JP2022509990A - 垂直拡散板を有するキャパシタ構造 - Google Patents
垂直拡散板を有するキャパシタ構造 Download PDFInfo
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- 239000003990 capacitor Substances 0.000 title claims abstract description 91
- 238000002955 isolation Methods 0.000 claims abstract description 87
- 239000000758 substrate Substances 0.000 claims abstract description 75
- 239000004065 semiconductor Substances 0.000 claims abstract description 61
- 238000009792 diffusion process Methods 0.000 claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 35
- 229910052710 silicon Inorganic materials 0.000 claims description 35
- 239000010703 silicon Substances 0.000 claims description 35
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 9
- 229920005591 polysilicon Polymers 0.000 claims description 9
- 238000010276 construction Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 67
- 238000000034 method Methods 0.000 description 32
- 230000008569 process Effects 0.000 description 14
- 150000002500 ions Chemical class 0.000 description 12
- 239000002019 doping agent Substances 0.000 description 8
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 8
- 238000001289 rapid thermal chemical vapour deposition Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000002513 implantation Methods 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 229910008045 Si-Si Inorganic materials 0.000 description 3
- 229910006411 Si—Si Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/92—Capacitors having potential barriers
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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Abstract
Description
100 半導体基板
100a 表面側
100b 裏面側
101 イオンウェル
104 第1のシャロートレンチアイソレーション構造、第1のSTI構造
105 第2のシャロートレンチアイソレーション構造、第2のSTI構造
106 第3のシャロートレンチアイソレーション構造、第3のSTI構造
107 第4のシャロートレンチアイソレーション構造、第4のSTI構造
110 第1の垂直拡散板
110a 第1の下部
111 第1の高度にドープされた領域
120 第3の垂直拡散板
121 高度にドープされた領域
210 第2の垂直拡散板
210a 第2の下部
211 第2の高度にドープされた領域
220 第4の垂直拡散板
220a 第2の下部
221 高度にドープされた領域
302 受動素子
304 受動素子
306 受動素子
308 受動素子
310 受動素子
410 金属相互接続
420 金属相互接続
500 絶縁層
504 第1のウェハ裏面側トレンチアイソレーション構造、内側ウェハ裏面側トレンチアイソレーション構造
505 第2のウェハ裏面側トレンチアイソレーション構造、内側ウェハ裏面側トレンチアイソレーション構造、外側ウェハ裏面側トレンチアイソレーション構造
506 ウェハ裏面側トレンチアイソレーション構造、外側ウェハ裏面側トレンチアイソレーション構造、内側ウェハ裏面側トレンチアイソレーション構造
507 ウェハ裏面側トレンチアイソレーション構造、外側ウェハ裏面側トレンチアイソレーション構造
520 誘電体層
Claims (23)
- 半導体基板と、
前記半導体基板中に配設された第1の垂直拡散板であって、前記第1の垂直拡散板が、前記半導体基板の部分である第1の下部をさらに備え、前記第1の下部が、第1のウェハ裏面側トレンチアイソレーション構造によって囲まれて電気的に分離される、第1の垂直拡散板と、
前記半導体基板中に配設される第1のシャロートレンチアイソレーション(STI)構造であって、前記第1の垂直拡散板を囲む、第1のSTI構造と、
前記半導体基板中に配設される第1の導電型の第2の垂直拡散板であって、前記第1のSTI構造を囲む、第2の垂直拡散板と
を備える、キャパシタ構造。 - 前記第1のウェハ裏面側トレンチアイソレーション構造が前記第1のSTI構造の底部と直接接触する、請求項1に記載のキャパシタ構造。
- 前記第1のウェハ裏面側トレンチアイソレーション構造が前記第1のSTI構造のものより小さい横方向の厚さを有する、請求項1に記載のキャパシタ構造。
- 前記第1のウェハ裏面側トレンチアイソレーション構造が前記第1のSTI構造のものと同じリング形状を有する、請求項1に記載のキャパシタ構造。
- 前記第1の垂直拡散板がP型ドープ領域またはN型ドープ領域である、請求項1に記載のキャパシタ構造。
- 前記第2の垂直拡散板がP型ドープ領域またはN型ドープ領域である、請求項5に記載のキャパシタ構造。
- 前記半導体基板の裏面側に配設された絶縁層
をさらに備える、請求項1に記載のキャパシタ構造。 - 前記第1のSTI構造および前記第1のウェハ裏面側トレンチアイソレーション構造が、前記第1の垂直拡散板を前記第2の垂直拡散板から分離する、請求項1に記載のキャパシタ構造。
- 前記第1の垂直拡散板が第1の電圧に電気的に結合され、前記第2の垂直拡散板が第2の電圧に電気的に結合され、前記第2の電圧が前記第1の電圧よりも高い、請求項1に記載のキャパシタ構造。
- キャパシタが前記第1の垂直拡散板と前記第2の垂直拡散板の間に形成され、前記第1のSTI構造および前記第1のウェハ裏面側トレンチアイソレーション構造がその間に挿置され、キャパシタ誘電体層として働く、請求項1に記載のキャパシタ構造。
- 前記第1の垂直拡散板の表面に配設される第1の高度にドープされた領域と、
前記第2の垂直拡散板の表面に配設される第2の高度にドープされた領域と
をさらに備える、請求項1に記載のキャパシタ構造。 - 前記半導体基板中に配設される第2のシャロートレンチアイソレーション(STI)構造をさらに備え、前記第2のSTI構造が、前記第2の垂直拡散板、前記第1のSTI構造、および前記第1の垂直拡散板を囲む、請求項1に記載のキャパシタ構造。
- 前記第2の垂直拡散板が、前記半導体基板の部分である、第2の下部をさらに備える、請求項12に記載のキャパシタ構造。
- 前記第2の下部が、第2のウェハ裏面側トレンチアイソレーション構造および前記第1のウェハ裏面側トレンチアイソレーション構造によって囲まれて電気的に分離される、請求項13に記載のキャパシタ構造。
- 前記第2のSTI構造、前記第2の垂直拡散板、前記第1のSTI構造が、前記第1の垂直拡散板と同心円状に配置される、請求項12に記載のキャパシタ構造。
- 前記第1の垂直拡散板および前記第2の垂直拡散板が、前記第1のSTI構造および前記第2のSTI構造によって画定されて分離されるシリコン活性区域である、請求項12に記載のキャパシタ構造。
- 前記第1のSTI構造または前記第2のSTI構造の上面の直上に受動素子
をさらに備える、請求項12に記載のキャパシタ構造。 - 前記受動素子が抵抗器を備える、請求項17に記載のキャパシタ構造。
- 前記受動素子がポリシリコンを含む、請求項17に記載のキャパシタ構造。
- 前記第2のSTI構造、前記第2の垂直拡散板、前記第1のSTI構造、および前記第1の垂直拡散板を囲む第3の垂直拡散板と、
前記第3の垂直拡散板、前記第2のSTI構造、前記第2の垂直拡散板、前記第1のSTI構造、および前記第1の垂直拡散板を囲む第3のシャロートレンチアイソレーション(STI)構造と
をさらに備える、請求項12に記載のキャパシタ構造。 - 前記第3のSTI構造、前記第3の垂直拡散板、前記第2のSTI構造、前記第2の垂直拡散板、前記第1のSTI構造、および前記第1の垂直拡散板を囲む第4の垂直拡散板と、
前記第4の垂直拡散板、前記第3のSTI構造、前記第3の垂直拡散板、前記第2のSTI構造、前記第2の垂直拡散板、前記第1のSTI構造、および前記第1の垂直拡散板を囲む第4のシャロートレンチアイソレーション(STI)構造と
をさらに備える、請求項20に記載のキャパシタ構造。 - 前記第2の垂直拡散板、前記第4の垂直拡散板、およびイオンウェルがアノードノードに電気的に結合され、前記第1の垂直拡散板および前記第3の垂直拡散板がカソードノードに電気的に結合される、請求項21に記載のキャパシタ構造。
- 前記半導体基板がシリコン基板である、請求項1に記載のキャパシタ構造。
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EP3853895A4 (en) | 2022-06-08 |
CN111653627B (zh) | 2021-03-12 |
EP3853895B1 (en) | 2023-11-22 |
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KR102626948B1 (ko) | 2024-01-17 |
CN109923666B (zh) | 2020-05-26 |
WO2020154950A1 (en) | 2020-08-06 |
CN111653627A (zh) | 2020-09-11 |
US10777690B2 (en) | 2020-09-15 |
CN109923666A (zh) | 2019-06-21 |
US20200243693A1 (en) | 2020-07-30 |
TWI692854B (zh) | 2020-05-01 |
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TW202029479A (zh) | 2020-08-01 |
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