JP2022507980A5 - - Google Patents

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Publication number
JP2022507980A5
JP2022507980A5 JP2021529402A JP2021529402A JP2022507980A5 JP 2022507980 A5 JP2022507980 A5 JP 2022507980A5 JP 2021529402 A JP2021529402 A JP 2021529402A JP 2021529402 A JP2021529402 A JP 2021529402A JP 2022507980 A5 JP2022507980 A5 JP 2022507980A5
Authority
JP
Japan
Prior art keywords
coil
structures
aspect ratio
dielectric layer
high aspect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021529402A
Other languages
English (en)
Japanese (ja)
Other versions
JP7494177B2 (ja
JP2022507980A (ja
Filing date
Publication date
Priority claimed from US16/693,169 external-priority patent/US11387033B2/en
Application filed filed Critical
Priority claimed from PCT/US2019/062885 external-priority patent/WO2020112570A1/en
Publication of JP2022507980A publication Critical patent/JP2022507980A/ja
Publication of JP2022507980A5 publication Critical patent/JP2022507980A5/ja
Application granted granted Critical
Publication of JP7494177B2 publication Critical patent/JP7494177B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021529402A 2018-11-26 2019-11-23 電気メッキ構造 Active JP7494177B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862771442P 2018-11-26 2018-11-26
US62/771,442 2018-11-26
US16/693,169 US11387033B2 (en) 2016-11-18 2019-11-22 High-aspect ratio electroplated structures and anisotropic electroplating processes
US16/693,169 2019-11-22
PCT/US2019/062885 WO2020112570A1 (en) 2018-11-26 2019-11-23 High-aspect ratio electroplated structures and anisotropic electroplating processes

Publications (3)

Publication Number Publication Date
JP2022507980A JP2022507980A (ja) 2022-01-18
JP2022507980A5 true JP2022507980A5 (https=) 2022-11-30
JP7494177B2 JP7494177B2 (ja) 2024-06-03

Family

ID=70852681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021529402A Active JP7494177B2 (ja) 2018-11-26 2019-11-23 電気メッキ構造

Country Status (6)

Country Link
JP (1) JP7494177B2 (https=)
KR (1) KR102688488B1 (https=)
CN (1) CN113396246B (https=)
PH (1) PH12021551216A1 (https=)
TW (1) TWI868089B (https=)
WO (1) WO2020112570A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI888813B (zh) * 2022-03-30 2025-07-01 韓商斯天克有限公司 線圈基板及其製造方法和電子裝置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6600404B1 (en) * 1998-01-12 2003-07-29 Tdk Corporation Planar coil and planar transformer, and process of fabricating a high-aspect conductive device
US6847527B2 (en) * 2001-08-24 2005-01-25 3M Innovative Properties Company Interconnect module with reduced power distribution impedance
JP2005236158A (ja) * 2004-02-23 2005-09-02 Murata Mfg Co Ltd 積層コイル部品、及び積層コイル部品の製造方法、並びに積層コイル部品の実装構造
US7527713B2 (en) * 2004-05-26 2009-05-05 Applied Materials, Inc. Variable quadruple electromagnet array in plasma processing
US8513124B1 (en) * 2008-03-06 2013-08-20 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers
JP5306789B2 (ja) * 2008-12-03 2013-10-02 日本特殊陶業株式会社 多層配線基板及びその製造方法
JP5195956B2 (ja) * 2011-04-05 2013-05-15 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、およびハードディスクドライブ
TWI488198B (zh) * 2013-08-02 2015-06-11 Cyntec Co Ltd 多層線圈之製造方法
KR101558092B1 (ko) * 2014-06-02 2015-10-06 삼성전기주식회사 칩 전자부품 및 그 실장기판
KR101598295B1 (ko) * 2014-09-22 2016-02-26 삼성전기주식회사 다층 시드 패턴 인덕터, 그 제조방법 및 그 실장 기판
US9984858B2 (en) * 2015-09-04 2018-05-29 Lam Research Corporation ALE smoothness: in and outside semiconductor industry
WO2018094280A1 (en) * 2016-11-18 2018-05-24 Hutchinson Technology Incorporated High aspect ratio electroplated structures and anisotropic electroplating processes
WO2018097112A1 (ja) * 2016-11-28 2018-05-31 株式会社村田製作所 多層基板、多層基板の回路基板への実装構造、多層基板の実装方法および多層基板の製造方法
KR101862503B1 (ko) * 2017-01-06 2018-05-29 삼성전기주식회사 인덕터 및 그의 제조방법

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