JP2022525810A - 分散型フィードバックレーザ - Google Patents
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 11
- 239000010703 silicon Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 238000000407 epitaxy Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000002019 doping agent Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
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- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
- G02B6/12019—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by the optical interconnection to or from the AWG devices, e.g. integration or coupling with lasers or photodiodes
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- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/1206—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers having a non constant or multiplicity of periods
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
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- G02B2006/12078—Gallium arsenide or alloys (GaAs, GaAlAs, GaAsP, GaInAs)
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- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
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- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0287—Facet reflectivity
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- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1028—Coupling to elements in the cavity, e.g. coupling to waveguides adjacent the active region, e.g. forward coupled [DFC] structures
- H01S5/1032—Coupling to elements comprising an optical axis that is not aligned with the optical axis of the active region
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- H01S5/00—Semiconductor lasers
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- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/1206—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers having a non constant or multiplicity of periods
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- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
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- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/3235—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength longer than 1000 nm, e.g. InP-based 1300 nm and 1500 nm lasers
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- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
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Abstract
Description
Claims (16)
- シリコンフォトニック集積回路(Si PIC)に実装される分散フィードバック(DFB)レーザであって、前記DFBレーザの第1の端部から前記DFBレーザの第2の端部まで延びる長手方向の長さを有し、
前記DFBレーザは、エピスタックを備え、
前記エピスタックは、
1又は複数の活性媒質層と、
前記DFBレーザの第2の端部から延在し、前記DFBレーザの第1の端部まで延在しないように、前記DFBレーザの長手方向の長さに沿って部分的にのみ延在する部分格子と、
前記DFBレーザの前記第1の端部に配置される高反射媒体と、
前記DFBレーザの前記第2の端部に配置される背面ファセットとを有する層を有することを特徴とするDFBレーザ。 - 請求項1に記載の分散フィードバック(DFB)レーザであって、
いかなる形態の冷却装置も含まない分散フィードバックレーザ。 - 請求項1に記載の分散フィードバックレーザであって、
前記高反射媒体は、高反射率(HR)バックファセットである分散フィードバックレーザ。 - 請求項1に記載の分散フィードバックレーザであって、
前記高反射媒体は、広帯域グレーティングミラーである分散フィードバックレーザ。 - 請求項4に記載の分散フィードバックレーザであって、
前記広帯域グレーティングミラーは、チャープ格子である分散フィードバックレーザ。 - 請求項1から5のいずれか一つに記載の分散フィードバックレーザであって、
前記部分格子によって定められるレーザ波長は、エピスタックの材料利得ピークより短い波長を有する分散フィードバックレーザ。 - 請求項1から6のいずれか一つに記載の分散フィードバックレーザであって、
前記エピスタックは、Si PIC上に取り付けられたフリップチップである分散フィードバックレーザ。 - 請求項7に記載の分散フィードバックレーザであって、
前記Si PICは、前記エピスタックの少なくとも一つの前記活性媒質層と整列する1又は複数のシリコン導波路を含む分散フィードバックレーザ。 - 請求項1から8のいずれか一つに記載の分散フィードバックレーザであって、
前記エピスタックの活性媒質層は、アルミニウムベースのInPエピタキシーから形成される分散フィードバックレーザ。 - 請求項9に記載の分散フィードバックレーザであって、
前記エピスタックは、Al(x)GaIn(y)Asで形成された活性層を含む分散フィードバックレーザ。 - 請求項10に記載の分散フィードバックレーザであって、
前記エピスタックは、PIN接合を含む分散フィードバックレーザ。 - 請求項11に記載の分散フィードバックレーザであって、
前記エピスタックの活性媒質層はドープされておらず、PIN接合の固有部分を形成する分散フィードバックレーザ。 - 請求項12に記載の分散フィードバックレーザであって、
前記部分格子は、前記活性媒質層の片側に配置され、
前記エピスタックは、前記活性媒質層の前記部分格子と同じ側にPドープ層を含む分散フィードバックレーザ。 - 請求項13に記載の分散フィードバックレーザであって、
前記エピスタックは、前記活性媒質層の前記部分格子から反対側にNドープ層を含む分散フィードバックレーザ。 - 請求項1から14のいずれか一つに記載の分散フィードバックレーザを配列したDFBレーザのアレイ。
- 請求項15に記載のDBFレーザアレイであって、
前記アレイのDBFレーザの各々は、他のDFBレーザによって形成される他のチャネルの波長と異なる波長を有する別のチャネルを提供するDFBレーザアレイ。
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US201962822635P | 2019-03-22 | 2019-03-22 | |
US62/822,635 | 2019-03-22 | ||
PCT/EP2020/057875 WO2020193433A1 (en) | 2019-03-22 | 2020-03-20 | A distributed feedback laser |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002134842A (ja) * | 2000-10-26 | 2002-05-10 | Hitachi Ltd | 半導体レーザ装置 |
JP2002329927A (ja) * | 2001-05-01 | 2002-11-15 | Furukawa Electric Co Ltd:The | 半導体レーザ装置、半導体レーザモジュールおよびこれを用いたラマン増幅器 |
JP2006108370A (ja) * | 2004-10-05 | 2006-04-20 | Furukawa Electric Co Ltd:The | 分布帰還型半導体レーザ素子及びそれを用いた半導体レーザモジュール |
JP2015088626A (ja) * | 2013-10-30 | 2015-05-07 | 住友電気工業株式会社 | 波長可変レーザ装置の試験方法および波長可変レーザ装置 |
JP2019500753A (ja) * | 2015-12-17 | 2019-01-10 | フィニサー コーポレイション | 表面結合システム |
US20190168821A1 (en) * | 2016-08-11 | 2019-06-06 | Bayerische Motoren Werke Aktiengesellschaft | Motor Vehicle |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4751710A (en) | 1984-07-26 | 1988-06-14 | Nec Corporation | Semiconductor laser device |
US5802096A (en) * | 1995-03-23 | 1998-09-01 | Nec Corporation | Distributed feed back laser with a grating structure adjusted for a reduced intermodulation distortion in an analog amplitude modulation and method for fabricating the same |
JP3450169B2 (ja) * | 1997-11-28 | 2003-09-22 | Necエレクトロニクス株式会社 | 分布帰還型半導体レーザ |
US6574260B2 (en) * | 2001-03-15 | 2003-06-03 | Corning Lasertron Incorporated | Electroabsorption modulated laser |
JP5143985B2 (ja) * | 2001-08-10 | 2013-02-13 | 古河電気工業株式会社 | 分布帰還型半導体レーザ素子 |
US6822982B2 (en) * | 2001-09-28 | 2004-11-23 | The Furukawa Electric Co., Ltd. | Device and method for providing a tunable semiconductor laser |
US6965628B1 (en) * | 2002-10-30 | 2005-11-15 | Finisar Corporation | Distributed feedback laser having a differential grating |
US8121170B2 (en) * | 2005-08-24 | 2012-02-21 | Applied Optoelectronics, Inc. | Gain-coupled distributed feedback semiconductor laser including first-order and second-order gratings |
JP2007227560A (ja) * | 2006-02-22 | 2007-09-06 | Mitsubishi Electric Corp | 利得結合型分布帰還型半導体レーザ |
US7639719B2 (en) | 2007-12-31 | 2009-12-29 | Intel Corporation | Thermal shunt for active devices on silicon-on-insulator wafers |
JPWO2009116140A1 (ja) | 2008-03-18 | 2011-07-21 | 富士通株式会社 | 光半導体素子及びその製造方法 |
JP5287460B2 (ja) | 2009-04-17 | 2013-09-11 | 富士通株式会社 | 半導体レーザ |
JP5286198B2 (ja) | 2009-08-27 | 2013-09-11 | Nttエレクトロニクス株式会社 | 分布帰還形半導体レーザ |
US10074959B2 (en) * | 2016-08-03 | 2018-09-11 | Emcore Corporation | Modulated laser source and methods of its fabrication and operation |
CN110431721B (zh) * | 2017-04-07 | 2021-06-29 | 华为技术有限公司 | 激光器 |
-
2020
- 2020-03-20 EP EP20714512.9A patent/EP3942657A1/en active Pending
- 2020-03-20 GB GB2004109.1A patent/GB2582706B/en active Active
- 2020-03-20 US US16/826,122 patent/US11605930B2/en active Active
- 2020-03-20 JP JP2021557000A patent/JP7509794B2/ja active Active
- 2020-03-20 CN CN202080005821.8A patent/CN114424414A/zh active Pending
- 2020-03-20 WO PCT/EP2020/057875 patent/WO2020193433A1/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002134842A (ja) * | 2000-10-26 | 2002-05-10 | Hitachi Ltd | 半導体レーザ装置 |
JP2002329927A (ja) * | 2001-05-01 | 2002-11-15 | Furukawa Electric Co Ltd:The | 半導体レーザ装置、半導体レーザモジュールおよびこれを用いたラマン増幅器 |
JP2006108370A (ja) * | 2004-10-05 | 2006-04-20 | Furukawa Electric Co Ltd:The | 分布帰還型半導体レーザ素子及びそれを用いた半導体レーザモジュール |
JP2015088626A (ja) * | 2013-10-30 | 2015-05-07 | 住友電気工業株式会社 | 波長可変レーザ装置の試験方法および波長可変レーザ装置 |
JP2019500753A (ja) * | 2015-12-17 | 2019-01-10 | フィニサー コーポレイション | 表面結合システム |
US20190168821A1 (en) * | 2016-08-11 | 2019-06-06 | Bayerische Motoren Werke Aktiengesellschaft | Motor Vehicle |
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CN114424414A (zh) | 2022-04-29 |
GB2582706B (en) | 2022-07-06 |
GB2582706A (en) | 2020-09-30 |
US11605930B2 (en) | 2023-03-14 |
US20200303891A1 (en) | 2020-09-24 |
JP7509794B2 (ja) | 2024-07-02 |
GB202004109D0 (en) | 2020-05-06 |
EP3942657A1 (en) | 2022-01-26 |
WO2020193433A1 (en) | 2020-10-01 |
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