plurality of cluster apparatuses 1 and a relay apparatus 2 for connecting the cluster apparatuses 1 to each other between the cluster apparatuses 1. The cluster apparatus 1 includes a plurality of film deposition apparatuses 11 that perform processes (e.g., film deposition) on substrates, a plurality of mask storage apparatuses 12 that store masks before and after use, and a transfer chamber 13 disposed at the center of the apparatuses. As shown in fig. 1, the transfer chamber 13 is connected to the plurality of film deposition apparatuses 11 and the mask stocker 12, respectively.

A transfer robot 14 for transferring the substrate and the mask is disposed in the transfer chamber 13. The transfer robot 14 transfers the substrate from the passage chamber 22 of the relay apparatus 2 disposed on the upstream side to the film deposition apparatus 11. Further, the transfer robot 14 transfers the mask between the film deposition apparatus 11 and the mask stocker 12. The transfer robot 14 is a robot having a structure in which a robot hand for holding a substrate or a mask is attached to an articulated arm, for example.

In the film forming apparatus 11 (also referred to as a film forming chamber or a vapor deposition apparatus), a vapor deposition material stored in an evaporation source is heated by a heater to be evaporated, and is deposited on a substrate through a mask. The film deposition apparatus 11 performs a series of film deposition processes such as delivery and reception of a substrate to and from the transfer robot 14, adjustment (alignment) of the relative position between the substrate and the mask, fixation of the substrate to the mask, and film deposition (vapor deposition).

In the mask stocker 12, a new mask used in a film forming process in the film forming apparatus 11 and a used mask are stored in two separate boxes. The transfer robot 14 transfers the used mask from the film formation apparatus 11 to the cassette of the mask storage apparatus 12, and transfers a new mask stored in another cassette of the mask storage apparatus 12 to the film formation apparatus 11.

The cluster apparatus 1 is connected to: a path chamber 22 for supplying a substrate from the upstream side in the flow direction of the substrate to the cluster device 1; and a path chamber 22 for supplying the substrate subjected to the film formation process in the cluster apparatus 1 to another cluster apparatus on the downstream side. The transfer robot 14 of the transfer chamber 13 receives the substrate from the upstream path chamber 22 and transfers the substrate to one of the film deposition apparatuses 11 in the cluster apparatus 1. The transfer robot 14 receives a substrate on which a film formation process has been completed in the cluster apparatus 1 from one of the plurality of film formation apparatuses 11, and transfers the substrate to the path chamber 22 of the relay apparatus 2 connected to the downstream side.

The relay device 2 is provided with a whirling chamber 21 for changing the direction of the substrate and path chambers 22 provided on the upstream side and the downstream side of the whirling chamber 21, respectively, and transports the substrate transported from the upstream cluster device 1 to the downstream cluster device 1. A transfer robot 24 is provided in the whirling chamber 21, and the transfer robot 24 receives the substrate from the upstream path chamber 22, rotates the substrate by 180 °, and transfers the substrate to the downstream path chamber 22. This makes it possible to easily handle substrates because the directions of substrates carried in by the upstream cluster device 1 and the downstream cluster device 1 are the same.

The passage chamber 22 in this embodiment includes a mounting table for mounting a substrate. The path chamber 22 provided upstream of the swirling chamber 21 in the relay device 2 includes a fixed stage that does not move or rotate. On the other hand, the path chamber 22 provided on the downstream side of the whirling chamber 21 includes an alignment mechanism, and the stage is capable of being driven to move in a first direction parallel to the mounting surface, in a second direction parallel to the mounting surface and orthogonal to the first direction, and to rotate about a third direction orthogonal to the first direction and the second direction. The alignment process can be made efficient by performing the alignment of the substrates in advance in the relay device 2 before the substrates are conveyed into the conveyance chamber 13 of the cluster device 1.

Further, a buffer chamber 23 may be provided on the downstream side of the cluster device 1 instead of the passage chamber 22. The relay device 2 provided on the upstream side and/or the downstream side of the cluster device 1 includes at least one of the swirl chamber 21, the path chamber 22, and the buffer chamber 23.

The cluster apparatus 1 and the relay apparatus 2 are vacuum apparatuses, and the interiors of a plurality of chambers constituting the cluster apparatus 1 and the relay apparatus 2 can be depressurized. The film forming apparatus 11, the mask stocker 12, the transfer chamber 13, the buffer chamber 23, the whirling chamber 21, and the like are maintained in a high vacuum state during the process of manufacturing the organic light emitting element. The path chamber 22 is normally maintained in a low vacuum state, but may be maintained in a high vacuum state as needed.

In the present embodiment, the structure of the apparatus for manufacturing an electronic device is described with reference to fig. 1, but the present invention is not limited to this, and other types of apparatuses and chambers may be provided, and the arrangement of these apparatuses and chambers may be changed. For example, the manufacturing apparatus of an electronic device according to an embodiment of the present invention may also be of an in-line type instead of the cluster type shown in fig. 1. That is, the substrate and the mask may be mounted on a carrier, and the film may be formed while being transported in a plurality of film forming apparatuses arranged in a line. Further, a configuration combining a cluster type and an inline type may be provided. For example, the cluster-type manufacturing apparatus may perform the film formation of the base layer, and the in-line-type manufacturing apparatus may perform the sealing step, the cutting step, and the like from the film formation step of the electrode layer (cathode layer).

[ Relay device ]

The relay device 2 according to the embodiment of the present invention will be described with reference to fig. 2 to 5. In this embodiment, the longitudinal direction in which the substrate is transferred from the upstream chamber to the downstream chamber in the substrate transfer direction is defined as the X direction, the width direction orthogonal to the longitudinal direction is defined as the Y direction, and the height direction orthogonal to the longitudinal direction and the width direction is defined as the Z direction. The longitudinal direction (X direction) is also a moving direction in which the substrate moves between the chambers.

The relay device 2 of the present embodiment has a characteristic configuration that can be switched between an installation state in which substrates are transferred between cluster devices and a transport state for transporting substrates to a transport device such as a factory. Fig. 2 (a) is a schematic plan view showing the configuration of the relay device 2 in an installation state in which the swirling chamber 21 and the passage chamber 22 are connected and the substrate can be transported between the swirling chamber 21 and the passage chamber 22, and fig. 2 (b) is a schematic front view thereof. Fig. 3 is a schematic perspective view of the relay device 2 in the installation state. The relay device 2 of the present embodiment is provided with path chambers 22 (second chamber and third chamber) adjacent to each other on the upstream and downstream sides of the swirling chamber 21 (first chamber), and support means 25 for supporting the swirling chamber 21 and the path chambers 22. The relay device 2 further includes a gate valve 26 between the swirling chamber 21 and the path chamber 22, and the gate valve 26 and the path chamber 22 are connected via an adapter plate 27.

The support unit 25 includes a base 251 (first base) for supporting the swirling chamber 21, a movable base 252 (second base, third base) for supporting the passage chamber 22, and a connecting portion 253 for connecting the base 251 and the movable base 252. The bottom surface of the swirling chamber 21 is fixed to a fixing surface 251a (first fixing surface) of the pedestal 251. Similarly, the bottom surface of the passage chamber 22 is fixed to a fixing surface 252a (second fixing surface, third fixing surface) of the movable base 252. Further, the support unit 25 includes: a support structure 254 for supporting the pedestal 251 from below; a leg member 255 supporting the movable base 252 from below; and a shaft clamp member 256 as a leg connecting member that connects the leg member 255 and the movable base 252.

The swirl chamber 21 of the present embodiment has a hexagonal shape when viewed from above, and the support structure 254 that supports the swirl chamber 21 from below via the base 251 is configured by a plurality of supports including a support that supports each vertex of a hexagon. The column structure 254 further includes a level adjuster 2541 that can adjust the position in the height direction when the device is assembled.

The passage chamber 22 of the present embodiment has a rectangular shape when viewed from above, and is fixed to the movable base 252. In the relay device 2 in the installation state, the fixed surface 251a of the base 251 to which the whirling chamber 21 is fixed and the fixed surface 252a of the movable base 252 to which the passage chamber 22 is fixed are provided in parallel. The movable pedestal 252 is supported on the leg member 255 via a shaft clamp member 256. Movable base 252 is connected to base 251 via a connection portion 253 formed of a plurality of members. That is, in the set state, the movable base 252 is supported by the leg member 255 and the connection portion 253. The leg member 255 includes a horizontal adjuster 2551, and is adjustable in position in the height direction, similarly to the support structure 254.

The movable pedestal 252 of the present embodiment is supported by the connection portion 253 to be rotatable about a rotation axis in the width direction (Y direction). When the connection between the path chamber 22 and the swirling chamber 21 is released and the movable base 252 is rotated, the path chamber 22 and the movable base 252 are rotated together. The leg member 255 is also supported by the shaft clamp member 256 so as to be rotatable about the width direction as a rotation axis. The relay device 2 in the set state can be switched to a conveyance state described later by rotating the movable base 252 and the leg members 255. The structure for allowing the movable base 252 and the leg member 255 to rotate will be described in detail later.

Fig. 4 (a) is a schematic plan view showing the configuration of the relay device 2 in the conveyance state, and fig. 4 (b) is a schematic front view thereof. Fig. 5 is a schematic perspective view of the relay device 2 in the conveyance state. In the relay device 2 in the conveyance state, the support unit 25 is bent such that the angle formed by the fixed surface 251a of the base 251 and the fixed surface 252a of the movable base 252 is substantially perpendicular. The leg member 255 is folded with respect to the movable base 252 so as to extend in a direction parallel to the fixed surface 252a of the movable base 252. The relay device 2 of the present embodiment is configured such that a distance M1 from the rotation shaft 252b, which is the rotation center of the movable base 252, to the end portion on the lower side of the support structure 254 is greater than a distance M2 from the rotation shaft 252b to the end portion on the side away from the connection portion 253 of the movable base 252. With such a configuration, when the movable base 252 is rotated with respect to the base 251, the movable base 252 does not interfere with the floor surface, and the support unit 25 is bent at a substantially right angle, so that the size of the relay device 2 during conveyance can be reduced.

In order to avoid interference between the leg member 255 and the support column structure 254, the leg member 255 is supported rotatably by a shaft clamp member 256 connected to the movable base 252 and can be folded with respect to the movable base 252. That is, in the transport state, the movable base 252 is supported only by the connection portion 253. Further, in the case where the movable base 252 including the passage chamber 22 has an excessively large weight and is not sufficiently supported only by the connection portion 253, a configuration in which the movable base 252 and the support structure 254 are connected by another member and are more firmly supported during conveyance may be considered as a modification.

As described above, by configuring the support unit 25 to be bendable so that the angle of the fixing surface 252a with respect to the fixing surface 251a changes, the overall length L2 in the longitudinal direction of the relay device 2 in the transport state can be made smaller than the overall length L1 in the longitudinal direction of the relay device 2 in the installation state. By deforming the entire maximum side of the apparatus so as to be small, it is possible to obtain great advantages in conveyance, such as reduction in conveyance space and avoidance of a conflict of size restrictions in conveyance. That is, since the relay device 2 of the present invention can integrally convey a plurality of chambers, it is possible to easily perform position adjustment and the like at the time of installation of the device. Further, since the apparatus can be reduced in size and transported as compared with the case of connecting only the chambers and the gantry, it is possible to save space and avoid the conflict of size restrictions during transportation.

The gate valve 26 includes a disk body 261 (valve body) and a main body 262 (valve body), and opens and closes a passage for passing the substrate from the inside of the swirl chamber 21 to the inside of the passage chamber 22 by movement of the disk body 261. An adapter plate 27 for connection to the passage chamber 22 is provided on a surface of the gate valve 26 opposite to a surface thereof connected to the swirling chamber 21. The adaptor plate 27 and the path chamber 22 are connected by a screw member (not shown), and a cover provided on the upper surface of the path chamber 22 is removed, whereby a fastening operation by the screw member can be performed. The adapter plate 27 includes a seal groove 27a provided with a seal ring 28 on both of a connection surface to the gate valve 26 and a connection surface to the passage chamber 22. By connecting the gate valve 26 to the passage chamber 22 via the adapter plate 27 provided with the seal groove 27a, air can be prevented from leaking from the connection portion between the gate valve 26 and the passage chamber 22. The respective chambers can be maintained in a low vacuum state or a high vacuum state by raising the disk 261 to close the passage through which the substrate passes, closing the gate valve 26, sealing the respective chambers, and then evacuating the chambers with a pump.

The transfer device 2 in the transportation state may seal each chamber so that moisture or the like does not enter the chamber during offshore transportation or the like. Therefore, in the conveying state, the swirling chamber 21 is in a sealed state by closing the gate valves 26 provided at both ends of the swirling chamber 21. Then, the raw material 41 is attached to and sealed at both ends of the passage chamber 22. As the raw material 41, a SUS metal plate having a thickness of about 5 to 20mm is used. After the sealing, the inside of the swirling chamber 21 and the inside of the passage chamber 22 are depressurized, and the interiors are brought into a vacuum state and conveyed.

[ connecting part 253]

Referring to fig. 6 to 9, a connection portion 253 connecting the base 251 and the movable base 252 will be described. Hereinafter, the movable base 252 (second base) and the connection portion 253 connected to the passage chamber 22 provided on the downstream side of the swirling chamber 21 will be described with reference to the drawings. The movable base 252 (third base) and the connection portion 253 (connection portion for the third base) connected to the path chamber 22 provided on the upstream side with respect to the swirling chamber 21 have the same configuration as the downstream side, and therefore, the description thereof is omitted.

Fig. 6 (a) is a schematic plan view showing the structure of the connecting portion 253 in the conveying state, and fig. 6 (b) is a schematic front view thereof. The connection portion 253 of the present embodiment is composed of three members, i.e., a base connection member 2531 connected to the base 251, an intermediate member 2532 engaged with the pin member 38 connected to the lower surface of the passage chamber 22, and a shaft clamping member 2533 through which the rotation shaft portion 252b of the movable base 252 is inserted. The base connection members 2531 are members connected to the base 251 by screws 35 and extending in the longitudinal direction (X direction) so as to be beside the space where the disk body 261 of the gate valve 26 moves, and are provided on both sides in the width direction of the relay device 2. Intermediate member 2532 is a member elongated in the width direction (Y direction) of relay device 2, and is connected to base connection member 2531 at both ends in the width direction by

screws

33 and 34. That is, the connecting portion 253 is provided so as to surround the main body 262 of the gate valve 26 and the space in which the disk body 261 moves, by the pedestal 251, the pedestal connecting member 2531, and the intermediate member 2532. Furthermore, a pin hole 2532a is provided in the intermediate member 2532, and the pin hole 2532a engages with a pin member 38 connected to the path chamber 22. A pair of shaft clamping members 2533 are connected to both ends of the intermediate member 2532 in the width direction by screws 32. The shaft clamp member 2533 engages with the rotation shaft 252b of the movable base 252 through the rotation shaft support hole 2533a to support the movable base 252.

Fig. 7 (a) is a schematic front view showing a detailed structure of the connection portion 253 in the set state, and fig. 7 (b) is a schematic front view not showing a screw member and the like of fig. 7 (a). The shaft clamp member 2533 has a rotation shaft support hole 2533a, a notch 2533b, a clamp screw hole 2533c, a through hole 2533d (non-screw hole), and a through long hole 2533e. The rotation shaft 252b of the movable base 252 is inserted into the rotation shaft support hole 2533 a. The cutout 2533b extends from the rotation shaft support hole 2533a to the end of the shaft clamping member 2533. The clamping screw hole 2533c and the through hole 2533d extend perpendicular to the surface of the cutout 2533b with the same center axis, and the clamping screw 31 is inserted therethrough. When the clamp screw 31 is attached to and tightened in the clamp screw hole 2533c, the shaft clamp member 2533 is elastically deformed, and the rotation shaft portion 252b of the movable pedestal 252 is tightened in the rotation shaft support hole 2533 a. That is, the movable base 252 can be rotated with respect to the base 251 by loosening the clamp screw 31, and the movable base 252 can be fixed at a predetermined rotational position with respect to the base 251 by tightening the clamp screw 31.

The through long holes 2533e are holes through which screws 32 for connecting to the intermediate member 2532 are inserted, and two of the shaft clamping members 2533 are provided. The through long hole 2533e has a long hole shape that is long in the longitudinal direction (X direction) in order to adjust the longitudinal position of the passage chamber 22 with respect to the swirl chamber 21 when the movable base 252 is connected to the adapter plate 27. By providing two through long holes 2533e, the movable base 252 is firmly supported, and when the screw 32 is loosened, the shaft clamp member 2533 is prevented from rotating with respect to the intermediate member 2532, and the workability of the installation work of the device is improved. The details of the operation of connecting the movable base 252 to the interposer 27 while adjusting the position of the movable base 252 to set the relay device 2 in the installation state will be described later.

Pedestal connection member 2531 and intermediate member 2532 are connected by a screw 33 attached to the side surface side and a screw 34 attached to the lower surface side. The pedestal connection member 2531 has a vertical wall portion 2531a, and a screw 33 is inserted into a through hole 2531b provided in the vertical wall portion 2531 a. Screws 34 attached to the lower surface side of pedestal connection member 2531 are inserted into screw holes provided in the lower portion of intermediate member 2532. Further, pin members 38 connected to path chamber 22 engage pin holes 2532a of intermediate member 2532.

Fig. 8 (a) is a schematic bottom view showing a detailed structure of the connection portion 253, and fig. 8 (b) is a schematic bottom view not showing the screw member and the like of fig. 8 (a). Fig. 9 is a detailed diagram showing a detailed structure of the connection portion 253. Base connecting member 2531 is connected to intermediate member 2532 by a screw 33 inserted through hole 2531b of vertical wall portion 2531a provided on the side surface side and a screw 34 inserted through long hole 2531c provided on the lower surface side. The through long hole 2531c has a long hole shape that is long in the width direction (Y direction) in order to adjust the position of the path chamber 22 in the width direction with respect to the swirl chamber 21 when the movable base 252 is connected to the adapter plate 27. That is, long through hole 2533e of shaft clamp member 2533 and long through hole 2531c of base connection member 2531 are long in the directions orthogonal to each other. A gap of about 5 to 20mm is provided between vertical wall portion 2531a of base connecting member 2531 and the end portion of intermediate member 2532 facing vertical wall portion 2531a, and this gap allows intermediate member 2532 to move in the width direction with respect to base connecting member 2531 together with passage chamber 22.

In addition, the connection portion 253 of the present embodiment is formed of three members, but the connection portion 253 may be formed of a plurality of members. Further, although the connecting portion 253 is provided with a space in which the disk body 261 of the gate valve 26 moves, a modification is conceivable in which the disk body 261 does not have a space in the connecting portion 253 in which the disk body 26 moves using the gate valve 26 in which the disk body 261 moves upward.

The elongated hole provided in the connecting portion is not limited to the above configuration, and for example, a hole through which a screw is inserted to connect the connecting portion 253 and the base 251 may be formed as an elongated hole.

[ leg Member ]

Fig. 10 (a) is a schematic view showing a state in which the leg member 255 is folded with respect to the movable base 252, and fig. 10 (b) is a schematic view showing a state in which the leg member 255 supports the movable base 252. In the movable base 252, when the relay device 2 is set, the leg member 255 supporting the movable base 252 is connected via the shaft clamp member 256. Further, when the movable base 252 is rotated with respect to the base 251, the leg member 255 is also supported by the shaft clamp member 256 so as to be rotatable with respect to the movable base 252 in order to prevent the leg member 255 from interfering with the floor surface and being unable to rotate.

The shaft clamping member 256 has a rotation shaft supporting hole, a notch, a clamping screw hole, and a through hole (non-screw hole), and is connected to the movable base 252 by the screw 36. The rotation shaft support hole is engaged with the rotation shaft 255a of the leg member 255. The cutout extends from the rotation shaft support hole to the end of the shaft clamping member 256. The clamp screw hole and the through hole extend perpendicularly to the surface of the cutout on the same central axis, and the clamp screw is inserted through the through hole. By fitting and tightening the clamp screw 37 into the clamp screw hole, the shaft clamp member 256 is elastically deformed to tighten the rotary shaft portion 255a of the leg member 255 in the rotary shaft support hole. That is, the leg member 255 can be rotated with respect to the movable base 252 by loosening the clamp screw 37, and the leg member 255 is fixed with respect to the movable base 252 by tightening the clamp screw 37. With the above-described configuration, the leg member 255 is fixed in a folded state with respect to the movable base 252 in the conveyance state, and the leg member 255 does not interfere with the support structure 254.

Further, although the relay device 2 of the present embodiment is configured such that the leg member 255 is also connected to the movable base 252 in the conveyance state, it may be configured such that it does not have a rotation function on the premise that the leg member 255 is detached and conveyed. Further, the leg members 255 may be configured to be extendable and retractable in length so that the leg members 255 do not interfere with the strut structure 254 when the relay device 2 is bent. As a modification, it is needless to say that a structure for supporting more firmly by increasing the number of leg members can be conceived.

[ installation work of the repeater 2 ]

A method of assembling the relay device 2 carried into a factory or the like in a transport state into an installation state will be described. First, in order to connect the relay device 2 and the cluster device 1 at the same height of the line, the position in the height direction is adjusted by the horizontal adjuster 2541 provided in the support structure 254. Next, the shaft clamp member 2533 is loosened, and the movable base 252 is rotated so that the fixing surface 252a of the movable base 252 is substantially parallel to the fixing surface 251a of the base 251. At this time, the shaft clamp members 256 are also loosened to rotate the leg members 255, so that the movable base 252 and the path chamber 22 can be supported. Then, adjustment is performed by using the level adjuster 2551 of the leg member 255 to be able to fix the posture of the movable pedestal 252 and support the path chamber 22 from below. Thus, the path chamber 22 is supported by the connection portion 253 and the leg member 255 via the movable base 252.

Next, fine adjustment of the position of the path chamber 22 with respect to the swirl chamber 21 is performed in order to connect the path chamber 22 and the swirl chamber 21. Since the passage chamber 22 is connected to the adapter plate 27 by a screw member, it is necessary to adjust the position in each direction so that the positions of the holes for screw fastening are matched with each other. The path chamber 22 is fixed to the movable base 252 by a screw member inserted from the bottom of the movable base 252, and the position of the path chamber 22 in the height direction with respect to the swirl chamber 21 can be finely adjusted by sandwiching a spacer between the path chamber 22 and the movable base 252. Further, the horizontal position of the passage chamber 22 with respect to the swirling chamber 21 can be finely adjusted by the long through holes 2533e long in the longitudinal direction (X direction) and the long through holes 2531c long in the width direction (Y direction). According to the above configuration, the device provided with the plurality of chambers can be integrally transported in a small space, and after the transportation, the position of the path chamber 22 with respect to the swirling chamber 21 can be finely adjusted, and the connection can be easily performed to assemble the device.

The configuration of the present invention is not limited to the above configuration, and various modifications can be made. For example, a configuration may be considered in which the relay device 2 is provided with the buffer chamber 23 instead of the path chamber 22, and a configuration in which the path chamber 22 is provided at both ends of the transfer chamber 13 of the cluster device 1 using the connection portions 253 instead of the swirling chamber 21.

As another modification, a structure may be considered in which the path chamber 22 and the connection portion 253 are connected by using screws or the like instead of the pin members 38. Fig. 11 is a schematic front view showing a detailed structure of the connecting portion 253 in an installation state of a modification using the screw 39. In the present modification, screw 39 is inserted through-holes provided in pedestal connection member 2531 and intermediate member 2532, and is inserted through a screw hole provided in the lower surface of path chamber 22, whereby path chamber 22 and connection portion 253 are connected. By adopting such a configuration, since the fastening force acts in the direction in which the path chamber 22 and the connection portion 253 approach each other, the connection can be made more firmly than in the case where only the pin is engaged with the hole. In the conveying state, screws 39 are attached to the lower surface of path chamber 22, and base connection member 2531 and intermediate member 2532 are connected by different members such as bolts and nuts, thereby preventing foreign matter from entering the screw holes and through holes. It is needless to say that a structure may be conceived in which the screw and the hole used for the connection between path chamber 22 and intermediate member 2532 and the connection between intermediate member 2532 and pedestal connection member 2531 are separately provided and connected.

[ method for manufacturing electronic device ]

Next, an example of a method for manufacturing an electronic device using the vacuum apparatus of the present embodiment will be described. Hereinafter, the structure of the organic EL display device is shown as an example of the electronic device, and a method for manufacturing the organic EL display device is exemplified.

First, the organic EL display device manufactured will be described. Fig. 12 (a) is an overall view of the organic EL display device 50, and fig. 12 (b) shows a cross-sectional structure of 1 pixel.

As shown in fig. 12 (a), in a display region 501 of the organic EL display device 50, a plurality of pixels 502 each including a plurality of light-emitting elements are arranged in a matrix. As will be described in detail later, each of the light emitting elements has a configuration with an organic layer sandwiched between a pair of electrodes. Here, the pixel is a minimum unit that can display a desired color in the display region 501. In the case of the organic EL display device of the present embodiment, the pixel 502 is constituted by a combination of the first light-emitting element 502R, the second light-emitting element 502G, and the third light-emitting element 502B which display different light emissions from each other. The pixel 502 is often configured by a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but is not particularly limited as long as it is a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element and at least 1 color.

FIG. 12 (b) is a partial cross-sectional view taken along line S-S of FIG. 12 (a). The pixel 502 is formed of a plurality of light-emitting elements, each of which has a first electrode (anode) 504, a hole transport layer 505, any one of light-emitting

layers

506R, 506G, and 506B, an electron transport layer 507, and a second electrode (cathode) 508 on a substrate 503. The hole transport layer 505, the

light emitting layers

506R, 506G, and 506B, and the electron transport layer 507 correspond to organic layers. In this embodiment, the light-emitting layer 506R is an organic EL layer that emits red light, the light-emitting layer 506G is an organic EL layer that emits green light, and the light-emitting layer 506B is an organic EL layer that emits blue light. The light-emitting

layers

506R, 506G, and 506B are formed in patterns corresponding to light-emitting elements (also referred to as organic EL elements) that emit red light, green light, and blue light, respectively.

In addition, the first electrode 504 is formed separately for each light emitting element. The hole transport layer 505, the electron transport layer 507, and the second electrode 508 may be formed by the plurality of

light emitting elements

502R, 502G, and 502B in common, or may be formed for each light emitting element. In order to prevent the first electrode 504 and the second electrode 508 from being short-circuited by foreign matter, an insulating layer 509 is provided between the first electrodes 504. Since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 510 for protecting the organic EL element from moisture or oxygen is provided.

In fig. 12 (b), the hole transport layer 505 and the electron transport layer 507 are illustrated as one layer, but may be formed of a plurality of layers including a hole blocking layer and an electron blocking layer depending on the structure of the organic EL display element. Further, a hole injection layer having a band structure can be formed between the first electrode 504 and the hole transport layer 505, and holes can be smoothly injected from the first electrode 504 into the hole transport layer 505. Similarly, an electron injection layer can be further formed between the second electrode 508 and the electron transport layer 507.

Next, an example of a method for manufacturing an organic EL display device will be specifically described.

First, a substrate (mother glass) 503 on which a circuit (not shown) for driving the organic EL display device and a first electrode 504 are formed is prepared.

An acrylic resin is formed by spin coating over the substrate 503 on which the first electrode 504 is formed, and the acrylic resin is patterned by photolithography so that an opening is formed in a portion where the first electrode 504 is formed, thereby forming an insulating layer 509. The opening corresponds to a light-emitting region where the light-emitting element actually emits light.

The substrate 503 with the patterned insulating layer 509 is placed on a substrate carrier provided with an adhesive member. The substrate 503 is held by an adhesive member. The first organic material film-forming apparatus is carried in, and after the inversion, the hole transport layer 505 is formed as a common layer on the first electrode 504 in the display region. The hole transport layer 505 is formed by vacuum deposition. In fact, since the hole transport layer 505 is formed to be larger in size than the display region 501, a high-definition mask is not required.

Next, the substrate 503 with the hole transport layer 505 formed thereon is carried into the second organic material film forming apparatus. The substrate and the mask are aligned, the substrate is placed on the mask, and a light-emitting layer 506R that emits red light is formed on a portion of the substrate 503 where an element that emits red light is disposed.

Similarly to the formation of the light-emitting layer 506R, the light-emitting layer 506G emitting green light is formed by a third organic material film-forming device, and the light-emitting layer 506B emitting blue light is formed by a fourth organic material film-forming device. After the light-emitting

layers

506R, 506G, and 506B are formed, the electron-transporting layer 507 is formed over the entire display region 501 by a fifth film formation apparatus. The electron transport layer 507 is formed as a common layer of the

light emitting layers

506R, 506G, and 506B of the three colors.

The substrate on which the electron transport layer 507 has been formed is moved by a metallic vapor deposition material film forming apparatus, and the second electrode 508 is formed.

Then, the substrate is moved to the plasma CVD apparatus to form the protective layer 510, thereby completing the film formation process on the substrate 503. After the inversion, the substrate 503 is separated from the substrate carrier by peeling the adhesive member from the substrate 503 as described in the above embodiments or examples. Then, the organic EL display device 50 is completed by cutting.

When the substrate 503 with the patterned insulating layer 509 is carried into a film forming apparatus and the film formation of the protective layer 510 is completed, the light-emitting layer made of an organic EL material may be deteriorated by moisture or oxygen if the substrate is exposed to an atmosphere containing moisture or oxygen. Therefore, in this embodiment, the substrate is carried in and out between the film forming apparatuses in a vacuum atmosphere or an inert gas atmosphere.

Claims

1. A vacuum device is provided with:

a first chamber;

a second chamber coupled to the first chamber; and

a supporting unit supporting the first chamber and the second chamber,

it is characterized in that the preparation method is characterized in that,

2. Vacuum device according to claim 1,

the vacuum apparatus further includes a gate valve provided between the first chamber and the second chamber, and configured to open and close a passage through which the substrate passes from the inside of the first chamber to the inside of the second chamber.

3. Vacuum device according to claim 2,

a space for moving a valve body of the gate valve is provided in the connection portion of the support unit.

4. Vacuum device according to claim 1,

the connecting portion is constituted by a plurality of members connected to each other by fastening of screw parts,

the first pedestal is connected to the connecting portion by fastening of a screw member,

at least one of a through hole through which a shaft portion of the screw member for connecting the plurality of members to each other is inserted and a through hole through which a shaft portion of the screw member for connecting the connecting portion and the first pedestal is inserted is an elongated hole that is elongated in a moving direction in which the substrate moves between the first chamber and the second chamber.

5. Vacuum device according to claim 4,

at least one of a through hole through which a shaft portion of the screw member for connecting the plurality of members to each other is inserted and a through hole through which a shaft portion of the screw member for connecting the connecting portion to the first base is inserted is an elongated hole that is elongated in a direction orthogonal to the moving direction.

6. Vacuum device according to claim 1,

the support unit further includes a support column connected to the first base to support the first base from below.

7. The vacuum apparatus according to claim 6,

the second base includes a rotating shaft portion extending in a direction parallel to the first fixed surface and is rotatably supported by the connecting portion,

the connecting portion includes a shaft clamping member capable of fastening the rotation shaft portion at a predetermined rotation position to fix the position of the second base relative to the first base.

8. Vacuum device according to claim 7,

the support unit can be bent such that the angle of the second fixing surface with respect to the first fixing surface becomes substantially a right angle,

the distance from the rotating shaft to the end of the pillar on the lower side in the direction orthogonal to the first fixing surface is greater than the distance from the rotating shaft to the end of the second base on the side away from the connecting portion.

9. Vacuum device according to claim 1,

the support unit further includes a leg member for supporting the second base from below, and a leg connecting member for connecting the second base and the leg member,

the leg member is rotatably supported by the leg connecting member.

10. Vacuum device according to claim 9,

the leg member is perpendicular to a plane along the second fixing surface when the first fixing surface is parallel to the second fixing surface,

when the first fixing surface is not parallel to the second fixing surface, the leg member is located in a direction along the second fixing surface.

11. Vacuum device according to claim 1,

the first chamber is a whirling chamber provided with a robot hand for transferring a substrate.

12. Vacuum device according to claim 11,

the second chamber is a path chamber located downstream of the first chamber in the substrate conveying direction and including a mounting table on which the substrate is mounted,

the mounting table is capable of driving at least one of movement in a first direction parallel to a mounting surface of the substrate, movement in a second direction orthogonal to the first direction and parallel to the mounting surface of the substrate, and rotation about a third direction orthogonal to the first direction and the second direction as a rotation axis.

13. The vacuum apparatus according to claim 12,

the vacuum apparatus further includes a third chamber connected to the first chamber on an upstream side in a substrate transfer direction,

the support unit includes: a third pedestal having a third fixing surface to which the third chamber is fixed; and a third base connecting portion for connecting the first base and the third base,

the support unit is bent by the third pedestal connecting portion so as to change an angle formed by a surface along the first fixing surface and a surface along the third fixing surface.

14. Vacuum device according to claim 13,

the third chamber is a path chamber having a fixed mounting table on which the substrate is mounted.

15. An apparatus for manufacturing an electronic device is provided,

the manufacturing device of the electronic device comprises:

a plurality of cluster apparatuses each including a film forming chamber for forming a film on a substrate; and

relay devices provided between the adjacent cluster devices, respectively, for transferring the substrate from an upstream side to a downstream side in a transfer direction of the substrate,

it is characterized in that the preparation method is characterized in that,

the relay device comprises the vacuum device according to any one of claims 1 to 14.