JP2022541511A - 半導体製造におけるマルチゾーンヒータのモデルベース制御 - Google Patents
半導体製造におけるマルチゾーンヒータのモデルベース制御 Download PDFInfo
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Abstract
Description
Claims (20)
- 複数の温度検出器から温度フィードバックを収集する工程であって、前記複数の温度検出器の各々は、ウエハを支持する基板支持アセンブリの複数の加熱ゾーンのうちの対応する加熱ゾーンに配置される、複数の温度検出器から温度フィードバックを収集する工程と、
前記温度フィードバックを表すデータを、プロセス制御アルゴリズムへの第1の入力として提供する工程と、
モデルを使用して計算された、前記複数の加熱ゾーンのうちの1又は複数の加熱ゾーンに対するヒータ温度の目標値を、前記プロセス制御アルゴリズムへの第2の入力として提供する工程と、
前記1又は複数の加熱ゾーンに対する前記ヒータ温度の目標値を達成するためのヒータ電力の目標値を計算する工程であって、前記計算は、前記プロセス制御アルゴリズムを実行するプロセッサによって、前記第1の入力及び前記第2の入力に基づいて実行される、前記1又は複数の加熱ゾーンに対する前記ヒータ温度の目標値を達成するためのヒータ電力の目標値を計算する工程と、
前記基板支持アセンブリを含む処理チャンバのチャンバハードウェアを、前記1又は複数の加熱ゾーンに対する前記ヒータ温度の目標値と一致するように制御する工程と
を含む方法。 - 前記複数の温度検出器は、複数の測温抵抗体(RTD)を含む、請求項1に記載の方法。
- 前記モデルは、1又は複数のプロセスパラメータの現在の最適値に対応するウエハ特性に基づいて、前記1又は複数の加熱ゾーンのうちの特定の加熱ゾーンに対するヒータ温度の目標値を計算するように構成される、請求項1に記載の方法。
- 前記プロセス制御アルゴリズムは、前記温度フィードバックの収集、前記温度フィードバックを表すデータの提供、前記ヒータ温度の目標値の提供、前記ヒータ電力の目標値の計算、及びチャンバハードウェアの制御の工程が繰り返される閉ループアルゴリズムである、請求項1に記載の方法。
- 前記チャンバハードウェアを制御することは、
計算された前記ヒータ電力の目標値を前記1又は複数の加熱ゾーンに供給するように、ヒータ電子機器を制御することを含む、請求項1に記載の方法。 - 前記チャンバハードウェアを制御することは更に、
前記1又は複数の加熱ゾーンに対するヒータ温度の目標値を達成するために、熱交換器温度を制御することを含む、請求項5に記載の方法。 - 前記モデルによって使用されるプロセスパラメータは、シャワーヘッドの温度、チャンバ圧力、及び前記シャワーヘッドと基板支持アセンブリとの間の距離のうちの1又は複数を含む、請求項3に記載の方法。
- 1又は複数の前記プロセスパラメータの現在の最適値に対応するウエハ特性は、ウエハエッチング量及びウエハ温度のうちの一方又は両方を含む、請求項7に記載の方法。
- 前記モデルによって使用されるプロセスパラメータは、チャンバ本体温度、熱交換器温度、リフトピンの高さ、及びプロセスガスのうちの1又は複数を更に含む、請求項7に記載の方法。
- 前記モデルは、機械学習アルゴリズムを使用して、過去のチャンバデータを用いて訓練される、請求項1に記載の方法。
- 前記複数の加熱ゾーンの各々は、1又は複数のヒータを含む、請求項1に記載の方法。
- 前記基板支持アセンブリは複数の領域を有し、各領域は、対応する独立して制御可能な複数の加熱ゾーンを有する、請求項1に記載の方法。
- システムであって、
複数の温度検出器であって、各々が、ウエハを支持するように構成された基板支持アセンブリの複数の加熱ゾーンのうちの対応する加熱ゾーンに配置される、複数の温度検出器と、
プロセス制御アルゴリズムを実行するプロセッサと
を備え、前記プロセッサは、
前記複数の温度検出器から温度フィードバックデータを受信することと、
前記温度フィードバックデータを前記プロセス制御アルゴリズムへの第1の入力として提供することと、
サーバに記憶されたモデルを使用して、前記複数の加熱ゾーンのうちの1又は複数の前記加熱ゾーンに対するヒータ温度の目標値を計算することと、
前記モデルによって計算された、前記1又は複数の加熱ゾーンに対する前記ヒータ温度の目標値を、前記プロセス制御アルゴリズムへの第2の入力として提供することと、
前記1又は複数の加熱ゾーンに対する前記ヒータ温度の目標値を達成するためのヒータ電力の目標値を、前記第1の入力及び前記第2の入力に基づいて計算することと、
前記基板支持アセンブリを備える処理チャンバのチャンバハードウェアを、前記1又は複数の加熱ゾーンに対する前記ヒータ温度の目標値と一致するように調整する量を計算することと
を行う、システム。 - 前記複数の温度検出器は、複数の測温抵抗体(RTD)を含む、請求項13に記載のシステム。
- 前記モデルは、前記1又は複数の加熱ゾーンのうちの特定の加熱ゾーンに対するヒータ温度の目標値を、1又は複数のプロセスパラメータの現在の最適値に対応するウエハ特性に基づいて計算するように構成される、請求項13に記載のシステム。
- 前記チャンバハードウェアは、
計算された前記ヒータ電力の目標値を前記1又は複数の加熱ゾーンに供給するヒータ電子機器を備える、請求項13に記載のシステム。 - 前記チャンバハードウェアは更に、
前記1又は複数の加熱ゾーンに対するヒータ温度の目標値を達成するのに役立つ熱交換器温度コントローラを備える、請求項16に記載のシステム。 - 前記モデルによって使用されるプロセスパラメータは、シャワーヘッドの温度、チャンバ圧力、及び前記シャワーヘッドと基板支持アセンブリとの間の距離のうちの1又は複数を含む、請求項15に記載のシステム。
- 前記モデルによって使用されるプロセスパラメータは更に、チャンバ本体温度、熱交換器温度、リフトピンの高さ、及びプロセスガスのうちの1又は複数を含む、請求項18に記載のシステム。
- 前記プロセス制御アルゴリズムは、閉ループアルゴリズムである、請求項13に記載のシステム。
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