CN113396246B - 电气装置和线圈 - Google Patents

电气装置和线圈

Info

Publication number
CN113396246B
CN113396246B CN201980089815.2A CN201980089815A CN113396246B CN 113396246 B CN113396246 B CN 113396246B CN 201980089815 A CN201980089815 A CN 201980089815A CN 113396246 B CN113396246 B CN 113396246B
Authority
CN
China
Prior art keywords
aspect ratio
high aspect
coil
ratio plated
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201980089815.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN113396246A (zh
Inventor
D·P·里默
K·C·斯旺森
P·F·拉德维希
M·S·朗
P·V·佩萨文托
J·D·斯塔基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hutchinson Technology Inc
Original Assignee
Hutchinson Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/693,169 external-priority patent/US11387033B2/en
Application filed by Hutchinson Technology Inc filed Critical Hutchinson Technology Inc
Publication of CN113396246A publication Critical patent/CN113396246A/zh
Application granted granted Critical
Publication of CN113396246B publication Critical patent/CN113396246B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN201980089815.2A 2018-11-26 2019-11-23 电气装置和线圈 Active CN113396246B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862771442P 2018-11-26 2018-11-26
US62/771,442 2018-11-26
US16/693,169 US11387033B2 (en) 2016-11-18 2019-11-22 High-aspect ratio electroplated structures and anisotropic electroplating processes
US16/693,169 2019-11-22
PCT/US2019/062885 WO2020112570A1 (en) 2018-11-26 2019-11-23 High-aspect ratio electroplated structures and anisotropic electroplating processes

Publications (2)

Publication Number Publication Date
CN113396246A CN113396246A (zh) 2021-09-14
CN113396246B true CN113396246B (zh) 2025-08-26

Family

ID=70852681

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980089815.2A Active CN113396246B (zh) 2018-11-26 2019-11-23 电气装置和线圈

Country Status (6)

Country Link
JP (1) JP7494177B2 (https=)
KR (1) KR102688488B1 (https=)
CN (1) CN113396246B (https=)
PH (1) PH12021551216A1 (https=)
TW (1) TWI868089B (https=)
WO (1) WO2020112570A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI888813B (zh) * 2022-03-30 2025-07-01 韓商斯天克有限公司 線圈基板及其製造方法和電子裝置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6600404B1 (en) * 1998-01-12 2003-07-29 Tdk Corporation Planar coil and planar transformer, and process of fabricating a high-aspect conductive device
US6847527B2 (en) * 2001-08-24 2005-01-25 3M Innovative Properties Company Interconnect module with reduced power distribution impedance
JP2005236158A (ja) * 2004-02-23 2005-09-02 Murata Mfg Co Ltd 積層コイル部品、及び積層コイル部品の製造方法、並びに積層コイル部品の実装構造
US7527713B2 (en) * 2004-05-26 2009-05-05 Applied Materials, Inc. Variable quadruple electromagnet array in plasma processing
US8513124B1 (en) * 2008-03-06 2013-08-20 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers
JP5306789B2 (ja) * 2008-12-03 2013-10-02 日本特殊陶業株式会社 多層配線基板及びその製造方法
JP5195956B2 (ja) * 2011-04-05 2013-05-15 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、およびハードディスクドライブ
TWI488198B (zh) * 2013-08-02 2015-06-11 Cyntec Co Ltd 多層線圈之製造方法
KR101558092B1 (ko) * 2014-06-02 2015-10-06 삼성전기주식회사 칩 전자부품 및 그 실장기판
KR101598295B1 (ko) * 2014-09-22 2016-02-26 삼성전기주식회사 다층 시드 패턴 인덕터, 그 제조방법 및 그 실장 기판
US9984858B2 (en) * 2015-09-04 2018-05-29 Lam Research Corporation ALE smoothness: in and outside semiconductor industry
WO2018094280A1 (en) * 2016-11-18 2018-05-24 Hutchinson Technology Incorporated High aspect ratio electroplated structures and anisotropic electroplating processes
WO2018097112A1 (ja) * 2016-11-28 2018-05-31 株式会社村田製作所 多層基板、多層基板の回路基板への実装構造、多層基板の実装方法および多層基板の製造方法
KR101862503B1 (ko) * 2017-01-06 2018-05-29 삼성전기주식회사 인덕터 및 그의 제조방법

Also Published As

Publication number Publication date
JP7494177B2 (ja) 2024-06-03
KR102688488B1 (ko) 2024-07-26
JP2022507980A (ja) 2022-01-18
PH12021551216A1 (en) 2021-11-08
TW202033835A (zh) 2020-09-16
TWI868089B (zh) 2025-01-01
WO2020112570A1 (en) 2020-06-04
CN113396246A (zh) 2021-09-14
KR20210096185A (ko) 2021-08-04

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