JP2022549041A - 多色ledピクセル単位およびマイクロledディスプレイパネル - Google Patents
多色ledピクセル単位およびマイクロledディスプレイパネル Download PDFInfo
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- 229910052751 metal Inorganic materials 0.000 claims description 214
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- 239000010410 layer Substances 0.000 description 553
- 238000000034 method Methods 0.000 description 49
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- 238000000206 photolithography Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 238000000059 patterning Methods 0.000 description 7
- 239000004020 conductor Substances 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
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- 238000000605 extraction Methods 0.000 description 3
- 238000011031 large-scale manufacturing process Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
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- 239000004065 semiconductor Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
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- 239000002356 single layer Substances 0.000 description 1
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- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
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- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
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- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
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- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
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- H01L33/385—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending at least partially onto a side surface of the semiconductor body
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Abstract
Description
本出願は、2019年9月11日出願の米国特許出願第16/567,123号に基づき、その優先権の利益を主張する。上述の出願の内容は、その全体が参照により本明細書に組み込まれる。
Claims (17)
- 基板と、
前記基板上に形成された発光トランジスタとを備え、前記発光トランジスタが、
前記基板上に形成された最下部導電層および前記最下部導電層の上に形成された最上部導電層と、
前記最上部導電層と前記最下部導電層との間に形成された上部発光層と、
前記上部発光層と前記最下部導電層との間に形成された少なくとも1つの下部発光層と、
前記少なくとも1つの下部発光層および前記最下部導電層を電気的に接続する電気コネクタと、を含む、多色発光ピクセル単位。 - 前記上部発光層と前記少なくとも1つの下部発光層との間に形成された金属層を更に備える、請求項1に記載の多色発光ピクセル単位。
- 前記電気コネクタが、前記金属層、前記少なくとも1つの下部発光層、および前記最下部導電層の側面に取り付けられ、該側面に接触する、請求項2に記載の多色発光ピクセル単位。
- 前記電気コネクタが、前記金属層および前記最下部導電層の側面に取り付けられ、該側面に接触する、請求項2に記載の多色発光ピクセル単位。
- 前記電気コネクタが前記発光トランジスタの側面に取り付けられ、該側面に接触する、請求項1に記載の多色発光ピクセル単位。
- 前記少なくとも1つの下部発光層が、
前記上部発光層と前記最下部導電層との間に形成された第1の下部発光層と、
前記第1の下部発光層と前記最下部導電層との間に形成された第2の下部発光層と、を含む、請求項1に記載の多色発光ピクセル単位。 - 前記電気コネクタが前記第1の下部発光層および前記第2の下部発光層を電気的に接続する、請求項6に記載の多色発光ピクセル単位。
- 前記上部発光層と前記第1の下部発光層と間に形成された第1の金属層と、
前記第1の下部発光層と前記第2の下部発光層との間に形成された第2の金属層と、を更に備える、請求項6に記載の多色発光ピクセル単位。 - 前記電気コネクタが、前記第1の金属層、前記第2の金属層、前記第1の下部発光層、前記第2の下部発光層、および前記最下部導電層の側面に取り付けられ、該側面に接触する、請求項8に記載の多色発光ピクセル単位。
- 前記電気コネクタが、前記第1の金属層、前記第2の金属層、および前記最下部導電層の側面に取り付けられ、該側面に接触する、請求項8に記載の多色発光ピクセル単位。
- 前記発光トランジスタが青色発光トランジスタであり、前記上部発光層が青色発光層である、請求項1に記載の多色発光ピクセル単位。
- 前記少なくとも1つの下部発光層が赤色発光層および緑色発光層を含む、請求項11に記載の多色発光ピクセル単位。
- 前記電気コネクタが、前記赤色発光層および前記緑色発光層の両方を前記最下部導電層に電気的に接続する、請求項12に記載の多色発光ピクセル単位。
- 前記発光トランジスタが緑色発光トランジスタであり、前記上部発光層が緑色発光層である、請求項1に記載の多色発光ピクセル単位。
- 前記少なくとも1つの下部発光層が赤色発光層を含む、請求項14に記載の多色発光ピクセル単位。
- 前記電気コネクタが赤色発光層を前記最下部導電層に電気的に接続する、請求項14に記載の多色発光ピクセル単位。
- 請求項1に記載の前記多色発光ピクセル単位を備える、マイクロディスプレイパネル。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/567,123 | 2019-09-11 | ||
US16/567,123 US11362133B2 (en) | 2019-09-11 | 2019-09-11 | Multi-color LED pixel unit and micro-LED display panel |
PCT/IB2020/000733 WO2021048622A1 (en) | 2019-09-11 | 2020-09-11 | Multi-color led pixel unit and micro-led display panel |
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JP2022549041A true JP2022549041A (ja) | 2022-11-24 |
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JP2021552509A Pending JP2022549041A (ja) | 2019-09-11 | 2020-09-11 | 多色ledピクセル単位およびマイクロledディスプレイパネル |
Country Status (8)
Country | Link |
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US (1) | US11362133B2 (ja) |
EP (1) | EP4029057A4 (ja) |
JP (1) | JP2022549041A (ja) |
KR (1) | KR20220061911A (ja) |
CN (1) | CN114788002A (ja) |
AU (1) | AU2020346416A1 (ja) |
SG (1) | SG11202109449PA (ja) |
WO (1) | WO2021048622A1 (ja) |
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US11355480B1 (en) * | 2020-01-27 | 2022-06-07 | Facebook Technologies, Llc | Micropixellation for alignment-free assembly |
US11114587B1 (en) * | 2020-02-25 | 2021-09-07 | Odyssey Semiconductor, Inc. | Streamlined GaN-based fabrication of light emitting diode structures |
US11476299B2 (en) * | 2020-08-31 | 2022-10-18 | Hong Kong Beida Jade Bird Display Limited | Double color micro LED display panel |
WO2024033904A1 (en) * | 2022-08-12 | 2024-02-15 | Jade Bird Display (shanghai) Limited | Multi-color led pixel unit and micro-led display panel |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3755521B2 (ja) * | 2003-06-13 | 2006-03-15 | セイコーエプソン株式会社 | 有機el装置とその駆動方法、照明装置、及び電子機器 |
KR100987451B1 (ko) * | 2003-12-04 | 2010-10-13 | 엘지전자 주식회사 | 면발광 소자 |
US7816859B2 (en) | 2007-04-30 | 2010-10-19 | Global Oled Technology Llc | White light tandem OLED |
KR101316752B1 (ko) * | 2007-05-31 | 2013-10-08 | 삼성디스플레이 주식회사 | 백색 유기발광소자 |
KR101365824B1 (ko) | 2010-10-22 | 2014-02-20 | 엘지디스플레이 주식회사 | 유기전계발광소자 |
JP5617700B2 (ja) | 2011-03-07 | 2014-11-05 | セイコーエプソン株式会社 | 発光装置および発光装置の製造方法 |
JP6192431B2 (ja) * | 2013-08-21 | 2017-09-06 | 株式会社ジャパンディスプレイ | 有機el表示装置の駆動方法、及び有機el表示装置 |
US9142595B2 (en) * | 2013-10-18 | 2015-09-22 | OLEDWorks LLC | Color-tunable OLED lighting device |
CN104681724A (zh) | 2013-11-29 | 2015-06-03 | 海洋王照明科技股份有限公司 | 有机电致发光器件及其制备方法 |
KR102302850B1 (ko) * | 2014-10-22 | 2021-09-23 | 삼성디스플레이 주식회사 | 발광 소자 |
US9825088B2 (en) | 2015-07-24 | 2017-11-21 | Epistar Corporation | Light-emitting device and manufacturing method thereof |
US10032757B2 (en) | 2015-09-04 | 2018-07-24 | Hong Kong Beida Jade Bird Display Limited | Projection display system |
CN106531772B (zh) | 2016-12-27 | 2020-01-31 | 武汉华星光电技术有限公司 | Oled显示装置及其制作方法 |
US11282981B2 (en) | 2017-11-27 | 2022-03-22 | Seoul Viosys Co., Ltd. | Passivation covered light emitting unit stack |
CN110767670B (zh) | 2019-10-31 | 2022-11-15 | 成都辰显光电有限公司 | 显示面板、显示装置和显示面板的制作方法 |
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2019
- 2019-09-11 US US16/567,123 patent/US11362133B2/en active Active
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2020
- 2020-09-11 WO PCT/IB2020/000733 patent/WO2021048622A1/en unknown
- 2020-09-11 KR KR1020217035536A patent/KR20220061911A/ko unknown
- 2020-09-11 CN CN202080063585.5A patent/CN114788002A/zh active Pending
- 2020-09-11 EP EP20863087.1A patent/EP4029057A4/en active Pending
- 2020-09-11 SG SG11202109449PA patent/SG11202109449PA/en unknown
- 2020-09-11 AU AU2020346416A patent/AU2020346416A1/en active Pending
- 2020-09-11 JP JP2021552509A patent/JP2022549041A/ja active Pending
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US20210074761A1 (en) | 2021-03-11 |
SG11202109449PA (en) | 2021-09-29 |
KR20220061911A (ko) | 2022-05-13 |
CN114788002A (zh) | 2022-07-22 |
AU2020346416A1 (en) | 2021-09-30 |
EP4029057A1 (en) | 2022-07-20 |
WO2021048622A1 (en) | 2021-03-18 |
EP4029057A4 (en) | 2023-10-18 |
US11362133B2 (en) | 2022-06-14 |
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