JP2022514926A - プリントヘッド用のダイ - Google Patents
プリントヘッド用のダイ Download PDFInfo
- Publication number
- JP2022514926A JP2022514926A JP2021536232A JP2021536232A JP2022514926A JP 2022514926 A JP2022514926 A JP 2022514926A JP 2021536232 A JP2021536232 A JP 2021536232A JP 2021536232 A JP2021536232 A JP 2021536232A JP 2022514926 A JP2022514926 A JP 2022514926A
- Authority
- JP
- Japan
- Prior art keywords
- die
- fluid supply
- supply holes
- fluid
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 claims abstract description 218
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 32
- 238000001514 detection method Methods 0.000 claims description 21
- 229920000642 polymer Polymers 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000007599 discharging Methods 0.000 claims 1
- 230000005684 electric field Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 80
- 239000000976 ink Substances 0.000 description 35
- 229910052751 metal Inorganic materials 0.000 description 24
- 239000002184 metal Substances 0.000 description 24
- 238000010586 diagram Methods 0.000 description 19
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 18
- 229920005591 polysilicon Polymers 0.000 description 17
- 229910052710 silicon Inorganic materials 0.000 description 15
- 239000010703 silicon Substances 0.000 description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 239000000463 material Substances 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 229920001486 SU-8 photoresist Polymers 0.000 description 8
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 238000004382 potting Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000007639 printing Methods 0.000 description 7
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 5
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 229910052715 tantalum Inorganic materials 0.000 description 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910016570 AlCu Inorganic materials 0.000 description 3
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000005669 field effect Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000010146 3D printing Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910008807 WSiN Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- HXNZTJULPKRNPR-UHFFFAOYSA-N borinine Chemical compound B1=CC=CC=C1 HXNZTJULPKRNPR-UHFFFAOYSA-N 0.000 description 1
- 239000005380 borophosphosilicate glass Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- WNUPENMBHHEARK-UHFFFAOYSA-N silicon tungsten Chemical compound [Si].[W] WNUPENMBHHEARK-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000012085 test solution Substances 0.000 description 1
- 238000012725 vapour phase polymerization Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04543—Block driving
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14145—Structure of the manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14153—Structures including a sensor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/0458—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on heating elements forming bubbles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14403—Structure thereof only for on-demand ink jet heads including a filter
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Impression-Transfer Materials And Handling Thereof (AREA)
Abstract
Description
Claims (16)
- プリントヘッド用のダイであって:
前記ダイの長手方向軸と平行なラインに配置された複数の流体供給孔、ここで前記流体供給孔は前記ダイの基板を貫通して形成されている;
前記複数の流体供給孔から受け取った流体を吐出するための、前記複数の流体供給孔に近接する複数の流体アクチュエータ;
前記複数の流体アクチュエータを作動させるためのロジック回路、ここで前記ロジック回路は前記複数の流体供給孔の第1の側に配置されている;
前記複数の流体アクチュエータに給電するための電力回路、ここで前記電力回路は前記複数の流体供給孔の前記ロジック回路と反対側に配置されている;および
前記複数の流体供給孔の各々の間に配置されて前記ロジック回路を前記電力回路に結合する付勢トレースを含む、ダイ。 - 前記ロジック回路に近接しており前記ロジック回路に低電圧電力を供給するための共通の電力トレースおよび共通の接地トレースを含む、請求項1のダイ。
- 前記電力回路に近接しており前記電力回路に高電圧電力を供給するための共通の電力トレースおよび共通の接地トレースを含む、請求項1または2のいずれかのダイ。
- 前記第1の側において前記ロジック回路に近接する複数のアドレスラインを含む、請求項1から3のいずれかのダイ。
- 流体供給孔の外側縁部の周囲に配置されたクラック検出トレースを含み、クラック検出トレースは隣接する流体供給孔との間で前記基板を横断し、前記隣接する流体供給孔の外側縁部の周囲に配置されている、請求項1から4のいずれかのダイ。
- 前記クラック検出トレースは、前記基板上にある前記複数の流体供給孔の実質的にすべての周囲に配置されている、請求項1から5のいずれかのダイ。
- 前記複数の流体アクチュエータの各々は流れチャネルに結合されており、前記流れチャネルは前記複数の流体供給孔のすべてに対して流体的に結合されている、請求項1から6のいずれかのダイ。
- 前記ダイの各々の端部に配置された熱センサーを含む、請求項1から7のいずれかのダイ。
- 前記ダイの実質的に中間点に配置された熱センサーを含む、請求項1から8のいずれかのダイ。
- プリントヘッドであってダイを含み、前記ダイが:
前記ダイの長手方向軸に平行な第1のラインに沿った流体供給孔のアレイ;
前記第1のラインに平行な第2のラインに沿った複数の流体アクチュエータ、ここで各々の流体アクチュエータは可能化され活性化されるよう構成されている;
前記第1のラインに平行な第3のラインに沿った低電圧制御回路;および
前記第1のライン、前記第2のライン、および前記第3のラインに平行な第4のラインに沿った電界効果トランジスタ(FET)のアレイ、ここで前記第4のラインは前記第1のラインから前記第3のラインとは反対側にある、
を含む、プリントヘッド。 - 前記ダイが前記第1のラインと平行な、前記第1のラインから前記第2のラインと反対側にある第5のラインに沿った第2の複数の流体アクチュエータを含む、請求項10のプリントヘッド。
- 前記ダイを保持する高分子マウントを含み、前記高分子マウントは前記ダイの後面に沿って配置されたスロットを含んで流体を前記流体供給孔のアレイに提供する、請求項10または11のいずれかのプリントヘッド。
- プリントヘッド用のダイを形成するための方法であって:
複数の流体供給孔を基板の長手方向軸と平行なラインにおいてエッチングし;
前記基板上に複数の層を堆積して:
前記複数の流体供給孔の第1の側に沿って:
共通の低電圧電力ラインおよび共通の低電圧接地ラインを含む、前記基板の一方の縁部に沿ったロジック電力回路;
複数の流体アクチュエータ中の流体アクチュエータのグループから流体アクチュエータを選択するためのアドレスロジックを含む、アドレスロジック回路;
アドレスライン;および
流体アクチュエータの各々のグループについてのメモリ素子を含むメモリ回路を形成し;そして
前記複数の流体供給孔の第2の側に沿って:
共通の高電圧電力ラインおよび共通の高電圧接地ラインを含む、電力バス回路;および
前記複数の流体アクチュエータの各々のための熱抵抗器に給電するための電力回路を含む、印刷電力回路を形成し;
そして、
前記流体供給孔の間で前記第1の側から前記第2の側への、前記アドレスロジック回路を前記電力回路に結合するためのトレースを形成することを含む、方法。 - 前記複数の流体供給孔の各々の側に沿って、そして前記複数の流体供給孔と平行に配置された複数の熱抵抗器を形成することを含み、前記複数の熱抵抗器は前記印刷電力回路に電気的に結合され、そして前記複数の流体供給孔の一方の側にある前記複数の熱抵抗器は前記複数の流体供給孔の反対側にある前記複数の熱抵抗器と互い違いになっている、請求項13の方法。
- 前記複数の流体供給孔の一方の側に沿ったラインに配置され、前記複数の流体供給孔と平行な複数の熱抵抗器を形成することを含み、前記複数の熱抵抗器は前記印刷電力回路に電気的に結合され、そして前記複数の熱抵抗器は小さな熱抵抗器と交互になった大きな熱抵抗器を含んでいる、請求項13または14のいずれかの方法。
- 前記基板を高分子マウントに埋設することを含み、前記高分子マウントは前記流体供給孔に流体を供給するための前記基板の後面に配置された開放領域を含む、請求項13から15のいずれかの方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2019/016836 WO2020162924A1 (en) | 2019-02-06 | 2019-02-06 | Die for a printhead |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022514926A true JP2022514926A (ja) | 2022-02-16 |
JP7146094B2 JP7146094B2 (ja) | 2022-10-03 |
Family
ID=65598714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021536232A Active JP7146094B2 (ja) | 2019-02-06 | 2019-02-06 | プリントヘッド用のダイ |
Country Status (12)
Country | Link |
---|---|
US (1) | US11413864B2 (ja) |
EP (2) | EP4344878A3 (ja) |
JP (1) | JP7146094B2 (ja) |
KR (1) | KR102621225B1 (ja) |
CN (1) | CN113396065B (ja) |
AU (1) | AU2019428015B2 (ja) |
BR (1) | BR112021014843A2 (ja) |
CA (1) | CA3126057C (ja) |
IL (1) | IL284503A (ja) |
MX (1) | MX2021008855A (ja) |
PL (1) | PL3710261T3 (ja) |
WO (1) | WO2020162924A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3713768B1 (en) * | 2019-02-06 | 2023-06-28 | Hewlett-Packard Development Company, L.P. | Die for a printhead |
AU2019428712B2 (en) | 2019-02-06 | 2023-01-19 | Hewlett-Packard Development Company, L.P. | Die for a printhead |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001058411A (ja) * | 1999-06-04 | 2001-03-06 | Canon Inc | 液体吐出ヘッド用基板、液体吐出ヘッド、ヘッドカートリッジ、前記液体吐出ヘッドを有する液体吐出装置、記録ヘッド、前記液体吐出ヘッドの駆動方法、および液体吐出ヘッドの製造方法 |
JP2006015737A (ja) * | 2004-06-02 | 2006-01-19 | Canon Inc | ヘッド基板、記録ヘッド、ヘッドカートリッジ、及び記録装置 |
JP2010179608A (ja) * | 2009-02-06 | 2010-08-19 | Canon Inc | 液体吐出ヘッドおよびインクジェット記録装置 |
JP2011515237A (ja) * | 2007-01-25 | 2011-05-19 | イーストマン コダック カンパニー | 二重供給液滴噴射装置 |
JP2012254527A (ja) * | 2011-06-07 | 2012-12-27 | Canon Inc | インクジェットヘッド |
JP2016128255A (ja) * | 2015-01-06 | 2016-07-14 | キヤノン株式会社 | 素子基板、及び液体吐出ヘッド |
JP2018016054A (ja) * | 2016-07-29 | 2018-02-01 | キヤノン株式会社 | 素子基板、記録ヘッド、及び記録装置 |
Family Cites Families (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0376314A (ja) * | 1989-08-17 | 1991-04-02 | Yokogawa Electric Corp | カウンタテスト方法 |
JPH09123450A (ja) | 1995-11-07 | 1997-05-13 | Hitachi Denshi Ltd | 記録液体噴出による記録装置 |
US5942900A (en) * | 1996-12-17 | 1999-08-24 | Lexmark International, Inc. | Method of fault detection in ink jet printhead heater chips |
JP2002527272A (ja) | 1998-10-16 | 2002-08-27 | シルバーブルック リサーチ プロプライエタリイ、リミテッド | インクジェットプリンタに関する改良 |
US6582062B1 (en) | 1999-10-18 | 2003-06-24 | Hewlett-Packard Development Company, L.P. | Large thermal ink jet nozzle array printhead |
SG89371A1 (en) | 2000-01-31 | 2002-06-18 | Canon Kk | Printhead, printhead driving method, and data output apparatus |
RU2176600C2 (ru) | 2000-02-01 | 2001-12-10 | Насибов Александр Сергеевич | Способ и устройство для печати |
AU5374500A (en) | 2000-06-30 | 2002-01-21 | Silverbrook Res Pty Ltd | Controlling the timing of printhead nozzle firing |
US6502925B2 (en) | 2001-02-22 | 2003-01-07 | Eastman Kodak Company | CMOS/MEMS integrated ink jet print head and method of operating same |
DE60117456T2 (de) | 2000-12-29 | 2006-10-05 | Eastman Kodak Co. | Cmos/mems-integrierter tintenstrahldruckkopf und verfahren zur herstellung desselben |
EP1221372B1 (en) | 2001-01-05 | 2005-06-08 | Hewlett-Packard Company | Integrated programmable fire pulse generator for inkjet printhead assembly |
US6478396B1 (en) | 2001-03-02 | 2002-11-12 | Hewlett-Packard Company | Programmable nozzle firing order for printhead assembly |
US6922203B2 (en) | 2001-06-06 | 2005-07-26 | Hewlett-Packard Development Company, L.P. | Barrier/orifice design for improved printhead performance |
US6626523B2 (en) | 2001-10-31 | 2003-09-30 | Hewlett-Packard Development Company, Lp. | Printhead having a thin film membrane with a floating section |
US6726300B2 (en) | 2002-04-29 | 2004-04-27 | Hewlett-Packard Development Company, L.P. | Fire pulses in a fluid ejection device |
US6789871B2 (en) | 2002-12-27 | 2004-09-14 | Lexmark International, Inc. | Reduced size inkjet printhead heater chip having integral voltage regulator and regulating capacitors |
TWI246462B (en) | 2003-06-10 | 2006-01-01 | Canon Kk | Ink-jet printhead substrate, driving control method, ink-jet printhead and ink-jet printing apparatus |
US7384113B2 (en) | 2004-04-19 | 2008-06-10 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with address generator |
US7497536B2 (en) | 2004-04-19 | 2009-03-03 | Hewlett-Packard Development Company, L.P. | Fluid ejection device |
EP1600295B1 (en) | 2004-05-26 | 2007-12-12 | International United Technology Co., Ltd. | Printhead controller and ink jet printer |
US7314261B2 (en) | 2004-05-27 | 2008-01-01 | Silverbrook Research Pty Ltd | Printhead module for expelling ink from nozzles in groups, alternately, starting at outside nozzles of each group |
US7182422B2 (en) | 2004-08-23 | 2007-02-27 | Silverbrook Research Pty Ltd | Printhead having first and second rows of print nozzles |
WO2006021018A1 (en) | 2004-08-23 | 2006-03-02 | Silverbrook Research Pty Ltd | Symmetric nozzle arrangement |
US7195341B2 (en) | 2004-09-30 | 2007-03-27 | Lexmark International, Inc. | Power and ground buss layout for reduced substrate size |
US7350902B2 (en) | 2004-11-18 | 2008-04-01 | Eastman Kodak Company | Fluid ejection device nozzle array configuration |
TWI253395B (en) | 2005-01-13 | 2006-04-21 | Benq Corp | Fluid injector |
GB0503996D0 (en) | 2005-02-26 | 2005-04-06 | Xaar Technology Ltd | Droplet deposition apparatus |
US20060243701A1 (en) | 2005-04-19 | 2006-11-02 | Shogo Ono | Liquid discharge head and liquid discharge head manufacturing method, chip element, and printing apparatus |
US7845765B2 (en) | 2005-10-11 | 2010-12-07 | Silverbrook Research Pty Ltd | Inkjet printers with elongate chambers, nozzles and heaters |
US7806495B2 (en) * | 2006-12-05 | 2010-10-05 | Canon Kabushiki Kaisha | Head substrate, printhead, head cartridge, and printing apparatus |
US7946690B2 (en) | 2007-02-20 | 2011-05-24 | Mvm Technologies, Inc. | Printhead fabricated on flexible substrate |
US7712859B2 (en) | 2007-07-30 | 2010-05-11 | Silverbrook Research Pty Ltd | Printhead with multiple nozzles sharing single nozzle data |
US8109586B2 (en) | 2007-09-04 | 2012-02-07 | Hewlett-Packard Development Company, L.P. | Fluid ejection device |
JP5180595B2 (ja) * | 2008-01-09 | 2013-04-10 | キヤノン株式会社 | ヘッド基板、記録ヘッド、ヘッドカートリッジ、及び記録装置 |
US7815273B2 (en) | 2008-04-01 | 2010-10-19 | Hewlett-Packard Development Company, L.P. | Fluid ejection device |
CN103552379B (zh) | 2008-05-22 | 2015-09-02 | 富士胶片株式会社 | 流体喷射装置 |
JP5534683B2 (ja) | 2009-02-06 | 2014-07-02 | キヤノン株式会社 | インクジェット記録ヘッド |
WO2011043776A1 (en) | 2009-10-08 | 2011-04-14 | Hewlett-Packard Development Company, L.P. | Inkjet printhead with cross-slot conductor routing |
EP2497643B1 (en) | 2009-11-05 | 2015-09-30 | Canon Kabushiki Kaisha | Substrate for liquid ejection head, and liquid ejection head |
US8960860B2 (en) | 2011-04-27 | 2015-02-24 | Hewlett-Packard Development Company, L.P. | Printhead die |
JP5787603B2 (ja) | 2011-04-28 | 2015-09-30 | キヤノン株式会社 | インクジェット記録ヘッドおよびインクジェット記録装置 |
US8348385B2 (en) | 2011-05-31 | 2013-01-08 | Hewlett-Packard Development Company, L.P. | Printhead die |
BR112013031746B1 (pt) | 2011-06-29 | 2020-10-20 | Hewlett-Packard Development Company, L.P | pilha de pastilhas piezelétricas de jato de tinta e cabeçote impressor piezelétrico |
JP6049393B2 (ja) | 2011-11-15 | 2016-12-21 | キヤノン株式会社 | インクジェット記録ヘッド |
JP6157184B2 (ja) | 2012-04-10 | 2017-07-05 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
US20150145925A1 (en) * | 2012-05-31 | 2015-05-28 | Rio Rivas | Printheads with conductor traces across slots |
JP6043101B2 (ja) * | 2012-06-18 | 2016-12-14 | キヤノン株式会社 | 記録装置及びその記録方法 |
US8608283B1 (en) | 2012-06-27 | 2013-12-17 | Eastman Kodak Company | Nozzle array configuration for printhead die |
CN104870195B (zh) | 2012-12-10 | 2017-09-12 | 惠普发展公司,有限责任合伙企业 | 对应于打印头喷嘴的发射路径中的液滴探测 |
CN104853923B (zh) | 2012-12-20 | 2016-08-24 | 惠普发展公司,有限责任合伙企业 | 具有颗粒耐受层延伸部的流体喷射装置 |
WO2014133517A1 (en) | 2013-02-28 | 2014-09-04 | Hewlett-Packard Development Company, L.P. | Molded print bar |
US9656469B2 (en) | 2013-02-28 | 2017-05-23 | Hewlett-Packard Development Company, L.P. | Molded fluid flow structure with saw cut channel |
US9156254B2 (en) | 2013-08-30 | 2015-10-13 | Hewlett-Packard Development Company, L.P. | Fluid ejection device |
JP6287341B2 (ja) | 2014-03-03 | 2018-03-07 | セイコーエプソン株式会社 | 液体吐出装置および液体吐出装置の制御方法 |
EP3113953B1 (en) | 2014-03-07 | 2021-04-28 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with ground electrode exposed to fluid chamber |
US9434165B2 (en) | 2014-08-28 | 2016-09-06 | Funai Electric Co., Ltd. | Chip layout to enable multiple heater chip vertical resolutions |
EP3456542B1 (en) | 2014-10-29 | 2020-04-01 | Hewlett-Packard Development Company, L.P. | Printhead die |
WO2016068946A1 (en) | 2014-10-30 | 2016-05-06 | Hewlett-Packard Development Company, L.P. | Ink jet printing |
JP6470570B2 (ja) * | 2015-01-06 | 2019-02-13 | キヤノン株式会社 | 素子基板、液体吐出ヘッド及び記録装置 |
MX2017010391A (es) | 2015-02-13 | 2018-01-23 | Hewlett Packard Development Co | Cabezal de impresion que emplea paquetes de datos incluyendo datos de direccion. |
WO2016167763A1 (en) | 2015-04-15 | 2016-10-20 | Hewlett-Packard Development Company, L.P. | Printheads with high dielectric eprom cells |
GB2539052B (en) | 2015-06-05 | 2020-01-01 | Xaar Technology Ltd | Inkjet printhead |
US10442188B2 (en) | 2016-02-10 | 2019-10-15 | Seiko Epson Corporation | Liquid ejecting head and liquid ejecting apparatus |
CN108367568A (zh) * | 2016-02-24 | 2018-08-03 | 惠普发展公司,有限责任合伙企业 | 包括集成电路的流体喷射装置 |
JP6724480B2 (ja) | 2016-03-30 | 2020-07-15 | ブラザー工業株式会社 | 印刷装置 |
JP6806464B2 (ja) | 2016-05-30 | 2021-01-06 | キヤノン株式会社 | 記録素子基板、液体吐出ヘッドおよび液体吐出装置 |
US10933634B2 (en) | 2016-08-03 | 2021-03-02 | Hewlett-Packard Development Company, L.P. | Conductive wire disposed in a layer |
US10857786B2 (en) | 2017-01-19 | 2020-12-08 | Hewlett-Packard Development Company, L.P. | Fluid driver actuation control using offset |
WO2018190872A1 (en) | 2017-04-14 | 2018-10-18 | Hewlett-Packard Development Company, L.P. | Fluidic die |
US10479075B2 (en) | 2017-05-09 | 2019-11-19 | Canon Kabushiki Kaisha | Print head substrate and method of manufacturing the same, and semiconductor substrate |
WO2019017867A1 (en) | 2017-07-17 | 2019-01-24 | Hewlett-Packard Development Company, L.P. | FLUIDIC MATRIX |
US20200122456A1 (en) | 2018-05-17 | 2020-04-23 | Tecglass Sl | Machine and method for single-pass digital printing on glass |
MX2021009368A (es) * | 2019-02-06 | 2021-09-10 | Hewlett Packard Development Co | Matriz para un cabezal de impresion. |
EP3713768B1 (en) * | 2019-02-06 | 2023-06-28 | Hewlett-Packard Development Company, L.P. | Die for a printhead |
-
2019
- 2019-02-06 WO PCT/US2019/016836 patent/WO2020162924A1/en unknown
- 2019-02-06 PL PL19708199.5T patent/PL3710261T3/pl unknown
- 2019-02-06 KR KR1020217024827A patent/KR102621225B1/ko active IP Right Grant
- 2019-02-06 MX MX2021008855A patent/MX2021008855A/es unknown
- 2019-02-06 EP EP24150979.3A patent/EP4344878A3/en active Pending
- 2019-02-06 CA CA3126057A patent/CA3126057C/en active Active
- 2019-02-06 JP JP2021536232A patent/JP7146094B2/ja active Active
- 2019-02-06 AU AU2019428015A patent/AU2019428015B2/en active Active
- 2019-02-06 EP EP19708199.5A patent/EP3710261B1/en active Active
- 2019-02-06 US US16/766,523 patent/US11413864B2/en active Active
- 2019-02-06 BR BR112021014843-4A patent/BR112021014843A2/pt unknown
- 2019-02-06 CN CN201980091413.6A patent/CN113396065B/zh active Active
-
2021
- 2021-06-30 IL IL284503A patent/IL284503A/en unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001058411A (ja) * | 1999-06-04 | 2001-03-06 | Canon Inc | 液体吐出ヘッド用基板、液体吐出ヘッド、ヘッドカートリッジ、前記液体吐出ヘッドを有する液体吐出装置、記録ヘッド、前記液体吐出ヘッドの駆動方法、および液体吐出ヘッドの製造方法 |
JP2006015737A (ja) * | 2004-06-02 | 2006-01-19 | Canon Inc | ヘッド基板、記録ヘッド、ヘッドカートリッジ、及び記録装置 |
JP2011515237A (ja) * | 2007-01-25 | 2011-05-19 | イーストマン コダック カンパニー | 二重供給液滴噴射装置 |
JP2010179608A (ja) * | 2009-02-06 | 2010-08-19 | Canon Inc | 液体吐出ヘッドおよびインクジェット記録装置 |
JP2012254527A (ja) * | 2011-06-07 | 2012-12-27 | Canon Inc | インクジェットヘッド |
JP2016128255A (ja) * | 2015-01-06 | 2016-07-14 | キヤノン株式会社 | 素子基板、及び液体吐出ヘッド |
JP2018016054A (ja) * | 2016-07-29 | 2018-02-01 | キヤノン株式会社 | 素子基板、記録ヘッド、及び記録装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20210113285A (ko) | 2021-09-15 |
AU2019428015A1 (en) | 2021-09-16 |
EP4344878A3 (en) | 2024-06-12 |
US11413864B2 (en) | 2022-08-16 |
EP3710261C0 (en) | 2024-03-27 |
PL3710261T3 (pl) | 2024-05-27 |
CN113396065A (zh) | 2021-09-14 |
CN113396065B (zh) | 2022-11-18 |
AU2019428015B2 (en) | 2023-05-11 |
KR102621225B1 (ko) | 2024-01-04 |
BR112021014843A2 (pt) | 2021-10-05 |
MX2021008855A (es) | 2021-09-08 |
IL284503A (en) | 2021-08-31 |
CA3126057A1 (en) | 2020-08-13 |
CA3126057C (en) | 2023-08-22 |
JP7146094B2 (ja) | 2022-10-03 |
EP3710261B1 (en) | 2024-03-27 |
US20210354461A1 (en) | 2021-11-18 |
EP4344878A2 (en) | 2024-04-03 |
EP3710261A1 (en) | 2020-09-23 |
WO2020162924A1 (en) | 2020-08-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI721652B (zh) | 用於列印頭之晶粒及其形成方法,及列印頭 | |
CN113423578B (zh) | 用于打印头的管芯和用于形成用于打印头的管芯的方法 | |
JP7146094B2 (ja) | プリントヘッド用のダイ | |
CN113396066B (zh) | 用于打印头的管芯及在管芯上形成裂纹检测器迹线的方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210621 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220517 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220810 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220830 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220920 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7146094 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: R3D02 |