JP2022551605A5 - - Google Patents

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Publication number
JP2022551605A5
JP2022551605A5 JP2022520542A JP2022520542A JP2022551605A5 JP 2022551605 A5 JP2022551605 A5 JP 2022551605A5 JP 2022520542 A JP2022520542 A JP 2022520542A JP 2022520542 A JP2022520542 A JP 2022520542A JP 2022551605 A5 JP2022551605 A5 JP 2022551605A5
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JP
Japan
Prior art keywords
atomic percent
atomic
percentage
aluminum
manganese
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022520542A
Other languages
English (en)
Japanese (ja)
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JP2022551605A (ja
JP7684290B2 (ja
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Application filed filed Critical
Priority claimed from PCT/AU2020/051062 external-priority patent/WO2021062485A1/en
Publication of JP2022551605A publication Critical patent/JP2022551605A/ja
Publication of JP2022551605A5 publication Critical patent/JP2022551605A5/ja
Application granted granted Critical
Publication of JP7684290B2 publication Critical patent/JP7684290B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022520542A 2019-10-03 2020-10-02 銅合金 Active JP7684290B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
AU2019903725A AU2019903725A0 (en) 2019-10-03 Copper alloys
AU2019903725 2019-10-03
PCT/AU2020/051062 WO2021062485A1 (en) 2019-10-03 2020-10-02 Copper alloys

Publications (3)

Publication Number Publication Date
JP2022551605A JP2022551605A (ja) 2022-12-12
JP2022551605A5 true JP2022551605A5 (https=) 2025-02-04
JP7684290B2 JP7684290B2 (ja) 2025-05-27

Family

ID=75336358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022520542A Active JP7684290B2 (ja) 2019-10-03 2020-10-02 銅合金

Country Status (8)

Country Link
US (1) US12365963B2 (https=)
EP (1) EP4038211A4 (https=)
JP (1) JP7684290B2 (https=)
KR (1) KR102944465B1 (https=)
CN (1) CN114616352B (https=)
AU (1) AU2020359670B2 (https=)
CA (1) CA3153356A1 (https=)
WO (1) WO2021062485A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118647740A (zh) 2022-02-18 2024-09-13 古河电气工业株式会社 铜合金材料、以及使用了铜合金材料的电阻器用电阻材料及电阻器

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1272737A (en) * 1970-03-13 1972-05-03 American Smelting Refining Copper base alloy
JPS5917175B2 (ja) * 1978-04-06 1984-04-19 三菱マテリアル株式会社 耐食性のすぐれた建築および装飾工芸用白色銅合金
JPS5952223B2 (ja) * 1979-04-23 1984-12-18 三菱マテリアル株式会社 養殖生け「す」用銅合金
JPS5952223A (ja) 1982-09-20 1984-03-26 Ricoh Co Ltd 感熱複写機
JPS5976453A (ja) * 1982-10-19 1984-05-01 Mitsubishi Metal Corp 半導体装置のリ−ド材用Cu合金クラツド材
US4587097A (en) * 1984-06-22 1986-05-06 Allied Corporation Homogeneous low melting temperature brazing filler metal for joining ferrous and non-ferrous alloys
CN1948531A (zh) * 2006-11-03 2007-04-18 宁波博威集团有限公司 高锰铜镍锌合金及其线、棒、板、带材制备方法
CN100441713C (zh) * 2007-01-24 2008-12-10 宁波博威集团有限公司 易切削高锰铜合金
WO2011060034A1 (en) * 2009-11-10 2011-05-19 Gbc Metals, Llc Antitarnish, antimicrobial copper alloys and surfaces made from such alloys
DE102012014851A1 (de) * 2011-09-22 2013-03-28 Kme Germany Gmbh & Co. Kg Kupferwerkstoff für die Herstellung eines silberfarbigen Produktes mit einer antimikrobiellen Oberfläche
JP5632821B2 (ja) * 2011-12-06 2014-11-26 株式会社神戸製鋼所 タッチパネルセンサー用Cu合金配線膜、及びその製造方法、並びにタッチパネルセンサー
TWI537400B (zh) * 2011-12-06 2016-06-11 神戶製鋼所股份有限公司 觸控面板感測器用銅合金配線膜及其之製造方法、以及觸控面板感測器、以及濺鍍靶
WO2016065416A1 (en) * 2014-10-28 2016-05-06 New South Innovations Pty Limited Metal alloys including copper
CN109385610A (zh) * 2017-08-07 2019-02-26 态金材料科技股份有限公司 以高熵液态合金靶材制作的手机镀膜
JP2024141540A (ja) * 2023-03-29 2024-10-10 三菱重工業株式会社 購入支援装置、購入支援方法、及び購入支援プログラム

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