TWI868089B - 高縱橫比電鍍結構及各向異性電鍍製程 - Google Patents

高縱橫比電鍍結構及各向異性電鍍製程 Download PDF

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Publication number
TWI868089B
TWI868089B TW108143004A TW108143004A TWI868089B TW I868089 B TWI868089 B TW I868089B TW 108143004 A TW108143004 A TW 108143004A TW 108143004 A TW108143004 A TW 108143004A TW I868089 B TWI868089 B TW I868089B
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TW
Taiwan
Prior art keywords
aspect ratio
high aspect
coil
structures
dielectric layer
Prior art date
Application number
TW108143004A
Other languages
English (en)
Chinese (zh)
Other versions
TW202033835A (zh
Inventor
道格拉斯 Ｐ 李莫
柯特 Ｃ 斯汪森
比得 Ｆ 拉德维格
馬修 Ｓ 朗
保羅 Ｖ 佩薩文托
約瑟夫 Ｄ 斯塔基
Original Assignee
美商哈欽森技術股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/693,169 external-priority patent/US11387033B2/en
Application filed by 美商哈欽森技術股份有限公司 filed Critical 美商哈欽森技術股份有限公司
Publication of TW202033835A publication Critical patent/TW202033835A/zh
Application granted granted Critical
Publication of TWI868089B publication Critical patent/TWI868089B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW108143004A 2018-11-26 2019-11-26 高縱橫比電鍍結構及各向異性電鍍製程 TWI868089B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201862771442P 2018-11-26 2018-11-26
US62/771,442 2018-11-26
US16/693,169 US11387033B2 (en) 2016-11-18 2019-11-22 High-aspect ratio electroplated structures and anisotropic electroplating processes
US16/693,169 2019-11-22
PCT/US2019/062885 WO2020112570A1 (en) 2018-11-26 2019-11-23 High-aspect ratio electroplated structures and anisotropic electroplating processes
WOPCT/US19/62885 2019-11-23

Publications (2)

Publication Number Publication Date
TW202033835A TW202033835A (zh) 2020-09-16
TWI868089B true TWI868089B (zh) 2025-01-01

Family

ID=70852681

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108143004A TWI868089B (zh) 2018-11-26 2019-11-26 高縱橫比電鍍結構及各向異性電鍍製程

Country Status (6)

Country Link
JP (1) JP7494177B2 (https=)
KR (1) KR102688488B1 (https=)
CN (1) CN113396246B (https=)
PH (1) PH12021551216A1 (https=)
TW (1) TWI868089B (https=)
WO (1) WO2020112570A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI888813B (zh) * 2022-03-30 2025-07-01 韓商斯天克有限公司 線圈基板及其製造方法和電子裝置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201034546A (en) * 2008-12-03 2010-09-16 Ngk Spark Plug Co Multilayer wiring substrate and method for manufacturing the same
TW201719712A (zh) * 2015-09-04 2017-06-01 蘭姆研究公司 原子層蝕刻平坦度:半導體工業內部及外部

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US6600404B1 (en) * 1998-01-12 2003-07-29 Tdk Corporation Planar coil and planar transformer, and process of fabricating a high-aspect conductive device
US6847527B2 (en) * 2001-08-24 2005-01-25 3M Innovative Properties Company Interconnect module with reduced power distribution impedance
JP2005236158A (ja) * 2004-02-23 2005-09-02 Murata Mfg Co Ltd 積層コイル部品、及び積層コイル部品の製造方法、並びに積層コイル部品の実装構造
US7527713B2 (en) * 2004-05-26 2009-05-05 Applied Materials, Inc. Variable quadruple electromagnet array in plasma processing
US8513124B1 (en) * 2008-03-06 2013-08-20 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers
JP5195956B2 (ja) * 2011-04-05 2013-05-15 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、およびハードディスクドライブ
TWI488198B (zh) * 2013-08-02 2015-06-11 Cyntec Co Ltd 多層線圈之製造方法
KR101558092B1 (ko) * 2014-06-02 2015-10-06 삼성전기주식회사 칩 전자부품 및 그 실장기판
KR101598295B1 (ko) * 2014-09-22 2016-02-26 삼성전기주식회사 다층 시드 패턴 인덕터, 그 제조방법 및 그 실장 기판
WO2018094280A1 (en) * 2016-11-18 2018-05-24 Hutchinson Technology Incorporated High aspect ratio electroplated structures and anisotropic electroplating processes
WO2018097112A1 (ja) * 2016-11-28 2018-05-31 株式会社村田製作所 多層基板、多層基板の回路基板への実装構造、多層基板の実装方法および多層基板の製造方法
KR101862503B1 (ko) * 2017-01-06 2018-05-29 삼성전기주식회사 인덕터 및 그의 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201034546A (en) * 2008-12-03 2010-09-16 Ngk Spark Plug Co Multilayer wiring substrate and method for manufacturing the same
TW201719712A (zh) * 2015-09-04 2017-06-01 蘭姆研究公司 原子層蝕刻平坦度:半導體工業內部及外部

Also Published As

Publication number Publication date
CN113396246B (zh) 2025-08-26
JP7494177B2 (ja) 2024-06-03
KR102688488B1 (ko) 2024-07-26
JP2022507980A (ja) 2022-01-18
PH12021551216A1 (en) 2021-11-08
TW202033835A (zh) 2020-09-16
WO2020112570A1 (en) 2020-06-04
CN113396246A (zh) 2021-09-14
KR20210096185A (ko) 2021-08-04

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