JP2022510259A5 - - Google Patents
Info
- Publication number
- JP2022510259A5 JP2022510259A5 JP2021530834A JP2021530834A JP2022510259A5 JP 2022510259 A5 JP2022510259 A5 JP 2022510259A5 JP 2021530834 A JP2021530834 A JP 2021530834A JP 2021530834 A JP2021530834 A JP 2021530834A JP 2022510259 A5 JP2022510259 A5 JP 2022510259A5
- Authority
- JP
- Japan
- Prior art keywords
- adjuster
- pedestal
- ring
- flange
- pedestal assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023206548A JP7660651B2 (ja) | 2018-11-29 | 2023-12-07 | エッジリングリフトを用いた動的シース制御 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/205,028 | 2018-11-29 | ||
| US16/205,028 US11512393B2 (en) | 2018-11-29 | 2018-11-29 | Dynamic sheath control with edge ring lift |
| PCT/US2019/061458 WO2020112372A2 (en) | 2018-11-29 | 2019-11-14 | Dynamic sheath control with edge ring lift |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023206548A Division JP7660651B2 (ja) | 2018-11-29 | 2023-12-07 | エッジリングリフトを用いた動的シース制御 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022510259A JP2022510259A (ja) | 2022-01-26 |
| JP2022510259A5 true JP2022510259A5 (https=) | 2023-01-04 |
| JP7441221B2 JP7441221B2 (ja) | 2024-02-29 |
Family
ID=70851159
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021530834A Active JP7441221B2 (ja) | 2018-11-29 | 2019-11-14 | エッジリングリフトを用いた動的シース制御 |
| JP2023206548A Active JP7660651B2 (ja) | 2018-11-29 | 2023-12-07 | エッジリングリフトを用いた動的シース制御 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023206548A Active JP7660651B2 (ja) | 2018-11-29 | 2023-12-07 | エッジリングリフトを用いた動的シース制御 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US11512393B2 (https=) |
| EP (2) | EP4273912A3 (https=) |
| JP (2) | JP7441221B2 (https=) |
| KR (3) | KR20250071288A (https=) |
| CN (1) | CN113491003B (https=) |
| SG (1) | SG11202105638QA (https=) |
| TW (2) | TWI825228B (https=) |
| WO (1) | WO2020112372A2 (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI905899B (zh) * | 2019-09-26 | 2025-11-21 | 日商東京威力科創股份有限公司 | 電漿處理裝置、基板支持器及環構造 |
| WO2021158451A1 (en) * | 2020-02-04 | 2021-08-12 | Lam Research Corporation | Radiofrequency signal filter arrangement for plasma processing system |
| US20220028710A1 (en) * | 2020-07-21 | 2022-01-27 | Applied Materials, Inc. | Distribution components for semiconductor processing systems |
| TWI891866B (zh) * | 2020-07-31 | 2025-08-01 | 美商蘭姆研究公司 | 用於低傾角溝槽蝕刻的薄遮蔽環 |
| DE102020120732A1 (de) * | 2020-08-06 | 2022-02-10 | Vat Holding Ag | Stifthubvorrichtung |
| JP7514695B2 (ja) * | 2020-08-18 | 2024-07-11 | 株式会社安川電機 | アライメント装置、基板搬送システム、アライメント方法、及び基板搬送方法 |
| KR102649714B1 (ko) * | 2020-10-27 | 2024-03-21 | 세메스 주식회사 | 기판 처리 장치 및 기판 반송 방법 |
| USD997894S1 (en) * | 2021-09-28 | 2023-09-05 | Applied Materials, Inc. | Shadow ring lift assembly |
| USD997893S1 (en) * | 2021-09-28 | 2023-09-05 | Applied Materials, Inc. | Shadow ring lift plate |
| JP7510457B2 (ja) * | 2022-04-06 | 2024-07-03 | 株式会社アルバック | プラズマ処理装置 |
| KR102733590B1 (ko) * | 2022-08-12 | 2024-11-25 | 한화정밀기계 주식회사 | 포커스링의 위치를 조절할 수 있는 웨이퍼 처리 장치 |
| KR20250095669A (ko) * | 2022-10-27 | 2025-06-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 에피택셜 증착 동작들에서의 배치 처리를 위한 카세트 구조들 및 관련된 방법들 |
| CN116598251B (zh) * | 2023-06-09 | 2024-05-10 | 大连皓宇电子科技有限公司 | 一种用于半导体设备的搬运架 |
| WO2025122347A1 (en) * | 2023-12-04 | 2025-06-12 | Lam Research Corporation | Azimuthal edge ring control to improve residual non-uniformity near substrate edges |
| WO2026005937A1 (en) * | 2024-06-26 | 2026-01-02 | Lam Research Corporation | Tuned focus ring for uniformity improvement of plasma-assisted processes |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5421893A (en) * | 1993-02-26 | 1995-06-06 | Applied Materials, Inc. | Susceptor drive and wafer displacement mechanism |
| US6120609A (en) * | 1996-10-25 | 2000-09-19 | Applied Materials, Inc. | Self-aligning lift mechanism |
| US20030000647A1 (en) * | 2001-06-29 | 2003-01-02 | Applied Materials, Inc. | Substrate processing chamber |
| US6896765B2 (en) * | 2002-09-18 | 2005-05-24 | Lam Research Corporation | Method and apparatus for the compensation of edge ring wear in a plasma processing chamber |
| US7311784B2 (en) * | 2002-11-26 | 2007-12-25 | Tokyo Electron Limited | Plasma processing device |
| KR20080023569A (ko) * | 2006-09-11 | 2008-03-14 | 주식회사 하이닉스반도체 | 식각프로파일 변형을 방지하는 플라즈마식각장치 |
| US7378618B1 (en) * | 2006-12-14 | 2008-05-27 | Applied Materials, Inc. | Rapid conductive cooling using a secondary process plane |
| KR20110080811A (ko) | 2010-01-07 | 2011-07-13 | 세메스 주식회사 | 정전척 유닛 및 이를 갖는 기판 처리 장치 |
| TW201437423A (zh) * | 2013-02-21 | 2014-10-01 | 應用材料股份有限公司 | 用於注射器至基板的空隙控制之裝置及方法 |
| CN105575863B (zh) * | 2014-11-10 | 2019-02-22 | 中微半导体设备(上海)有限公司 | 等离子体处理装置、基片卸载装置及方法 |
| US10648079B2 (en) | 2014-12-19 | 2020-05-12 | Lam Research Corporation | Reducing backside deposition at wafer edge |
| US20170263478A1 (en) * | 2015-01-16 | 2017-09-14 | Lam Research Corporation | Detection System for Tunable/Replaceable Edge Coupling Ring |
| US10658222B2 (en) * | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
| KR20170014384A (ko) * | 2015-07-30 | 2017-02-08 | 삼성전자주식회사 | 건식 식각장치 |
| US10541117B2 (en) * | 2015-10-29 | 2020-01-21 | Lam Research Corporation | Systems and methods for tilting a wafer for achieving deposition uniformity |
| CN108369922B (zh) * | 2016-01-26 | 2023-03-21 | 应用材料公司 | 晶片边缘环升降解决方案 |
| US11011353B2 (en) * | 2016-03-29 | 2021-05-18 | Lam Research Corporation | Systems and methods for performing edge ring characterization |
| US9892956B1 (en) | 2016-10-12 | 2018-02-13 | Lam Research Corporation | Wafer positioning pedestal for semiconductor processing |
| US20180138074A1 (en) | 2016-11-11 | 2018-05-17 | Samsung Electronics Co., Ltd. | Carrier ring and chemical vapor deposition apparatus including the same |
| US11404249B2 (en) * | 2017-03-22 | 2022-08-02 | Tokyo Electron Limited | Substrate processing apparatus |
| US20180334746A1 (en) * | 2017-05-22 | 2018-11-22 | Lam Research Corporation | Wafer Edge Contact Hardware and Methods to Eliminate Deposition at Wafer Backside Edge and Notch |
| JP7061918B2 (ja) * | 2018-04-23 | 2022-05-02 | 東京エレクトロン株式会社 | プラズマエッチング方法及びプラズマ処理装置 |
-
2018
- 2018-11-29 US US16/205,028 patent/US11512393B2/en active Active
-
2019
- 2019-11-14 KR KR1020257015117A patent/KR20250071288A/ko active Pending
- 2019-11-14 KR KR1020217020161A patent/KR102512042B1/ko active Active
- 2019-11-14 JP JP2021530834A patent/JP7441221B2/ja active Active
- 2019-11-14 EP EP23187534.5A patent/EP4273912A3/en active Pending
- 2019-11-14 WO PCT/US2019/061458 patent/WO2020112372A2/en not_active Ceased
- 2019-11-14 CN CN201980079348.5A patent/CN113491003B/zh active Active
- 2019-11-14 EP EP19890740.4A patent/EP3887570B1/en active Active
- 2019-11-14 KR KR1020237009098A patent/KR102806993B1/ko active Active
- 2019-11-14 SG SG11202105638QA patent/SG11202105638QA/en unknown
- 2019-11-25 TW TW108142686A patent/TWI825228B/zh active
- 2019-11-25 TW TW112142746A patent/TWI860154B/zh active
-
2022
- 2022-11-29 US US18/071,192 patent/US12480208B2/en active Active
-
2023
- 2023-12-07 JP JP2023206548A patent/JP7660651B2/ja active Active
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