JP2023013935A - 合金材料の特殊な水路設計の放熱装置 - Google Patents
合金材料の特殊な水路設計の放熱装置 Download PDFInfo
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- JP2023013935A JP2023013935A JP2022066644A JP2022066644A JP2023013935A JP 2023013935 A JP2023013935 A JP 2023013935A JP 2022066644 A JP2022066644 A JP 2022066644A JP 2022066644 A JP2022066644 A JP 2022066644A JP 2023013935 A JP2023013935 A JP 2023013935A
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- 239000000956 alloy Substances 0.000 title claims abstract description 29
- 238000013461 design Methods 0.000 title claims abstract description 25
- 230000005855 radiation Effects 0.000 title claims abstract description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 74
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 71
- 238000010438 heat treatment Methods 0.000 claims abstract description 42
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims description 61
- 239000000463 material Substances 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 8
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 abstract description 12
- 239000010432 diamond Substances 0.000 abstract description 12
- 239000002585 base Substances 0.000 description 18
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000013329 compounding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 229910021397 glassy carbon Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 150000007523 nucleic acids Chemical class 0.000 description 1
- 102000039446 nucleic acids Human genes 0.000 description 1
- 108020004707 nucleic acids Proteins 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
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Abstract
Description
サンプル載置台、前記サンプル載置台に当接して設けられたグラフェン加熱構造、前記グラフェン加熱構造に当接して設けられた放熱構造及び前記放熱構造を被覆するための保護カバーを含み、
前記放熱構造は前記グラフェン加熱構造に当接する放熱台及び放熱台と連通する放熱ダクトを含み、前記放熱台の中間部位に水管貫通溝が開設されており、前記水管貫通溝内に放熱ダクトが嵌合されており、
前記放熱台の内部に複数の水路環状溝が開設されており、前記水路環状溝は前記水管貫通溝と連通する。
サンプル載置台、前記サンプル載置台に当接して設けられたグラフェン加熱構造、前記グラフェン加熱構造に当接して設けられた放熱構造及び前記放熱構造を被覆するための保護カバーを含み、
前記放熱構造は前記グラフェン加熱構造に当接する放熱台及び放熱台と連通する放熱ダクトを含み、前記放熱台の中間部位に水管貫通溝が開設されており、前記水管貫通溝内に放熱ダクトが嵌合されており、
前記放熱台の内部に複数の水路環状溝が開設されており、前記水路環状溝は前記水管貫通溝と連通する。
Claims (7)
- 合金材料の特殊な水路設計の放熱台であって、
サンプル載置台(1)、前記サンプル載置台(1)に当接して設けられたグラフェン加熱構造(2)、前記グラフェン加熱構造(2)に当接して設けられた放熱構造(3)及び前記放熱構造(3)を被覆するための保護カバー(4)を含み、
前記放熱構造(3)は前記グラフェン加熱構造(2)に当接する放熱台(31)及び放熱台(31)と連通する放熱ダクトを含み、前記放熱台(31)の中間部位に水管貫通溝が開設されており、前記水管貫通溝内に放熱ダクトが嵌合されており、
前記放熱台(31)の内部に複数の水路環状溝(311)が開設されており、前記水路環状溝(311)は前記水管貫通溝と連通する、ことを特徴とする合金材料の特殊な水路設計の放熱台。 - 前記グラフェン加熱構造(2)は第1グラフェン部材と、前記第1グラフェン部材に貼り付けて設けられた第2グラフェン部材と、前記第1グラフェン部材と第2グラフェン部材との間に設けられた薄型電熱線とを含む、ことを特徴とする請求項1に記載の合金材料の特殊な水路設計の放熱台。
- 前記放熱台(31)の外周の一回りに固定溝が設けられており、前記固定溝内に保護カバー(4)が嵌合されている、ことを特徴とする請求項1に記載の合金材料の特殊な水路設計の放熱台。
- 複数の前記水路環状溝(311)の間は隣接して設けられ、かつ水路環状溝(311)は前記放熱台(31)の端面に沿って環状に配列される、ことを特徴とする請求項3に記載の合金材料の特殊な水路設計の放熱台。
- 前記第1グラフェン部材と第2グラフェン部材の中間部位にそれぞれ第1貫通孔が開設されており、前記第1グラフェン部材と第2グラフェン部材の第1貫通孔が対応して設けられる、ことを特徴とする請求項2に記載の合金材料の特殊な水路設計の放熱台。
- 前記放熱台(31)の中間部位に1つの第2貫通孔が開設されており、前記第2貫通孔が第1貫通孔に対応して設けられて1つの通路を形成する、ことを特徴とする請求項1に記載の合金材料の特殊な水路設計の放熱台。
- 前記放熱台(31)の材質がいずれも銅錫合金材料であり、前記サンプル載置台(1)の材料がMT合金である、ことを特徴とする請求項1に記載の合金材料の特殊な水路設計の放熱台。
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JP3210051B2 (ja) * | 1992-01-16 | 2001-09-17 | 株式会社東芝 | 気相成長装置 |
US20100116788A1 (en) * | 2008-11-12 | 2010-05-13 | Lam Research Corporation | Substrate temperature control by using liquid controlled multizone substrate support |
US9119327B2 (en) * | 2010-10-26 | 2015-08-25 | Tdk-Lambda Corporation | Thermal management system and method |
JP6069654B2 (ja) * | 2013-03-29 | 2017-02-01 | Sppテクノロジーズ株式会社 | 被処理基板のプラズマ処理用載置台及びこれを用いたプラズマ処理装置 |
GB201320304D0 (en) * | 2013-11-18 | 2014-01-01 | Element Six Ltd | Methods of fabricating synthetic diamond materials using microwave plasma actived chemical vapour deposition techniques and products obtained using said |
US9382625B2 (en) * | 2014-05-01 | 2016-07-05 | Applied Materials, Inc. | Remote plasma source based cyclic CVD process for nanocrystalline diamond deposition |
JP2017069429A (ja) * | 2015-09-30 | 2017-04-06 | 株式会社東京精密 | ウェハの高精度加工装置 |
US10704160B2 (en) * | 2016-05-10 | 2020-07-07 | Arizona Board Of Regents On Behalf Of Arizona State University | Sample stage/holder for improved thermal and gas flow control at elevated growth temperatures |
JP6799550B2 (ja) * | 2018-01-16 | 2020-12-16 | 東京エレクトロン株式会社 | プラズマ処理装置の部品をクリーニングする方法 |
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CN108385086A (zh) * | 2018-03-12 | 2018-08-10 | 武汉工程大学 | 基片台系统及利用该系统提高金刚石膜生长均匀性的方法 |
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