JP2022505543A - 発光素子 - Google Patents
発光素子 Download PDFInfo
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- JP2022505543A JP2022505543A JP2021521824A JP2021521824A JP2022505543A JP 2022505543 A JP2022505543 A JP 2022505543A JP 2021521824 A JP2021521824 A JP 2021521824A JP 2021521824 A JP2021521824 A JP 2021521824A JP 2022505543 A JP2022505543 A JP 2022505543A
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- 230000035515 penetration Effects 0.000 claims description 220
- 239000004065 semiconductor Substances 0.000 claims description 150
- 238000002161 passivation Methods 0.000 claims description 66
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
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- 229910004205 SiNX Inorganic materials 0.000 description 5
- 229910003070 TaOx Inorganic materials 0.000 description 5
- 229910010421 TiNx Inorganic materials 0.000 description 5
- 229910003087 TiOx Inorganic materials 0.000 description 5
- 229910003134 ZrOx Inorganic materials 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- HLLICFJUWSZHRJ-UHFFFAOYSA-N tioxidazole Chemical compound CCCOC1=CC=C2N=C(NC(=O)OC)SC2=C1 HLLICFJUWSZHRJ-UHFFFAOYSA-N 0.000 description 5
- 208000021032 Finnish upper limb-onset distal myopathy Diseases 0.000 description 4
- 101000957559 Homo sapiens Matrin-3 Proteins 0.000 description 4
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- 102100038645 Matrin-3 Human genes 0.000 description 4
- 101100277598 Sorghum bicolor DES3 gene Proteins 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 208000013776 distal muscular dystrophy 3 Diseases 0.000 description 4
- 208000015400 distal muscular dystrophy 4 Diseases 0.000 description 4
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 4
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- 229910052751 metal Inorganic materials 0.000 description 4
- 238000001451 molecular beam epitaxy Methods 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
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- 229910052718 tin Inorganic materials 0.000 description 3
- 101000737578 Arabidopsis thaliana Bifunctional cystathionine gamma-lyase/cysteine synthase Proteins 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 101000952234 Homo sapiens Sphingolipid delta(4)-desaturase DES1 Proteins 0.000 description 2
- 101000918926 Homo sapiens Sphingolipid delta(4)-desaturase/C4-monooxygenase DES2 Proteins 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 102100037416 Sphingolipid delta(4)-desaturase DES1 Human genes 0.000 description 2
- 102100029473 Sphingolipid delta(4)-desaturase/C4-monooxygenase DES2 Human genes 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006336 epoxy molding compound Polymers 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
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- 229920000642 polymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229920001486 SU-8 photoresist Polymers 0.000 description 1
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- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000412 polyarylene Polymers 0.000 description 1
- 229920000131 polyvinylidene Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0756—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/385—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending at least partially onto a side surface of the semiconductor body
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
Description
発明を実施するための形態
Claims (20)
- 複数の発光部を含む発光構造体と、
前記発光構造体の外側に配置される絶縁構造体と、
前記発光構造体の一面上で前記発光部と電気的に接続されているパッドと、
を含み、
前記パッドのそれぞれの外側壁は前記発光構造体の外側壁と前記絶縁構造体の外側壁の内側に配置され、
前記パッドのうちの少なくとも一つは、前記絶縁構造体の一面に延長され、
前記絶縁構造体の一面は、前記発光構造体の一面と同一平面である、発光素子。 - 前記絶縁構造体に延長する少なくとも一つのパッドを除いた残りのパッドは、前記発光構造体内に配置されている、請求項1に記載の発光素子。
- 前記絶縁構造体に延長する少なくとも一つのパッドは、
前記発光構造体の一面に配置され、第1幅を有する第1部分と、
前記第1部分から前記絶縁構造体の一面に延長し、前記第1幅よりも大きい第2幅を有する第2部分と、
を含む、請求項1に記載の発光素子。 - 前記絶縁構造体に延長する少なくとも一つのパッドを除くパッドは、前記第1幅よりも大きい第3幅を有する、請求項3に記載の発光素子。
- 前記絶縁構造体に延長する少なくとも一つのパッドは、
前記発光構造体の一面に配置され、第1面積を有する第1部分と、
前記第1部分から前記絶縁構造体の一面に延長し、前記第1面積よりも大きい第2面積を有する第2部分と、
を含む、請求項1に記載の発光素子。 - 前記絶縁構造体に延長する少なくとも一つのパッドは、
前記発光構造体の一面の少なくとも一部を覆い、第1幅を有する第1部分と、
前記第1部分から前記絶縁構造体の一面に延長し、前記第1幅と同じ第2幅を有する第2部分と、
を含む、請求項1に記載の発光素子。 - 前記パッドは、互いに水平方向に離隔されている、請求項1に記載の発光素子。
- 前記絶縁構造体の一面に延長する一つのパッドは、他のパッドのうち少なくとも一つと重畳し、
前記一つのパッドは、前記一つのパッドと重畳する少なくとも一つのパッドとパッシベーション膜によって絶縁されている、請求項1に記載の発光素子。 - 前記パッドのそれぞれは、同じサイズを有する、請求項1に記載の発光素子。
- 前記発光構造体は、複数であり、
前記絶縁構造体は、前記発光構造体の間を満たし、
前記絶縁構造体の一面に延長するパッドは隣接する発光構造体の発光部のうち少なくとも一つと電気的に接続されている、請求項1に記載の発光素子。 - 前記パッド上に配置され、前記パッドを実装基板に電気的に接着するため導電部を含み、
前記導電部のうち少なくとも一つと前記絶縁構造体の一面との間に、前記少なくとも一つのパッドが配置される、請求項1に記載の発光素子。 - 前記発光構造体は、
第1-1型半導体層、第1活性層、および第1-2型半導体層を含む第1発光部と、
前記第1発光部上に配置され、第2-1型半導体層、第2活性層、および第2-2型半導体層を含む第2発光部と、
前記第2発光部上に配置され、第3-1型半導体層、第3活性層、および第3-2型半導体層を含む第3発光部と、
を含む、請求項1に記載の発光素子。 - 前記パッドは、
前記第1-2型半導体層と、第1貫通パターンを介して電気的に接続される第1パッドと、
前記第2-2型半導体層と第2貫通パターンを介して電気的に接続される第2パッドと、
前記第3-2型半導体層と第3貫通パターンを介して電気的に接続される第3パッドと、
前記第1-1型半導体層と第4貫通パターンを介して、前記第2-1型半導体層と第5貫通パターンを介して、前記第3-1型半導体層と第6貫通パターンを介して電気的に接続されている共通パッドと、
を含む、請求項12に記載の発光素子。 - 前記共通パッドは、
前記第4乃至第6貫通パターンと接し、第1幅を有する第1部分と、
前記第1部分から前記絶縁構造体の一面に延長され、第1幅よりも大きい第2幅を有する第2部分と、
を含む、請求項13に記載の発光素子。 - 前記第1乃至第3パッドのそれぞれは、前記第1幅よりも大きい第3幅を有する、請求項14に記載の発光素子。
- 前記共通パッドは、
前記発光構造体の一面の少なくとも一部を覆う第1幅を有する第1部分と、
前記第1部分から前記絶縁構造体の一面に延長して、前記第1幅と同じ第2幅を有する第2部分と、
を含む、請求項13に記載の発光素子。 - 前記共通パッドは、前記発光構造体の一面全体を覆い、前記第1乃至第3貫通パターンそれぞれを露出させるホールを含み、
前記第1乃至第3貫通パターンそれぞれ前記ホールを介して前記第1乃至第3パッドのそれぞれと電気的に接続されている、請求項16に記載の発光素子。 - 前記共通パッドと前記第1乃至第3パッドとの間を絶縁するパッシベーション膜さらに含む、請求項17に記載の発光素子。
- 前記発光構造体は、複数であり、
前記絶縁構造体は、前記発光構造体の間を満たし、
前記共通パッドは隣接する発光構造体の共通パッドと合わさった一体型である、請求項13に記載の発光素子。 - 前記隣接する発光構造体のそれぞれは、第1-1型半導体層が合わさった一体型である、請求項19に記載の発光素子。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862760381P | 2018-11-13 | 2018-11-13 | |
US62/760,381 | 2018-11-13 | ||
US16/676,711 US11967605B2 (en) | 2018-11-13 | 2019-11-07 | Light emitting device |
US16/676,711 | 2019-11-07 | ||
PCT/KR2019/015342 WO2020101323A1 (ko) | 2018-11-13 | 2019-11-12 | 발광 소자 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022505543A true JP2022505543A (ja) | 2022-01-14 |
JPWO2020101323A5 JPWO2020101323A5 (ja) | 2022-11-11 |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021521824A Pending JP2022505543A (ja) | 2018-11-13 | 2019-11-12 | 発光素子 |
Country Status (7)
Country | Link |
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US (1) | US11967605B2 (ja) |
EP (1) | EP3882990A4 (ja) |
JP (1) | JP2022505543A (ja) |
KR (1) | KR20210076013A (ja) |
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US11967605B2 (en) * | 2018-11-13 | 2024-04-23 | Seoul Viosys Co., Ltd. | Light emitting device |
EP3671812B1 (en) * | 2018-12-19 | 2022-02-09 | IMEC vzw | A method for bonding and interconnecting semiconductor chips |
US11211528B2 (en) * | 2019-03-13 | 2021-12-28 | Seoul Viosys Co., Ltd. | Light emitting device for display and display apparatus having the same |
WO2021119906A1 (zh) * | 2019-12-16 | 2021-06-24 | 厦门三安光电有限公司 | 一种发光二极管 |
US11880052B2 (en) | 2020-11-20 | 2024-01-23 | Applied Materials, Inc. | Structure and method of mirror grounding in LCoS devices |
US11881539B2 (en) * | 2020-11-20 | 2024-01-23 | Applied Materials, Inc. | Structure and method of advanced LCoS back-plane having highly reflective pixel via metallization |
US11908678B2 (en) | 2021-01-14 | 2024-02-20 | Applied Materials, Inc. | Method of CMP integration for improved optical uniformity in advanced LCOS back-plane |
JP7432844B2 (ja) | 2021-12-17 | 2024-02-19 | 日亜化学工業株式会社 | 窒化物半導体発光素子 |
WO2024129810A1 (en) * | 2022-12-16 | 2024-06-20 | Lumileds Llc | Die metallization for dense packed arrays |
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Also Published As
Publication number | Publication date |
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CN210743981U (zh) | 2020-06-12 |
KR20210076013A (ko) | 2021-06-23 |
US11967605B2 (en) | 2024-04-23 |
US20200152691A1 (en) | 2020-05-14 |
EP3882990A4 (en) | 2022-08-10 |
EP3882990A1 (en) | 2021-09-22 |
BR112021009132A2 (pt) | 2021-08-10 |
CN112970126A (zh) | 2021-06-15 |
WO2020101323A1 (ko) | 2020-05-22 |
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