JP2022501819A5 - - Google Patents

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Publication number
JP2022501819A5
JP2022501819A5 JP2021515183A JP2021515183A JP2022501819A5 JP 2022501819 A5 JP2022501819 A5 JP 2022501819A5 JP 2021515183 A JP2021515183 A JP 2021515183A JP 2021515183 A JP2021515183 A JP 2021515183A JP 2022501819 A5 JP2022501819 A5 JP 2022501819A5
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JP
Japan
Prior art keywords
layer
conductive
conductive layer
openings
nonconductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021515183A
Other languages
English (en)
Japanese (ja)
Other versions
JP7382396B2 (ja
JP2022501819A (ja
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Publication date
Priority claimed from GB1815292.6A external-priority patent/GB2577286B/en
Application filed filed Critical
Publication of JP2022501819A publication Critical patent/JP2022501819A/ja
Publication of JP2022501819A5 publication Critical patent/JP2022501819A5/ja
Application granted granted Critical
Publication of JP7382396B2 publication Critical patent/JP7382396B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021515183A 2018-09-19 2019-09-13 電装部品を含む転送部材 Active JP7382396B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1815292.6 2018-09-19
GB1815292.6A GB2577286B (en) 2018-09-19 2018-09-19 Transfer including an electrical component
PCT/GB2019/000137 WO2020058660A1 (en) 2018-09-19 2019-09-13 Transfer including an electrical component

Publications (3)

Publication Number Publication Date
JP2022501819A JP2022501819A (ja) 2022-01-06
JP2022501819A5 true JP2022501819A5 (https=) 2022-09-20
JP7382396B2 JP7382396B2 (ja) 2023-11-16

Family

ID=68084859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021515183A Active JP7382396B2 (ja) 2018-09-19 2019-09-13 電装部品を含む転送部材

Country Status (6)

Country Link
US (1) US11406012B2 (https=)
EP (1) EP3854185B1 (https=)
JP (1) JP7382396B2 (https=)
CN (1) CN113424664B (https=)
GB (1) GB2577286B (https=)
WO (1) WO2020058660A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2602800B (en) 2021-01-13 2023-05-10 Mygo4Ward Ltd Improvements relating to functional electrical stimulation garments

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02223438A (ja) * 1989-02-27 1990-09-05 Yoshida Kogyo Kk <Ykk> 表裏面加飾成形品及びその成形品の製造方法並びに加飾用シート
US7759167B2 (en) 2005-11-23 2010-07-20 Imec Method for embedding dies
JP5600458B2 (ja) * 2010-03-30 2014-10-01 株式会社トッパンTdkレーベル 焼成用転写型フィルム及び焼成体を備えるガラス板の製造方法
US8472207B2 (en) 2011-01-14 2013-06-25 Harris Corporation Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods
US8948839B1 (en) * 2013-08-06 2015-02-03 L.I.F.E. Corporation S.A. Compression garments having stretchable and conductive ink
JP6083233B2 (ja) * 2012-12-19 2017-02-22 Jnc株式会社 インモールド成形用転写フィルム、インモールド成形体の製造方法および成形体
KR102045113B1 (ko) 2013-11-01 2019-11-14 피피지 인더스트리즈 오하이오 인코포레이티드 전기전도성 물질의 전달 방법
US20150257278A1 (en) * 2014-03-06 2015-09-10 Tactotek Oy Method for manufacturing electronic products, related arrangement and product
US9724869B2 (en) * 2014-12-29 2017-08-08 Tacto Tek Oy Multilayer structure for accommodating electronics and related method of manufacture
TW201703208A (zh) * 2015-05-19 2017-01-16 塔克圖科技有限公司 用於電子產品的熱成型塑料罩和相關的製造方法
CN108141957B (zh) * 2015-10-16 2021-03-16 国立研究开发法人科学技术振兴机构 布线膜、器件转印片材以及纺织型器件
US20170164461A1 (en) * 2015-12-08 2017-06-08 Intel Corporation Conductive flexible and stretchable encapsulation method and apparatus
GB2550535B (en) * 2015-12-31 2019-07-31 Wearable Tech Limited Constructing a jacket
JP6982959B2 (ja) 2016-02-05 2021-12-17 日本メクトロン株式会社 伸縮基板モジュール、伸縮性配線基板及びそれらの製造方法
JP6823472B2 (ja) 2016-02-22 2021-02-03 日本メクトロン株式会社 伸縮性配線基板及びその製造方法
GB2555592B (en) * 2016-11-02 2019-02-27 Conductive Transfers Ltd Transfer for application to a surface
US10057989B1 (en) * 2017-04-10 2018-08-21 Tactotek Oy Multilayer structure and related method of manufacture for electronics

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